IT1265279B1 - Sistema di assemblaggio modulare - Google Patents
Sistema di assemblaggio modulareInfo
- Publication number
- IT1265279B1 IT1265279B1 IT93MI002630A ITMI932630A IT1265279B1 IT 1265279 B1 IT1265279 B1 IT 1265279B1 IT 93MI002630 A IT93MI002630 A IT 93MI002630A IT MI932630 A ITMI932630 A IT MI932630A IT 1265279 B1 IT1265279 B1 IT 1265279B1
- Authority
- IT
- Italy
- Prior art keywords
- container
- opening
- electrical equipment
- assembly system
- modular assembly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Packages (AREA)
- Massaging Devices (AREA)
- Surgical Instruments (AREA)
- Manipulator (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Motor Or Generator Cooling System (AREA)
- Enzymes And Modification Thereof (AREA)
Abstract
In un sistema di assemblaggio modulare per equipaggiamento elettrico due o più moduli sono disposti orizzontalmente o verticalmente uno rispetto all'altro. Ciascun modulo comprende equipaggiamento elettrico, un contenitore in cui è disposto l'equipaggiamento elettrico ed un complesso di ventilatore per spingere aria attraverso il contenitore per raffreddare l'equipaggiamento elettrico. Il contenitore comprende una parete interna del contenitore che forma un vano per l'aria, uno spazio verticale esteso fra un'apertura superiore ed un'apertura inferiore nel contenitore, ed uno spazio orizzontale che si estende fra un'apertura a sinistra ed un'apertura a destra nel contenitore. Il contenitore è inoltre formato con una prima ed una seconda apertura. La seconda apertura è formata nella parete interna del contenitore. Il complesso di ventilatore spinge l'aria attraverso la prima apertura del contenitore, lungo l'equipaggiamento elettrico, fuori dalla seconda apertura del contenitore e nel vano per l'aria. Il sistema di assemblaggio modulare comprende inoltre un camino formato dall'allineamento dei vani per l'aria di due o più moduli disposti verticalmente uno rispetto all'altro ed un canale verticale per i cavi formato dall'allineamento degli spazi verticali di due o più moduli disposti verticalmente. Il sistema di assemblaggio modulare comprende inoltre un condotto orizzontale per i cavi formato dall'allineamento degli spazi orizzontali di due o più moduli disposti orizzontalmente uno rispetto all'altro.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/990,515 US5398159A (en) | 1992-12-15 | 1992-12-15 | Modular packaging system |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI932630A0 ITMI932630A0 (it) | 1993-12-15 |
ITMI932630A1 ITMI932630A1 (it) | 1995-06-15 |
IT1265279B1 true IT1265279B1 (it) | 1996-10-31 |
Family
ID=25536237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT93MI002630A IT1265279B1 (it) | 1992-12-15 | 1993-12-15 | Sistema di assemblaggio modulare |
Country Status (17)
Country | Link |
---|---|
US (1) | US5398159A (it) |
JP (1) | JPH07506222A (it) |
KR (1) | KR100352110B1 (it) |
CN (1) | CN1042387C (it) |
AU (1) | AU669043B2 (it) |
BR (1) | BR9305896A (it) |
CA (1) | CA2130194A1 (it) |
GB (1) | GB2278961B (it) |
HK (1) | HK1006630A1 (it) |
IT (1) | IT1265279B1 (it) |
MX (1) | MX9307922A (it) |
MY (1) | MY109964A (it) |
NZ (1) | NZ259077A (it) |
SE (1) | SE518372C2 (it) |
SG (1) | SG49350A1 (it) |
TW (1) | TW370333U (it) |
WO (1) | WO1994014308A1 (it) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5513071A (en) * | 1994-11-28 | 1996-04-30 | Philips Electronics North America Corporation | Electronics housing with improved heat rejection |
JP3464553B2 (ja) * | 1995-03-06 | 2003-11-10 | 富士通株式会社 | サブラック装置 |
GB2298995A (en) * | 1995-03-07 | 1996-09-18 | Motorola Ltd | Base station |
FR2735946B1 (fr) * | 1995-06-26 | 1997-07-25 | Aeg Schneider Automation | Bac pour modules electroniques |
US5772500A (en) * | 1996-12-20 | 1998-06-30 | Symbios, Inc. | Compact ventilation unit for electronic apparatus |
