IT993790B - Lunghezza di un provino sotto l effetto della temperaturadispositivo interferometrico per misurare le variazioni d - Google Patents
Lunghezza di un provino sotto l effetto della temperaturadispositivo interferometrico per misurare le variazioni dInfo
- Publication number
- IT993790B IT993790B IT28274/73A IT2827473A IT993790B IT 993790 B IT993790 B IT 993790B IT 28274/73 A IT28274/73 A IT 28274/73A IT 2827473 A IT2827473 A IT 2827473A IT 993790 B IT993790 B IT 993790B
- Authority
- IT
- Italy
- Prior art keywords
- length
- temperature
- effect
- specimen under
- interferometric device
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/16—Investigating or analyzing materials by the use of thermal means by investigating thermal coefficient of expansion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7231505A FR2198636A5 (it) | 1972-09-06 | 1972-09-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT993790B true IT993790B (it) | 1975-09-30 |
Family
ID=9103916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT28274/73A IT993790B (it) | 1972-09-06 | 1973-08-28 | Lunghezza di un provino sotto l effetto della temperaturadispositivo interferometrico per misurare le variazioni d |
Country Status (6)
Country | Link |
---|---|
US (1) | US3930730A (it) |
BE (1) | BE804146A (it) |
DE (1) | DE2344822A1 (it) |
FR (1) | FR2198636A5 (it) |
GB (1) | GB1441664A (it) |
IT (1) | IT993790B (it) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4147435A (en) * | 1977-06-30 | 1979-04-03 | International Business Machines Corporation | Interferometric process and apparatus for the measurement of the etch rate of opaque surfaces |
US4313679A (en) * | 1979-11-29 | 1982-02-02 | The United States Of America As Represented By The Secretary Of The Air Force | Test sample support assembly |
US4643577A (en) * | 1983-07-15 | 1987-02-17 | Wero Ohg Roth & Co. | Length measuring apparatus based on the dual laser beam interferometer principle |
US5350899A (en) * | 1992-04-15 | 1994-09-27 | Hiroichi Ishikawa | Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber |
US4579463A (en) * | 1984-05-21 | 1986-04-01 | Therma-Wave Partners | Detecting thermal waves to evaluate thermal parameters |
US4636088A (en) * | 1984-05-21 | 1987-01-13 | Therma-Wave, Inc. | Method and apparatus for evaluating surface conditions of a sample |
US4815856A (en) * | 1986-06-05 | 1989-03-28 | Storage Technology Partners Ii | Method and apparatus for measuring the absolute thickness of dust defocus layers |
US4823291A (en) * | 1987-09-10 | 1989-04-18 | Sensor Control, Inc. | Radiometric measurement of wafer temperatures during deposition |
US5121987A (en) * | 1989-03-02 | 1992-06-16 | Honeywell Inc. | Method and apparatus for measuring coefficient of thermal expansion |
JPH0640078B2 (ja) * | 1989-08-21 | 1994-05-25 | 品川白煉瓦株式会社 | セラミツクス等の熱間における変位測定装置 |
US5231285A (en) * | 1991-06-28 | 1993-07-27 | Honeywell Inc. | Refraction index change measurement |
US5290586A (en) * | 1992-09-10 | 1994-03-01 | International Business Machines Corporation | Method to monitor Meta-Paete cure on metallized substrates |
US5581351A (en) * | 1994-02-22 | 1996-12-03 | Eastman Kodak Company | Optical monitor for measuring thermal expansion of a rotating roller |
US5650852A (en) * | 1996-03-08 | 1997-07-22 | The Boeing Company | Temperature-compensated laser measuring method and apparatus |
US6681145B1 (en) * | 1996-06-06 | 2004-01-20 | The Boeing Company | Method for improving the accuracy of machines |
CN1221500B (zh) * | 1996-06-06 | 2013-06-05 | 波音公司 | 改进精度的机床系统及其方法 |
US5949685A (en) * | 1997-06-03 | 1999-09-07 | The Boeing Company | Real-time orientation of machine media to improve machine accuracy |
US6049220A (en) | 1998-06-10 | 2000-04-11 | Boxer Cross Incorporated | Apparatus and method for evaluating a wafer of semiconductor material |
US6812047B1 (en) | 2000-03-08 | 2004-11-02 | Boxer Cross, Inc. | Evaluating a geometric or material property of a multilayered structure |
US6911349B2 (en) * | 2001-02-16 | 2005-06-28 | Boxer Cross Inc. | Evaluating sidewall coverage in a semiconductor wafer |
US6812717B2 (en) * | 2001-03-05 | 2004-11-02 | Boxer Cross, Inc | Use of a coefficient of a power curve to evaluate a semiconductor wafer |
US6958814B2 (en) * | 2002-03-01 | 2005-10-25 | Applied Materials, Inc. | Apparatus and method for measuring a property of a layer in a multilayered structure |
US6971791B2 (en) * | 2002-03-01 | 2005-12-06 | Boxer Cross, Inc | Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough |
US6878559B2 (en) * | 2002-09-23 | 2005-04-12 | Applied Materials, Inc. | Measurement of lateral diffusion of diffused layers |
US6963393B2 (en) * | 2002-09-23 | 2005-11-08 | Applied Materials, Inc. | Measurement of lateral diffusion of diffused layers |
DE10309284B4 (de) * | 2003-03-04 | 2006-07-20 | Linseis Meßgeräte GmbH | Dilatometer |
US7164481B2 (en) * | 2003-09-01 | 2007-01-16 | Kabushiki Kaisha Ohara | Coefficient of linear expansion measuring apparatus and coefficient of linear expansion measuring method |
JP3908211B2 (ja) * | 2003-09-01 | 2007-04-25 | 株式会社オハラ | 線膨張係数測定装置及び線膨張係数測定方法 |
CN107894440B (zh) * | 2017-12-20 | 2023-11-10 | 沈阳建筑大学 | 一种混凝土热膨胀系数测量装置及测量方法 |
US11561080B2 (en) | 2021-03-26 | 2023-01-24 | Arun Anath Aiyer | Optical sensor for surface inspection and metrology |
US11442025B1 (en) * | 2021-03-26 | 2022-09-13 | Arun Anath Aiyer | Optical sensor for surface inspection and metrology |
US11703461B2 (en) | 2021-03-26 | 2023-07-18 | Arun Anath Aiyer | Optical sensor for surface inspection and metrology |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3788746A (en) * | 1972-10-02 | 1974-01-29 | Hewlett Packard Co | Optical dilatometer |
-
1972
- 1972-09-06 FR FR7231505A patent/FR2198636A5/fr not_active Expired
-
1973
- 1973-08-28 IT IT28274/73A patent/IT993790B/it active
- 1973-08-29 BE BE135045A patent/BE804146A/xx unknown
- 1973-09-05 DE DE19732344822 patent/DE2344822A1/de active Pending
- 1973-09-06 US US05/394,552 patent/US3930730A/en not_active Expired - Lifetime
- 1973-09-06 GB GB4207373A patent/GB1441664A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2198636A5 (it) | 1974-03-29 |
DE2344822A1 (de) | 1974-03-14 |
US3930730A (en) | 1976-01-06 |
GB1441664A (en) | 1976-07-07 |
BE804146A (fr) | 1973-12-17 |
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