ITMI20101577A1 - Microsistema - Google Patents
MicrosistemaInfo
- Publication number
- ITMI20101577A1 ITMI20101577A1 IT001577A ITMI20101577A ITMI20101577A1 IT MI20101577 A1 ITMI20101577 A1 IT MI20101577A1 IT 001577 A IT001577 A IT 001577A IT MI20101577 A ITMI20101577 A IT MI20101577A IT MI20101577 A1 ITMI20101577 A1 IT MI20101577A1
- Authority
- IT
- Italy
- Prior art keywords
- microsystem
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0041—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009029180.6A DE102009029180B4 (de) | 2009-09-03 | 2009-09-03 | Mikrosystem |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20101577A1 true ITMI20101577A1 (it) | 2011-03-04 |
IT1400767B1 IT1400767B1 (it) | 2013-07-02 |
Family
ID=43571013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2010A001577A IT1400767B1 (it) | 2009-09-03 | 2010-08-27 | Microsistema |
Country Status (4)
Country | Link |
---|---|
US (2) | US8286854B2 (it) |
CN (1) | CN102009942B (it) |
DE (1) | DE102009029180B4 (it) |
IT (1) | IT1400767B1 (it) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008054415A1 (de) * | 2008-12-09 | 2010-06-10 | Robert Bosch Gmbh | Anordnung zweier Substrate mit einer SLID-Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung |
US8216882B2 (en) * | 2010-08-23 | 2012-07-10 | Freescale Semiconductor, Inc. | Method of producing a microelectromechanical (MEMS) sensor device |
DE102011081033B4 (de) * | 2011-08-16 | 2022-02-17 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur |
DE102011085727A1 (de) * | 2011-11-03 | 2013-05-08 | Continental Teves Ag & Co. Ohg | Mikromechanisches Element, Bauelement mit einem mikromechanischen Element und Verfahren zum Herstellen eines Bauelements |
JP2013232626A (ja) * | 2012-04-04 | 2013-11-14 | Seiko Epson Corp | 電子デバイス及びその製造方法、電子機器、並びに移動体 |
US20130320466A1 (en) * | 2012-05-31 | 2013-12-05 | Analog Devices, Inc. | Package for Damping Inertial Sensor |
US8952465B2 (en) * | 2012-07-13 | 2015-02-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS devices, packaged MEMS devices, and methods of manufacture thereof |
DE102012219605B4 (de) | 2012-10-26 | 2021-09-23 | Robert Bosch Gmbh | Mikromechanisches Bauelement |
US9862594B2 (en) | 2013-03-15 | 2018-01-09 | Versana Micro Inc. | Wearable device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor |
US9738511B2 (en) | 2013-09-13 | 2017-08-22 | Invensense, Inc. | Reduction of chipping damage to MEMS structure |
DE102013222517A1 (de) * | 2013-11-06 | 2015-05-07 | Robert Bosch Gmbh | Mikromechanische Sensoreinheit und Verfahren zur Herstellung von mikromechanischen Sensoreinheiten |
US9352956B2 (en) | 2014-01-16 | 2016-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS devices and methods for forming same |
US9761557B2 (en) * | 2014-04-28 | 2017-09-12 | Invensense, Inc. | CMOS-MEMS integration by sequential bonding method |
DE102014211558A1 (de) * | 2014-06-17 | 2015-12-17 | Robert Bosch Gmbh | Mikroelektromechanisches System und Verfahren zum Herstellen eines mikroelektromechanischen Systems |
CN106586946A (zh) * | 2015-10-15 | 2017-04-26 | 中芯国际集成电路制造(上海)有限公司 | 一种mems器件及其制备方法、电子装置 |
DE102015224533A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Reaktives Verschlussgas zur gezielten Anpassung des Kaverneninnendruckes |
DE102015224481A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Laser-Reseal mit verschiedenen Kappenmaterialien |
DE102015224523A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Zusätzliche Fläche zur Stabilisierung des Kaverneninnendrucks über Lebenszeit |
DE102016200497A1 (de) * | 2016-01-15 | 2017-07-20 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
CN105762088B (zh) * | 2016-04-13 | 2018-07-31 | 中国科学院微电子研究所 | 一种阻止金属共晶键合合金外溢的方法及一种器件 |
DE102017207475A1 (de) * | 2017-04-07 | 2018-11-08 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements |
