IT974672B - Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina - Google Patents

Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina

Info

Publication number
IT974672B
IT974672B IT31713/72A IT3171372A IT974672B IT 974672 B IT974672 B IT 974672B IT 31713/72 A IT31713/72 A IT 31713/72A IT 3171372 A IT3171372 A IT 3171372A IT 974672 B IT974672 B IT 974672B
Authority
IT
Italy
Prior art keywords
rare
built
heat sink
integrated circuits
resin container
Prior art date
Application number
IT31713/72A
Other languages
English (en)
Italian (it)
Inventor
G Cossutta
M Cellai
Original Assignee
Ates Componenti Elettronici So
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettronici So filed Critical Ates Componenti Elettronici So
Priority to IT31713/72A priority Critical patent/IT974672B/it
Priority to FR7340339A priority patent/FR2207356B1/fr
Priority to NL7315711A priority patent/NL7315711A/xx
Priority to DE2357350A priority patent/DE2357350C3/de
Priority to ES420805A priority patent/ES420805A1/es
Priority to GB5332473A priority patent/GB1446739A/en
Priority to JP48129110A priority patent/JPS501660A/ja
Application granted granted Critical
Publication of IT974672B publication Critical patent/IT974672B/it
Priority to US05/632,589 priority patent/US4066839A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
IT31713/72A 1972-11-16 1972-11-16 Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina IT974672B (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT31713/72A IT974672B (it) 1972-11-16 1972-11-16 Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina
FR7340339A FR2207356B1 (de) 1972-11-16 1973-11-13
NL7315711A NL7315711A (de) 1972-11-16 1973-11-15
DE2357350A DE2357350C3 (de) 1972-11-16 1973-11-16 Wärmeableitungskörper zum Einbringen ein einen integrierten Schaltkreis enthaltendes elektrisches Bauelement
ES420805A ES420805A1 (es) 1972-11-16 1973-11-16 Perfeccionamientos en los disipadores de calor y similares.
GB5332473A GB1446739A (en) 1972-11-16 1973-11-16 Method of manufacturing an integrated circuit device of the dual- in-line type
JP48129110A JPS501660A (de) 1972-11-16 1973-11-16
US05/632,589 US4066839A (en) 1972-11-16 1975-11-17 Molded body incorporating heat dissipator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT31713/72A IT974672B (it) 1972-11-16 1972-11-16 Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina

Publications (1)

Publication Number Publication Date
IT974672B true IT974672B (it) 1974-07-10

Family

ID=11234262

Family Applications (1)

Application Number Title Priority Date Filing Date
IT31713/72A IT974672B (it) 1972-11-16 1972-11-16 Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina

Country Status (7)

Country Link
JP (1) JPS501660A (de)
DE (1) DE2357350C3 (de)
ES (1) ES420805A1 (de)
FR (1) FR2207356B1 (de)
GB (1) GB1446739A (de)
IT (1) IT974672B (de)
NL (1) NL7315711A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651328Y2 (de) * 1976-08-18 1981-12-01
FR2495376A1 (fr) * 1980-12-02 1982-06-04 Thomson Csf Boitiers pour composants semiconducteurs de puissance a cosses de type faston
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento

Also Published As

Publication number Publication date
GB1446739A (en) 1976-08-18
NL7315711A (de) 1974-05-20
ES420805A1 (es) 1976-04-16
JPS501660A (de) 1975-01-09
DE2357350A1 (de) 1974-06-12
FR2207356B1 (de) 1976-11-19
FR2207356A1 (de) 1974-06-14
DE2357350C3 (de) 1980-01-24
DE2357350B2 (de) 1975-05-22

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