IT994322B - Circuito integrato a semiconduttore - Google Patents
Circuito integrato a semiconduttoreInfo
- Publication number
- IT994322B IT994322B IT52725/73A IT5272573A IT994322B IT 994322 B IT994322 B IT 994322B IT 52725/73 A IT52725/73 A IT 52725/73A IT 5272573 A IT5272573 A IT 5272573A IT 994322 B IT994322 B IT 994322B
- Authority
- IT
- Italy
- Prior art keywords
- integrated circuit
- semiconductor integrated
- semiconductor
- circuit
- integrated
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
- H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
- H10D84/615—Combinations of vertical BJTs and one or more of resistors or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47096007A JPS521877B2 (enrdf_load_stackoverflow) | 1972-09-25 | 1972-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT994322B true IT994322B (it) | 1975-10-20 |
Family
ID=14153103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT52725/73A IT994322B (it) | 1972-09-25 | 1973-09-25 | Circuito integrato a semiconduttore |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS521877B2 (enrdf_load_stackoverflow) |
CA (1) | CA1004780A (enrdf_load_stackoverflow) |
DE (1) | DE2348262A1 (enrdf_load_stackoverflow) |
FR (1) | FR2200636B1 (enrdf_load_stackoverflow) |
GB (1) | GB1429696A (enrdf_load_stackoverflow) |
IT (1) | IT994322B (enrdf_load_stackoverflow) |
NL (1) | NL184814C (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5994450A (ja) * | 1982-11-19 | 1984-05-31 | Nec Kyushu Ltd | 半導体装置の製造方法 |
US5177587A (en) * | 1989-07-21 | 1993-01-05 | Linear Technology Corporation | Push-back junction isolation semiconductor structure and method |
JP5497298B2 (ja) * | 2009-01-16 | 2014-05-21 | 久光製薬株式会社 | シート状貼付剤 |
JP5974978B2 (ja) | 2013-05-29 | 2016-08-23 | 信越半導体株式会社 | シリコン単結晶製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1539873B2 (de) * | 1966-10-18 | 1971-03-11 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Transistor |
US3544863A (en) * | 1968-10-29 | 1970-12-01 | Motorola Inc | Monolithic integrated circuit substructure with epitaxial decoupling capacitance |
FR2036530A5 (enrdf_load_stackoverflow) * | 1969-03-24 | 1970-12-24 | Radiotechnique Compelec |
-
1972
- 1972-09-25 JP JP47096007A patent/JPS521877B2/ja not_active Expired
-
1973
- 1973-09-24 GB GB4475173A patent/GB1429696A/en not_active Expired
- 1973-09-24 CA CA181,779A patent/CA1004780A/en not_active Expired
- 1973-09-25 IT IT52725/73A patent/IT994322B/it active
- 1973-09-25 FR FR7334414A patent/FR2200636B1/fr not_active Expired
- 1973-09-25 NL NLAANVRAGE7313221,A patent/NL184814C/xx not_active IP Right Cessation
- 1973-09-25 DE DE19732348262 patent/DE2348262A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2200636A1 (enrdf_load_stackoverflow) | 1974-04-19 |
NL184814C (nl) | 1989-11-01 |
JPS521877B2 (enrdf_load_stackoverflow) | 1977-01-18 |
JPS4953386A (enrdf_load_stackoverflow) | 1974-05-23 |
NL184814B (nl) | 1989-06-01 |
FR2200636B1 (enrdf_load_stackoverflow) | 1978-06-30 |
DE2348262A1 (de) | 1974-04-18 |
GB1429696A (enrdf_load_stackoverflow) | 1976-03-24 |
NL7313221A (enrdf_load_stackoverflow) | 1974-03-27 |
CA1004780A (en) | 1977-02-01 |
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