ITCA20100013A1 - WELDING ADHESIVE INSULATING GEL - IAS GEL - Google Patents
WELDING ADHESIVE INSULATING GEL - IAS GEL Download PDFInfo
- Publication number
- ITCA20100013A1 ITCA20100013A1 IT000013A ITCA20100013A ITCA20100013A1 IT CA20100013 A1 ITCA20100013 A1 IT CA20100013A1 IT 000013 A IT000013 A IT 000013A IT CA20100013 A ITCA20100013 A IT CA20100013A IT CA20100013 A1 ITCA20100013 A1 IT CA20100013A1
- Authority
- IT
- Italy
- Prior art keywords
- gel
- pine oil
- methyldiglycol
- claytone
- amines
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims description 5
- 230000001070 adhesive effect Effects 0.000 title claims description 5
- 238000003466 welding Methods 0.000 title claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims 3
- 239000010665 pine oil Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 1
- 230000002051 biphasic effect Effects 0.000 claims 1
- 239000003153 chemical reaction reagent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- 239000013008 thixotropic agent Substances 0.000 claims 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 1
- 239000000499 gel Substances 0.000 description 7
- 239000006071 cream Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
Description
Descrizione Description
"GEL ISOLANTE ADESIVO SALDANTE - GELIAS "WELDING ADHESIVE INSULATING GEL - GELIAS
Questo documento descrive le specifiche caratteristiche innovative del GEL ISOLANTE ADESIVO SALDANTE . Questo prodotto à ̈ la nuova generazione di gel adesivo non metallico, no clean, sviluppato per sostituire la tradizionale crema-gel saldante contenente elementi sferici metallici. This document describes the specific innovative features of the ADHESIVE SOLDERING INSULATING GEL. This product is the new generation of non-metallic, no clean adhesive gel, developed to replace the traditional sealing gel-cream containing metallic spherical elements.
Rappresenta un collegamento innovativo di aree metalliche tramite riscaldamento senza apporto di qualsiasi materiale metallico. I saldanti esistenti hanno un apporto di leghe di materiali metallici., Il Gel Saldante supera il limite tecnologico delle attuali CremeGel Saldanti prodotte per l'elettronica e microelettronica che contengono tante piccole sferette metalliche (i metalli maggiormente utilizzati per questa metallurgia sono : il piombo , lo stagno, l'argento, il bismuto, il rame, io zinco, il palladio) del diametro da un massimo di 80um ad un minimo di 20um. It represents an innovative connection of metal areas by heating without the addition of any metal material. The existing solders have a contribution of alloys of metallic materials., The Soldering Gel exceeds the technological limit of the current Soldering CremeGel produced for electronics and microelectronics which contain many small metal spheres (the metals most used for this metallurgy are: lead, tin, silver, bismuth, copper, zinc, palladium) with a diameter from a maximum of 80um to a minimum of 20um.
Ha la caratteristica innovativa perché supera le indicazioni delle creme-gel saldanti correnti contenenti le sferette metalliche e gli utilizzatori manifestano una criticità tecnologica perché l’utilizzo negli attuali processi di produzione tende a generare una moltitudine di difettosità ( corto circuito). It has the innovative characteristic because it exceeds the indications of the current sealing gel-creams containing the metal beads and the users show a technological criticality because the use in the current production processes tends to generate a multitude of defects (short circuit).
Assolutamente innovativa nella microcomponentistica perché non esistono controindicazioni di distanza tra i pin della componentistica elettronica. Esso à ̈ conducente tra metalli a contatto, mentre altrimenti à ̈ isolante. Innova e risolve i problemi delle distanze tra i Pin, limitazione esistente attualmente con i gel saldanti con sfere di qualsiasi metallo. I produttori di circuiti stampati e della relativa componentistica hanno dovuto frenare il processo di integrazione per questo impatto tecnologico di distanza dei PIN (apparecchiature sempre più piccole con funzioni sempre più elevate,). Absolutely innovative in micro-components because there are no contraindications of distance between the pins of the electronic components. It is a conductor between metals in contact, while otherwise it is insulating. It innovates and solves the problems of the distances between the pins, a limitation currently existing with soldering gels with spheres of any metal. Manufacturers of printed circuits and related components have had to slow down the integration process due to this technological impact of distance of the PINs (ever smaller equipment with ever higher functions).