US6042474A (en) * | 1997-06-04 | 2000-03-28 | Lsi Logic Corporation | Compact ventilation unit with exhaust ports for electronic apparatus |
DE29714762U1 (de) * | 1997-08-18 | 1997-12-18 | Siemens AG, 80333 München | Gehäuse zur Aufnahme von elektrischen Baugruppen |
US5947570A (en) * | 1997-10-10 | 1999-09-07 | International Business Machines Corporation | Modular cabinet assembly for a computer |
US6115242A (en) * | 1997-10-24 | 2000-09-05 | Advanced Micro Devices, Inc. | Chip chassis including a micro-backplane for receiving and connecting a plurality of computer chips |
US6067233A (en) * | 1998-02-27 | 2000-05-23 | 3Com Corporation | Mounting brace and cable management apparatus and method |
JPH11261265A (ja) * | 1998-03-12 | 1999-09-24 | Nec Corp | 密閉型装置の放熱構造 |
US6127663A (en) * | 1998-10-09 | 2000-10-03 | Ericsson Inc. | Electronics cabinet cooling system |
US6198628B1 (en) | 1998-11-24 | 2001-03-06 | Unisys Corporation | Parallel cooling of high power devices in a serially cooled evironment |
US6496366B1 (en) * | 1999-10-26 | 2002-12-17 | Rackable Systems, Llc | High density computer equipment storage system |
US6850408B1 (en) | 1999-10-26 | 2005-02-01 | Rackable Systems, Inc. | High density computer equipment storage systems |
EP1073285A1 (en) * | 1999-10-28 | 2001-01-31 | N.V. Belgacom Mobile S.A. | Unit housing cell equipment for cellular telephones |
DE10004107C2 (de) * | 2000-01-31 | 2002-04-11 | Siemens Ag | Architektur einer Basisstation eines Funkkommunikationssystems |
US6667891B2 (en) | 2000-02-18 | 2003-12-23 | Rackable Systems, Inc. | Computer chassis for dual offset opposing main boards |
US6504714B1 (en) * | 2000-08-16 | 2003-01-07 | Square D Company | Multi-level thermal management system and method |
IT1319610B1 (it) | 2000-12-22 | 2003-10-20 | Siemens Inf & Comm Networks | Procedimento e apparecchiatura per il condizionamento termico diarmadi contenenti apparecchiature elettroniche |
US6563704B2 (en) * | 2001-06-15 | 2003-05-13 | Sun Microsystems, Inc. | Storage device arrangement for increased cooling |
US6749070B2 (en) * | 2001-07-27 | 2004-06-15 | International Business Machines Corporation | Modular stacking equipment rack |
US20030033463A1 (en) * | 2001-08-10 | 2003-02-13 | Garnett Paul J. | Computer system storage |
ITMI20011939A1 (it) | 2001-09-17 | 2003-03-17 | Siemens Inf & Comm Networks | Procedimento e apparecchiatura di condizionamento termico di armadi per apparecchiature elettroniche con controllo dell'umidita' relativa |
US6975509B2 (en) * | 2002-05-16 | 2005-12-13 | Sun Microsystems, Inc. | Computing apparatus with cooling fan |
US6650539B1 (en) * | 2002-06-19 | 2003-11-18 | Handsome Electronics Ltd. | Modular backup power housing |
US6765795B2 (en) * | 2002-07-23 | 2004-07-20 | Silicon Graphics, Inc. | Modular fan brick and method for exchanging air in a brick-based computer system |
EP1416783A1 (de) * | 2002-10-30 | 2004-05-06 | Siemens Aktiengesellschaft | Anordnung zur Klimatisierung einer Basisstation |
FI114759B (fi) * | 2003-04-11 | 2004-12-15 | Vacon Oyj | Taajuusmuuttajien sijoitusjärjestely |
JP2005019562A (ja) * | 2003-06-24 | 2005-01-20 | Hitachi Ltd | 電子機器の冷却構造 |
US6987673B1 (en) * | 2003-09-09 | 2006-01-17 | Emc Corporation | Techniques for cooling a set of circuit boards within a rack mount cabinet |
US6963484B2 (en) * | 2003-12-17 | 2005-11-08 | Hewlett-Packard Development Company, L.P. | Airflow blocker component that comprises a flexible flap portion |
US7508663B2 (en) * | 2003-12-29 | 2009-03-24 | Rackable Systems, Inc. | Computer rack cooling system with variable airflow impedance |
US6927976B1 (en) * | 2004-01-15 | 2005-08-09 | Hewlett-Packard Development Company, L.P. | Air baffle for managing cooling air re-circulation in an electronic system |
US7123477B2 (en) * | 2004-03-31 | 2006-10-17 | Rackable Systems, Inc. | Computer rack cooling system |
