BE804146A - Dispositif interferometrique pour mesurer les variations de longueur d'une eprouvette sous l'effet de la temperature - Google Patents

Dispositif interferometrique pour mesurer les variations de longueur d'une eprouvette sous l'effet de la temperature

Info

Publication number
BE804146A
BE804146A BE135045A BE135045A BE804146A BE 804146 A BE804146 A BE 804146A BE 135045 A BE135045 A BE 135045A BE 135045 A BE135045 A BE 135045A BE 804146 A BE804146 A BE 804146A
Authority
BE
Belgium
Prior art keywords
length
temperature
effect
specimen under
interferometric device
Prior art date
Application number
BE135045A
Other languages
English (en)
Original Assignee
France Etat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by France Etat filed Critical France Etat
Publication of BE804146A publication Critical patent/BE804146A/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/16—Investigating or analyzing materials by the use of thermal means by investigating thermal coefficient of expansion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
BE135045A 1972-09-06 1973-08-29 Dispositif interferometrique pour mesurer les variations de longueur d'une eprouvette sous l'effet de la temperature BE804146A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7231505A FR2198636A5 (fr) 1972-09-06 1972-09-06

Publications (1)

Publication Number Publication Date
BE804146A true BE804146A (fr) 1973-12-17

Family

ID=9103916

Family Applications (1)

Application Number Title Priority Date Filing Date
BE135045A BE804146A (fr) 1972-09-06 1973-08-29 Dispositif interferometrique pour mesurer les variations de longueur d'une eprouvette sous l'effet de la temperature

Country Status (6)

Country Link
US (1) US3930730A (fr)
BE (1) BE804146A (fr)
DE (1) DE2344822A1 (fr)
FR (1) FR2198636A5 (fr)
GB (1) GB1441664A (fr)
IT (1) IT993790B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107894440A (zh) * 2017-12-20 2018-04-10 沈阳建筑大学 一种混凝土热膨胀系数测量装置及测量方法

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US4147435A (en) * 1977-06-30 1979-04-03 International Business Machines Corporation Interferometric process and apparatus for the measurement of the etch rate of opaque surfaces
US4313679A (en) * 1979-11-29 1982-02-02 The United States Of America As Represented By The Secretary Of The Air Force Test sample support assembly
US4643577A (en) * 1983-07-15 1987-02-17 Wero Ohg Roth & Co. Length measuring apparatus based on the dual laser beam interferometer principle
US5350899A (en) * 1992-04-15 1994-09-27 Hiroichi Ishikawa Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber
US4579463A (en) * 1984-05-21 1986-04-01 Therma-Wave Partners Detecting thermal waves to evaluate thermal parameters
US4636088A (en) * 1984-05-21 1987-01-13 Therma-Wave, Inc. Method and apparatus for evaluating surface conditions of a sample
US4815856A (en) * 1986-06-05 1989-03-28 Storage Technology Partners Ii Method and apparatus for measuring the absolute thickness of dust defocus layers
US4823291A (en) * 1987-09-10 1989-04-18 Sensor Control, Inc. Radiometric measurement of wafer temperatures during deposition
US5121987A (en) * 1989-03-02 1992-06-16 Honeywell Inc. Method and apparatus for measuring coefficient of thermal expansion
JPH0640078B2 (ja) * 1989-08-21 1994-05-25 品川白煉瓦株式会社 セラミツクス等の熱間における変位測定装置
US5231285A (en) * 1991-06-28 1993-07-27 Honeywell Inc. Refraction index change measurement
US5290586A (en) * 1992-09-10 1994-03-01 International Business Machines Corporation Method to monitor Meta-Paete cure on metallized substrates
US5581351A (en) * 1994-02-22 1996-12-03 Eastman Kodak Company Optical monitor for measuring thermal expansion of a rotating roller
US5650852A (en) * 1996-03-08 1997-07-22 The Boeing Company Temperature-compensated laser measuring method and apparatus
US6681145B1 (en) * 1996-06-06 2004-01-20 The Boeing Company Method for improving the accuracy of machines
CN1221500B (zh) * 1996-06-06 2013-06-05 波音公司 改进精度的机床系统及其方法
US5949685A (en) * 1997-06-03 1999-09-07 The Boeing Company Real-time orientation of machine media to improve machine accuracy
US6049220A (en) 1998-06-10 2000-04-11 Boxer Cross Incorporated Apparatus and method for evaluating a wafer of semiconductor material
US6812047B1 (en) 2000-03-08 2004-11-02 Boxer Cross, Inc. Evaluating a geometric or material property of a multilayered structure
US6911349B2 (en) * 2001-02-16 2005-06-28 Boxer Cross Inc. Evaluating sidewall coverage in a semiconductor wafer
US6812717B2 (en) * 2001-03-05 2004-11-02 Boxer Cross, Inc Use of a coefficient of a power curve to evaluate a semiconductor wafer
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
US6971791B2 (en) * 2002-03-01 2005-12-06 Boxer Cross, Inc Identifying defects in a conductive structure of a wafer, based on heat transfer therethrough
US6878559B2 (en) * 2002-09-23 2005-04-12 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US6963393B2 (en) * 2002-09-23 2005-11-08 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
DE10309284B4 (de) * 2003-03-04 2006-07-20 Linseis Meßgeräte GmbH Dilatometer
US7164481B2 (en) * 2003-09-01 2007-01-16 Kabushiki Kaisha Ohara Coefficient of linear expansion measuring apparatus and coefficient of linear expansion measuring method
JP3908211B2 (ja) * 2003-09-01 2007-04-25 株式会社オハラ 線膨張係数測定装置及び線膨張係数測定方法
US11561080B2 (en) 2021-03-26 2023-01-24 Arun Anath Aiyer Optical sensor for surface inspection and metrology
US11442025B1 (en) * 2021-03-26 2022-09-13 Arun Anath Aiyer Optical sensor for surface inspection and metrology
US11703461B2 (en) 2021-03-26 2023-07-18 Arun Anath Aiyer Optical sensor for surface inspection and metrology

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3788746A (en) * 1972-10-02 1974-01-29 Hewlett Packard Co Optical dilatometer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107894440A (zh) * 2017-12-20 2018-04-10 沈阳建筑大学 一种混凝土热膨胀系数测量装置及测量方法
CN107894440B (zh) * 2017-12-20 2023-11-10 沈阳建筑大学 一种混凝土热膨胀系数测量装置及测量方法

Also Published As

Publication number Publication date
FR2198636A5 (fr) 1974-03-29
DE2344822A1 (de) 1974-03-14
US3930730A (en) 1976-01-06
IT993790B (it) 1975-09-30
GB1441664A (en) 1976-07-07

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