ITMI20100107A1 - Apparato per cvd al plasma - Google Patents

Apparato per cvd al plasma

Info

Publication number
ITMI20100107A1
ITMI20100107A1 ITMI20100107A ITMI20100107A1 IT MI20100107 A1 ITMI20100107 A1 IT MI20100107A1 IT MI20100107 A ITMI20100107 A IT MI20100107A IT MI20100107 A1 ITMI20100107 A1 IT MI20100107A1
Authority
IT
Italy
Prior art keywords
cvd
plasma apparatus
plasma
Prior art date
Application number
Other languages
English (en)
Inventor
Kazuhiko Isshiki
Katsushi Kishimoto
Koji Murakami
Masahiro Yokogawa
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of ITMI20100107A1 publication Critical patent/ITMI20100107A1/it
Application granted granted Critical
Publication of IT1399179B1 publication Critical patent/IT1399179B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
ITMI2010A000107A 2009-06-12 2010-01-27 Apparato per cvd al plasma IT1399179B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009141595A JP4786731B2 (ja) 2009-06-12 2009-06-12 プラズマｃｖｄ装置

Publications (2)

Publication Number Publication Date
ITMI20100107A1 true ITMI20100107A1 (it) 2010-04-28
IT1399179B1 IT1399179B1 (it) 2013-04-11

Family

ID=43308591

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A000107A IT1399179B1 (it) 2009-06-12 2010-01-27 Apparato per cvd al plasma

Country Status (3)

Country Link
JP (1) JP4786731B2 (it)
IT (1) IT1399179B1 (it)
WO (1) WO2010143327A1 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468530B (zh) 2012-02-13 2015-01-11 新日鐵住金股份有限公司 冷軋鋼板、鍍敷鋼板、及其等之製造方法
WO2019235282A1 (ja) * 2018-06-07 2019-12-12 東京エレクトロン株式会社 基板処理装置およびシャワーヘッド
CN112823406B (zh) * 2018-09-26 2024-03-12 应用材料公司 用于等离子体处理腔室的导热间隔件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155844B2 (ja) * 1992-10-20 2001-04-16 日本真空技術株式会社 真空処理装置の高周波電極
JP2000120926A (ja) * 1998-10-20 2000-04-28 Aron Kasei Co Ltd 配管工法
JP2000294538A (ja) * 1999-04-01 2000-10-20 Matsushita Electric Ind Co Ltd 真空処理装置
US7645341B2 (en) * 2003-12-23 2010-01-12 Lam Research Corporation Showerhead electrode assembly for plasma processing apparatuses
JP4532897B2 (ja) * 2003-12-26 2010-08-25 財団法人国際科学振興財団 プラズマ処理装置、プラズマ処理方法及び製品の製造方法
JP4185483B2 (ja) * 2004-10-22 2008-11-26 シャープ株式会社 プラズマ処理装置
JP4870608B2 (ja) * 2007-04-12 2012-02-08 株式会社アルバック 成膜装置

Also Published As

Publication number Publication date
WO2010143327A1 (ja) 2010-12-16
JP4786731B2 (ja) 2011-10-05
JP2010285667A (ja) 2010-12-24
IT1399179B1 (it) 2013-04-11

Similar Documents

Publication Publication Date Title
EP2653586A4 (en) PLASMA ASSISTED CVD APPARATUS
GB0918246D0 (en) Apparatus
GB0906192D0 (en) Apparatus
GB0913229D0 (en) Apparatus for bio-automation
EP2487277A4 (en) PLASMA ASSISTED CHEMICAL VAPOR DEPOSITION DEVICE
GB0912799D0 (en) Apparatus
ZA201107480B (en) Apparatus for depositing
EP2479781A4 (en) PLASMA ETCHING DEVICE
HK1164381A1 (en) Plasma deposition
HK1202788A1 (en) Toilet purging apparatus
EP2397575A4 (en) CHEMICAL VAPOR DEPOSITION DEVICE (CVD)
EP2738288A4 (en) PLASMA CVD DEVICE
IT1400899B1 (it) Dispositivo di attacco per mandrino
EP2416351A4 (en) plasma etching
PL2277634T3 (pl) Przyrząd oczyszczający do oczyszczania przewodów rurowych
DE112010000869T8 (de) Plasmaverarbeitungsvorrichtung
EP2478955A4 (en) PLASMA GENERATION DEVICE
ITPD20090053U1 (it) Paradordi per banchine
EP2385153A4 (en) CVD DEVICE
GB0909258D0 (en) Apparatus
IT1399179B1 (it) Apparato per cvd al plasma
DE112010000717T8 (de) Plasmaverarbeitungsvorrichtung
GB2467213B (en) Navigation apparatus
DE112010000818T8 (de) Plasmaverarbeitungsvorrichtung
GB201014083D0 (en) Apparatus for retaining