IT995738B - Procedimento per formare fini strutture di piste conduttrici su un substrato di ceramica - Google Patents

Procedimento per formare fini strutture di piste conduttrici su un substrato di ceramica

Info

Publication number
IT995738B
IT995738B IT2994973A IT2994973A IT995738B IT 995738 B IT995738 B IT 995738B IT 2994973 A IT2994973 A IT 2994973A IT 2994973 A IT2994973 A IT 2994973A IT 995738 B IT995738 B IT 995738B
Authority
IT
Italy
Prior art keywords
procedure
ceramic substrate
conductive tracks
forming fine
fine structures
Prior art date
Application number
IT2994973A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT995738B publication Critical patent/IT995738B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT2994973A 1972-10-11 1973-10-10 Procedimento per formare fini strutture di piste conduttrici su un substrato di ceramica IT995738B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722249878 DE2249878A1 (de) 1972-10-11 1972-10-11 Verfahren zur herstellung feiner leiterbahnstrukturen auf einem keramiksubstrat

Publications (1)

Publication Number Publication Date
IT995738B true IT995738B (it) 1975-11-20

Family

ID=5858760

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2994973A IT995738B (it) 1972-10-11 1973-10-10 Procedimento per formare fini strutture di piste conduttrici su un substrato di ceramica

Country Status (8)

Country Link
JP (1) JPS4973669A (de)
BE (1) BE805951A (de)
DE (1) DE2249878A1 (de)
FR (1) FR2203258A1 (de)
GB (1) GB1404697A (de)
IT (1) IT995738B (de)
LU (1) LU68577A1 (de)
NL (1) NL7313954A (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165698A (en) * 1979-06-11 1980-12-24 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer integrated circuit board
DE3023905C2 (de) * 1980-06-26 1982-09-09 Adam Opel AG, 6090 Rüsselsheim Armaturentafel für Fahrzeuge, insbesondere Kraftfahrzeuge, und Verfahren zur Herstellung einer solchen
JPS5785289A (en) * 1980-11-17 1982-05-27 Fujitsu Ltd Method of producing ceramic printed board
GB2124037B (en) * 1982-07-19 1986-02-26 Gen Electric Co Plc Methods of forming patterns on substrates
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
DE3507341A1 (de) * 1982-12-06 1986-09-04 Fine Particle Technology Corp., Camarillo, Calif. Verfahren zum bilden von elektrisch-leitenden bahnen auf einem substrat
WO1985001231A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board
KR850700099A (ko) * 1983-09-21 1985-10-21 로이 에이취. 맷신길 인쇄회로판 제조방법
WO1985001415A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board
US5094811A (en) * 1983-09-21 1992-03-10 Allied-Signal Method of making a printed circuit board
JPS60137092A (ja) * 1983-12-19 1985-07-20 株式会社東芝 回路基板の製造方法
US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
JPS63240096A (ja) * 1987-03-27 1988-10-05 富士通株式会社 グリ−ンシ−ト多層法
GB2212332A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Fabrication of electrical circuits
DE3821121A1 (de) * 1988-06-23 1990-02-08 Ullmann Ulo Werk Verfahren zur herstellung von kontakttraegerkoerpern
FR2820548A1 (fr) * 2001-02-02 2002-08-09 Schlumberger Systems & Service Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
GB2374205B (en) 2001-04-04 2004-12-22 Rolls Royce Plc An electrical conductor winding and a method of manufacturing an electrical conductor winding
JP2006066637A (ja) * 2004-08-26 2006-03-09 Murata Mfg Co Ltd セラミック多層基板の製造方法およびそれに用いられる押し型
CN109974305B (zh) * 2017-12-28 2022-09-16 武汉海尔热水器有限公司 一种外壳及电热水器
CN112643899A (zh) * 2020-12-16 2021-04-13 南京缔邦新材料科技有限公司 一种陶瓷覆铜板的细电路切割方法

Also Published As

Publication number Publication date
GB1404697A (en) 1975-09-03
DE2249878A1 (de) 1974-04-18
BE805951A (fr) 1974-02-01
JPS4973669A (de) 1974-07-16
FR2203258A1 (de) 1974-05-10
LU68577A1 (de) 1973-12-14
NL7313954A (de) 1974-04-16

Similar Documents

Publication Publication Date Title
IT995738B (it) Procedimento per formare fini strutture di piste conduttrici su un substrato di ceramica
IT983627B (it) Procedimento per formare sottili strati di tantalio su substrati isolanti
BE811712A (fr) Circuit a couches epaisses realise sur un substrat en ceramique
IT1068533B (it) Elemento a piu strati formato da lamelle di ceramica piezoelettrica
JPS51136538A (en) Method of forming thin film having desired pattern on substrate
IT996924B (it) Procedimento per formare uno strato di ossido metallico
IT1026142B (it) Procedimento per produrre strati di carburo di silicio su un sostrato di silicio
IT978479B (it) Guida ceramica elettroconduttiva e metodo per la fabbricazione della stessa
IT973425B (it) Procedimento e composizione per applicare un materiale conduttore su un sottostrato ad esempio per la produzione di microcircuiti elettronici
IT970349B (it) Procedimento per la realizzazione di un rivestimento stabilizzante e o isolante su superfici semicon duttrici
IT992857B (it) Corpi di ceramica a bassa dilatazione
GB1551290A (en) Ething of a layer supported on a substrate
IT946536B (it) Procedimento per formare strati metallici su un substrato
TR18572A (tr) Karayolu satih kaplama malzemesinin imali icin usul
IT946728B (it) Procedimento per la preparazione di un elemento di contatto elettri co sinterizzato a due strati
IT980415B (it) Metodo per la metallizzazione di substrati
IT981333B (it) Procedimento per formare strati di materiale semiconduttore su un substrato
IT1066018B (it) Piastra di base ceramica per orologio da polso elettronico
IT993935B (it) Oggetto di ceramica dielettrico
IT1050941B (it) Procedimento e dispotivo per la fabbricazione di piastrelle di ceramica
IT1087260B (it) Substrato di ceramica metallizzata emetodo per fare il medesimo
IT988354B (it) Procedimento per irradiare una com posizione portata dalla superficie di un oggetto particolarmente a scopo di polimerizzazione
FR2328295A1 (fr) Procede pour la fabrication de circuits en couches minces
SU503985A1 (ru) Облицовочна плитка
JPS529862A (en) Multilayered ceramic substrate