US7236359B2 (en) * | 2004-04-01 | 2007-06-26 | Strobel Larry A | Environmental control system for personal computers |
US20050264995A1 (en) * | 2004-05-28 | 2005-12-01 | Lsi Logic Corporation | Downdraft cooling system for in-line devices |
US20090036167A1 (en) * | 2004-11-29 | 2009-02-05 | Sanmina-Sci Corporation | System and method for base station heat dissipation using chimneys |
US8115145B2 (en) * | 2004-11-29 | 2012-02-14 | Sanmina-Sci Corporation | Systems and methods for base station enclosures |
EP1694084A1 (en) * | 2005-02-18 | 2006-08-23 | T-Mobile Netherlands B.V. | Electrical equipment enclosure, method of installing equipment in such an enclosure, and extension device |
JP4778246B2 (ja) * | 2005-03-16 | 2011-09-21 | 日本電気株式会社 | 無線基地局装置 |
JP4361033B2 (ja) * | 2005-04-27 | 2009-11-11 | 株式会社日立製作所 | ディスクアレイ装置 |
CN1917752A (zh) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业(深圳)有限公司 | 具有散热装置的网络设备及其散热方法 |
US7365974B2 (en) * | 2005-10-14 | 2008-04-29 | Smiths Aerospace Llc | Method for electronics equipment cooling having improved EMI control and reduced weight |
WO2008003038A2 (en) * | 2006-06-29 | 2008-01-03 | Se2 Labs | Systems and methods for improved cooling of lelectrical components |
US7520805B2 (en) * | 2006-07-24 | 2009-04-21 | D-Link Corporation | Housing with hidden ventilation holes |
FI122888B (fi) * | 2007-10-08 | 2012-08-31 | Vacon Oyj | Tehoelektroniikkalaitteiston kotelointijärjestely |
US7898117B2 (en) * | 2008-05-22 | 2011-03-01 | International Business Machines Corporation | Modular racks and methods of use |
US10058011B2 (en) * | 2008-06-19 | 2018-08-21 | Panduit Corp. | Passive cooling systems for network cabinet |
US8325479B2 (en) * | 2010-07-16 | 2012-12-04 | Rockwell Automation Technologies, Inc. | Motor drive cooling duct system and method |
US8325478B2 (en) * | 2010-07-16 | 2012-12-04 | Rockwell Automation Technologies, Inc. | Cooling duct attachment and sealing for a motor drive |
US8335081B2 (en) | 2010-07-16 | 2012-12-18 | Rockwell Automation Technologies, Inc. | Heat sink cooling arrangement for multiple power electronic circuits |
FR2963327B1 (fr) * | 2010-07-27 | 2012-08-24 | Air Liquide | Dispositif de stockage d'articles sous atmosphere controlee |
US8405985B1 (en) | 2010-09-08 | 2013-03-26 | Juniper Networks, Inc. | Chassis system with front cooling intake |
US10492331B1 (en) * | 2010-09-29 | 2019-11-26 | Amazon Technologies, Inc. | System and method for cooling power distribution units |
WO2013003448A2 (en) * | 2011-06-27 | 2013-01-03 | Bergquist-Torrington Company | Cooling module with parallel blowers |
FR2980777B1 (fr) * | 2011-09-30 | 2016-02-12 | Airbus Operations Sas | Systeme de ventilation et circuits de soufflage et d'extraction d'air d'un tel systeme, ainsi que baie avionique d'aeronef |
US20130100610A1 (en) * | 2011-10-19 | 2013-04-25 | Danfoss A/S | Air duct arrangement for cooling a group of at least two heat producing modules |
US8687363B2 (en) * | 2012-05-01 | 2014-04-01 | General Electric Company | Enclosure with duct mounted electronic components |
US9426932B2 (en) | 2013-03-13 | 2016-08-23 | Silicon Graphics International Corp. | Server with heat pipe cooling |
US9612920B2 (en) | 2013-03-15 | 2017-04-04 | Silicon Graphics International Corp. | Hierarchical system manager rollback |
US10215431B2 (en) | 2013-03-18 | 2019-02-26 | Carrier Corporation | Compact air handler with multiple fans |
TWI489741B (zh) * | 2013-12-20 | 2015-06-21 | Ind Tech Res Inst | 具有散熱功能之馬達驅控器及其散熱方法 |
CN104812184B (zh) * | 2014-01-23 | 2018-05-04 | 华为技术有限公司 | 一种导风系统 |
US10306979B2 (en) | 2016-05-05 | 2019-06-04 | David Oliver Boone | System and method for flat packed furniture to enable reuse of packaging materials |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3562593A (en) * | 1968-12-31 | 1971-02-09 | Westinghouse Electric Corp | Metal-enclosed switchgear with vertically disposed conductors |
