ITMI20051681A1 - Componente micromeccanico e corrispondente procedimento di produzione - Google Patents

Componente micromeccanico e corrispondente procedimento di produzione

Info

Publication number
ITMI20051681A1
ITMI20051681A1 IT001681A ITMI20051681A ITMI20051681A1 IT MI20051681 A1 ITMI20051681 A1 IT MI20051681A1 IT 001681 A IT001681 A IT 001681A IT MI20051681 A ITMI20051681 A IT MI20051681A IT MI20051681 A1 ITMI20051681 A1 IT MI20051681A1
Authority
IT
Italy
Prior art keywords
correspondent
production procedure
micromechanical component
micromechanical
component
Prior art date
Application number
IT001681A
Other languages
English (en)
Inventor
Heribert Weber
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20051681A1 publication Critical patent/ITMI20051681A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0278—Temperature sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Measuring Fluid Pressure (AREA)
IT001681A 2004-09-14 2005-09-13 Componente micromeccanico e corrispondente procedimento di produzione ITMI20051681A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004044222A DE102004044222A1 (de) 2004-09-14 2004-09-14 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren

Publications (1)

Publication Number Publication Date
ITMI20051681A1 true ITMI20051681A1 (it) 2006-03-15

Family

ID=35853588

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001681A ITMI20051681A1 (it) 2004-09-14 2005-09-13 Componente micromeccanico e corrispondente procedimento di produzione

Country Status (4)

Country Link
US (1) US7435691B2 (it)
JP (1) JP2006084469A (it)
DE (1) DE102004044222A1 (it)
IT (1) ITMI20051681A1 (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100718141B1 (ko) * 2005-12-01 2007-05-14 삼성전자주식회사 임베드된 정렬 마크를 이용한 양면 식각 방법
KR100749619B1 (ko) 2006-08-24 2007-08-14 동부일렉트로닉스 주식회사 반도체 장치 형성 방법
US7976714B2 (en) * 2008-01-04 2011-07-12 Honeywell International Inc. Single SOI wafer accelerometer fabrication process
DE102008002332B4 (de) * 2008-06-10 2017-02-09 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Membranstruktur mit Zugang von der Substratrückseite
NL2003514C2 (en) * 2009-09-18 2011-03-21 Otb Solar Bv Thin film deposition apparatus and method for the same.
DE102017218635B4 (de) * 2017-10-18 2021-03-18 Infineon Technologies Ag Verfahren zum Verschließen einer Zugangsöffnung zu einer Kavität und MEMS-Bauelement mit einem Verschlusselement
DE102020200333A1 (de) * 2020-01-14 2021-07-15 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauteil für eine Sensor- oder Mikrofonvorrichtung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175123A (en) * 1990-11-13 1992-12-29 Motorola, Inc. High-pressure polysilicon encapsulated localized oxidation of silicon
FR2672731A1 (fr) * 1991-02-07 1992-08-14 France Telecom Procede d'oxydation localisee enterree d'un substrat de silicium et circuit integre correspondant.
JP2850558B2 (ja) * 1991-03-28 1999-01-27 株式会社デンソー 半導体圧力センサおよびその製造方法
KR950002188B1 (ko) * 1992-02-12 1995-03-14 삼성전자주식회사 반도체 장치의 소자분리 방법
JPH05326687A (ja) * 1992-05-25 1993-12-10 Fujitsu Ltd Ｓｏｉ構造半導体装置
KR960005553B1 (ko) * 1993-03-31 1996-04-26 현대전자산업주식회사 필드산화막 형성 방법
US5393692A (en) * 1993-07-28 1995-02-28 Taiwan Semiconductor Manufacturing Company Recessed side-wall poly plugged local oxidation
SE9304145D0 (sv) * 1993-12-10 1993-12-10 Pharmacia Lkb Biotech Sätt att tillverka hålrumsstrukturer
JP3403850B2 (ja) * 1995-04-03 2003-05-06 富士通株式会社 半導体装置の製造方法
US5994203A (en) * 1996-02-28 1999-11-30 Micron Technology, Inc. Process for stress reduction in silicon during field isolation
US5789305A (en) * 1997-01-27 1998-08-04 Chartered Semiconductor Manufacturing Ltd. Locos with bird's beak suppression by a nitrogen implantation
JPH11135806A (ja) * 1997-10-28 1999-05-21 Denso Corp 半導体圧力センサおよびその製造方法
US6245643B1 (en) * 1999-04-30 2001-06-12 Mosel Vitelic, Inc. Method of removing polysilicon residual in a LOCOS isolation process using an etching selectivity solution

Also Published As

Publication number Publication date
US20060057755A1 (en) 2006-03-16
JP2006084469A (ja) 2006-03-30
US7435691B2 (en) 2008-10-14
DE102004044222A1 (de) 2006-03-16

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