Consente il metodo in uso con le usuali creme-gel saldanti, consistente nell'applicazione , sul circuito stampato, mediante processo serigrafico, con macchine automatiche o semiautomatiche, del posizionamento dei componenti . Si differenzia per la caratteristica innovativa rispetto alle esistenti creme saldanti con sfere metalliche perché i problemi di adesività fra i componenti e la crema saldante, comportano che il tutto non può stazionare per più di 5\8 ore senza che si completi il processo termico. Con il GEL SALDANTE, l'utilizzatore, senza sostituire i propri impianti ,nà ̈ modificare il processo di produzione tecnologico, ha il tempo di adesività , dopo il processo serigrafico, fino a 48 ore. It allows the method used with the usual sealing gel creams, consisting in the application, on the printed circuit, by means of a screen printing process, with automatic or semi-automatic machines, of the positioning of the components. It differs for its innovative feature compared to existing sealing creams with metal spheres because the problems of adhesiveness between the components and the sealing cream mean that everything cannot be stationed for more than 5 \ 8 hours without completing the thermal process. With the SOLDERING GEL, the user, without replacing his systems or modifying the technological production process, has the adhesion time, after the screen printing process, up to 48 hours.
E’ innovativa perché essendo solubile in alcooli consente il recupero della componentistica elettronica utilizzata nel circuito stampato . It is innovative because being soluble in alcohols it allows the recovery of the electronic components used in the printed circuit.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITCA2010A000013A IT1407741B1 (en) | 2010-10-11 | 2010-10-11 | WELDING ADHESIVE INSULATING GEL - GELIAS. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITCA2010A000013A IT1407741B1 (en) | 2010-10-11 | 2010-10-11 | WELDING ADHESIVE INSULATING GEL - GELIAS. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITCA20100013A1 true ITCA20100013A1 (en) | 2012-04-12 |
IT1407741B1 IT1407741B1 (en) | 2014-05-07 |
Family
ID=43737886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITCA2010A000013A IT1407741B1 (en) | 2010-10-11 | 2010-10-11 | WELDING ADHESIVE INSULATING GEL - GELIAS. |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT1407741B1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1262403A (en) * | 1969-07-15 | 1972-02-02 | Metallgesellschaft Ag | A flux for soft solders |
JPS56154297A (en) * | 1980-04-30 | 1981-11-28 | Senjiyu Kinzoku Kogyo Kk | Cream solder |
US5176759A (en) * | 1990-12-14 | 1993-01-05 | Senju Metal Industry Co., Ltd. | Paste solder with minimized residue |
US20080000549A1 (en) * | 2006-06-30 | 2008-01-03 | Umicore Ag & Co. Kg | No-clean low-residue solder paste for semiconductor device applications |
-
2010
- 2010-10-11 IT ITCA2010A000013A patent/IT1407741B1/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1262403A (en) * | 1969-07-15 | 1972-02-02 | Metallgesellschaft Ag | A flux for soft solders |
JPS56154297A (en) * | 1980-04-30 | 1981-11-28 | Senjiyu Kinzoku Kogyo Kk | Cream solder |
US5176759A (en) * | 1990-12-14 | 1993-01-05 | Senju Metal Industry Co., Ltd. | Paste solder with minimized residue |
US20080000549A1 (en) * | 2006-06-30 | 2008-01-03 | Umicore Ag & Co. Kg | No-clean low-residue solder paste for semiconductor device applications |
Also Published As
Publication number | Publication date |
---|---|
IT1407741B1 (en) | 2014-05-07 |
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