DE2211268C3 (de) * | 1972-03-09 | 1978-10-12 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Lüftungsanordnung für Einschübe |
GB1494679A (en) * | 1974-03-28 | 1977-12-07 | Siemens Ag | Housings for telecommunications equipment or the like |
US4149218A (en) * | 1977-12-30 | 1979-04-10 | International Business Machines Corporation | Minimum delay module assembly |
JPS5814684B2 (ja) * | 1979-06-08 | 1983-03-22 | 富士通株式会社 | 電子機器筐体の連結構造 |
CA1164578A (en) * | 1980-10-24 | 1984-03-27 | Yoshihiro Takahashi | Shelf unit for electronic communication devices |
DE3107683A1 (de) * | 1981-02-28 | 1982-09-16 | Brown, Boveri & Cie Ag, 6800 Mannheim | Schrank zur aufnahme von elektrischen und/oder elektronischen bauelementen |
EP0236501B1 (en) * | 1984-11-15 | 1992-02-26 | Fujitsu Limited | Cooling structure of a rack for electronic devices |
ES2024412B3 (es) * | 1985-12-13 | 1992-03-01 | Hasler Ag Ascom | Procedimiento y dispositivo para la evacuacion de calor perdido de por lo menos un grupo de construccion de elementos electricos |
US4694484A (en) * | 1986-02-18 | 1987-09-15 | Motorola, Inc. | Cellular radiotelephone land station |
US4758924A (en) * | 1986-05-29 | 1988-07-19 | Honeywell Bull Inc. | Electronic equipment housing |
GB8910398D0 (en) * | 1989-05-05 | 1989-06-21 | Ashley & Rock Ltd | Improvements in or relating to consumer units |
JPH0494595A (ja) * | 1990-08-10 | 1992-03-26 | Fujitsu Ltd | 電子機器の冷却構造 |
SE466779B (sv) * | 1991-02-13 | 1992-03-30 | L T S I Soederkoeping Ab | Anordning vid ett kylsystem foer kylning av teleteknisk utrustning |
-
1992
- 1992-12-15 US US07/990,515 patent/US5398159A/en not_active Expired - Lifetime
-
1993
- 1993-12-07 KR KR1019940702804A patent/KR100352110B1/ko not_active IP Right Cessation
- 1993-12-07 JP JP6514056A patent/JPH07506222A/ja active Pending
- 1993-12-07 WO PCT/SE1993/001054 patent/WO1994014308A1/en active Application Filing
- 1993-12-07 AU AU57231/94A patent/AU669043B2/en not_active Ceased
- 1993-12-07 SG SG1996012108A patent/SG49350A1/en unknown
- 1993-12-07 NZ NZ259077A patent/NZ259077A/en unknown
- 1993-12-07 CA CA002130194A patent/CA2130194A1/en not_active Abandoned
- 1993-12-07 GB GB9415177A patent/GB2278961B/en not_active Expired - Lifetime
- 1993-12-07 BR BR9305896A patent/BR9305896A/pt not_active IP Right Cessation
- 1993-12-11 TW TW084217100U patent/TW370333U/zh unknown
- 1993-12-13 MY MYPI93002680A patent/MY109964A/en unknown
- 1993-12-14 MX MX9307922A patent/MX9307922A/es unknown
- 1993-12-14 CN CN93112656A patent/CN1042387C/zh not_active Expired - Lifetime
- 1993-12-15 IT IT93MI002630A patent/IT1265279B1/it active IP Right Grant
-
1994
- 1994-08-04 SE SE9402633A patent/SE518372C2/sv not_active IP Right Cessation
-
1998
- 1998-06-17 HK HK98105588A patent/HK1006630A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2278961B (en) | 1996-05-15 |
HK1006630A1 (en) | 1999-03-05 |
GB2278961A (en) | 1994-12-14 |
CN1042387C (zh) | 1999-03-03 |
KR950700678A (ko) | 1995-01-16 |
JPH07506222A (ja) | 1995-07-06 |
WO1994014308A1 (en) | 1994-06-23 |
CA2130194A1 (en) | 1994-06-16 |
MX9307922A (es) | 1994-06-30 |
MY109964A (en) | 1997-10-31 |
SE9402633D0 (sv) | 1994-08-04 |
BR9305896A (pt) | 1997-08-19 |
US5398159A (en) | 1995-03-14 |
AU669043B2 (en) | 1996-05-23 |
SG49350A1 (en) | 1998-05-18 |
ITMI932630A0 (it) | 1993-12-15 |
SE518372C2 (sv) | 2002-10-01 |
CN1090460A (zh) | 1994-08-03 |
ITMI932630A1 (it) | 1995-06-15 |
GB9415177D0 (en) | 1994-09-28 |
AU5723194A (en) | 1994-07-04 |
NZ259077A (en) | 1996-11-26 |
SE9402633L (sv) | 1994-10-03 |
TW370333U (en) | 1999-09-11 |
KR100352110B1 (ko) | 2003-01-24 |
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Legal Events
Date | Code | Title | Description |
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0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19971128 |