CN109231153A (zh) * | 2018-08-22 | 2019-01-18 | 深圳市奥极医疗科技有限公司 | 微加速度传感器的芯片级封装结构及制作方法与划片方法 |
CN109748235B (zh) * | 2018-12-29 | 2022-01-07 | 深迪半导体(绍兴)有限公司 | 一种半导体器件及其密封腔体制造工艺和图案转移版 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3613838B2 (ja) * | 1995-05-18 | 2005-01-26 | 株式会社デンソー | 半導体装置の製造方法 |
US6428650B1 (en) * | 1998-06-23 | 2002-08-06 | Amerasia International Technology, Inc. | Cover for an optical device and method for making same |
JP3435665B2 (ja) * | 2000-06-23 | 2003-08-11 | 株式会社村田製作所 | 複合センサ素子およびその製造方法 |
US20020056742A1 (en) * | 2000-11-10 | 2002-05-16 | Rinne Glenn A. | Methods and systems for attaching substrates to one another using solder structures having portions with different melting points |
US6470594B1 (en) * | 2001-09-21 | 2002-10-29 | Eastman Kodak Company | Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps |
US6644536B2 (en) * | 2001-12-28 | 2003-11-11 | Intel Corporation | Solder reflow with microwave energy |
DE10243014B4 (de) * | 2002-09-17 | 2010-07-01 | Robert Bosch Gmbh | Vorrichtung zur Detektion und Vorrichtung zur Messung der Konzentration eines Stoffes |
DE102004027501A1 (de) * | 2004-06-04 | 2005-12-22 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit mehreren Kavernen und Herstellungsverfahren |
US7159459B2 (en) * | 2005-01-06 | 2007-01-09 | Freescale Semiconductor, Inc. | Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor |
DE102006016260B4 (de) * | 2006-04-06 | 2024-07-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements |
CN100492631C (zh) * | 2006-04-26 | 2009-05-27 | 胜华科技股份有限公司 | 光学显示器构装结构及其方法 |
JP2008218811A (ja) * | 2007-03-06 | 2008-09-18 | Hitachi Metals Ltd | 機能素子パッケージ |
FR2922203B1 (fr) * | 2007-10-15 | 2009-11-20 | Commissariat Energie Atomique | Procede de realisation d'une structure ayant un cordon de scellement ajoure et structure obtenue. |
DE102008040970A1 (de) * | 2008-08-04 | 2010-02-11 | Robert Bosch Gmbh | Mikromechanische Vorrichtung mit Kavernen mit unterschiedlichem atmosphärischen Innendruck |
KR100945800B1 (ko) * | 2008-12-09 | 2010-03-05 | 김영혜 | 이종 접합 웨이퍼 제조방법 |
-
2009
- 2009-09-03 DE DE102009029180.6A patent/DE102009029180B4/de active Active
-
2010
- 2010-08-06 US US12/806,135 patent/US8286854B2/en active Active
- 2010-08-27 IT ITMI2010A001577A patent/IT1400767B1/it active
- 2010-09-01 CN CN201010270684.9A patent/CN102009942B/zh active Active
-
2012
- 2012-07-26 US US13/558,772 patent/US20120291543A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20120291543A1 (en) | 2012-11-22 |
DE102009029180B4 (de) | 2017-07-20 |
US8286854B2 (en) | 2012-10-16 |
US20110048132A1 (en) | 2011-03-03 |
DE102009029180A1 (de) | 2011-03-17 |
CN102009942A (zh) | 2011-04-13 |
IT1400767B1 (it) | 2013-07-02 |
CN102009942B (zh) | 2016-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL301193I2 (nl) | tebentafusp | |
NL301164I2 (nl) | sacituzumab govitecan | |
IT1400767B1 (it) | Microsistema | |
DK2414015T3 (da) | Laryngoskopsystem | |
DE112010002949A5 (de) | Kupplungstastpunkte | |
DK2411442T4 (da) | Umættet polyesterresin | |
BRPI1008827A2 (pt) | deisobutenizador | |
DK2430035T3 (da) | Uracylspipooxetannukleosider | |
BRPI1014968A2 (pt) | subalargador | |
DE112010002728A5 (de) | Turboinhalator | |
DE112009005323A5 (de) | Hebelarmprüfmaschine | |
DE112009005462T8 (de) | Lenkungsssteuervorrichtung | |
BR112012004964A2 (pt) | girocóptero | |
BRPI1008070A2 (pt) | tricianoboratos | |
DK2483126T3 (da) | Skinnekøretøj | |
DK2506968T3 (da) | Faujasit-zeolit | |
DE112010004865T8 (de) | Lamellennassreibkupplung | |
DE112010003255A5 (de) | Fördergutverteiler | |
BRPI1010159A2 (pt) | bistuti | |
DE602010000025D1 (de) | Fahrzeugsitzgurtvorrichtung | |
BR112012003616A2 (pt) | metilpirroloprimidinacarboxamidas | |
DE112010002351A5 (de) | Klemmorrichtung | |
DE112010003843T8 (de) | Lastansteuervorrichtung | |
UY3954Q (es) | Epiladora | |
DE202009005065U8 (de) | Kartonverschließmaschine |