IT8823166A0 - Procedimento e dispositivo per l'analisi quantitativa e differenziale in profondita' di provini solidi con l'impiego di due raggi ionici - Google Patents
Procedimento e dispositivo per l'analisi quantitativa e differenziale in profondita' di provini solidi con l'impiego di due raggi ioniciInfo
- Publication number
 - IT8823166A0 IT8823166A0 IT8823166A IT2316688A IT8823166A0 IT 8823166 A0 IT8823166 A0 IT 8823166A0 IT 8823166 A IT8823166 A IT 8823166A IT 2316688 A IT2316688 A IT 2316688A IT 8823166 A0 IT8823166 A0 IT 8823166A0
 - Authority
 - IT
 - Italy
 - Prior art keywords
 - quantitative
 - differential
 - procedure
 - depth analysis
 - solid specimens
 - Prior art date
 
Links
- 238000010921 in-depth analysis Methods 0.000 title 1
 - 238000000034 method Methods 0.000 title 1
 - 239000007787 solid Substances 0.000 title 1
 
Classifications
- 
        
- G—PHYSICS
 - G01—MEASURING; TESTING
 - G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
 - G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
 - G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
 - G01N23/203—Measuring back scattering
 
 
Landscapes
- Chemical & Material Sciences (AREA)
 - Crystallography & Structural Chemistry (AREA)
 - Physics & Mathematics (AREA)
 - Health & Medical Sciences (AREA)
 - Life Sciences & Earth Sciences (AREA)
 - Analytical Chemistry (AREA)
 - Biochemistry (AREA)
 - General Health & Medical Sciences (AREA)
 - General Physics & Mathematics (AREA)
 - Immunology (AREA)
 - Pathology (AREA)
 - Analysing Materials By The Use Of Radiation (AREA)
 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| DE3803424A DE3803424C2 (de) | 1988-02-05 | 1988-02-05 | Verfahren zur quantitativen, tiefendifferentiellen Analyse fester Proben | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| IT8823166A0 true IT8823166A0 (it) | 1988-12-30 | 
| IT1230178B IT1230178B (it) | 1991-10-18 | 
Family
ID=6346682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| IT8823166A IT1230178B (it) | 1988-02-05 | 1988-12-30 | Procedimento e dispositivo per l'analisi quantitativa e differenziale in profondita' di provini solidi con l'impiego di due raggi ionici | 
Country Status (6)
| Country | Link | 
|---|---|
| US (1) | US4982090A (it) | 
| JP (1) | JP2740231B2 (it) | 
| DE (1) | DE3803424C2 (it) | 
| FR (1) | FR2626976B1 (it) | 
| GB (1) | GB2215909B (it) | 
| IT (1) | IT1230178B (it) | 
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| DE3803424C2 (de) | 1988-02-05 | 1995-05-18 | Gsf Forschungszentrum Umwelt | Verfahren zur quantitativen, tiefendifferentiellen Analyse fester Proben | 
| DE4028044A1 (de) * | 1990-09-05 | 1992-03-12 | Geesthacht Gkss Forschung | Verfahren und vorrichtung zur analyse und bestimmung der konzentration von elementen in vorbestimmten tiefen von objekten | 
| FR2681472B1 (fr) | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. | 
| FR2748851B1 (fr) | 1996-05-15 | 1998-08-07 | Commissariat Energie Atomique | Procede de realisation d'une couche mince de materiau semiconducteur | 
| US6291313B1 (en) | 1997-05-12 | 2001-09-18 | Silicon Genesis Corporation | Method and device for controlled cleaving process | 
| WO1998052216A1 (en) * | 1997-05-12 | 1998-11-19 | Silicon Genesis Corporation | A controlled cleavage process | 
| US6245161B1 (en) * | 1997-05-12 | 2001-06-12 | Silicon Genesis Corporation | Economical silicon-on-silicon hybrid wafer assembly | 
| US6033974A (en) | 1997-05-12 | 2000-03-07 | Silicon Genesis Corporation | Method for controlled cleaving process | 
| US20070122997A1 (en) * | 1998-02-19 | 2007-05-31 | Silicon Genesis Corporation | Controlled process and resulting device | 
| US6548382B1 (en) * | 1997-07-18 | 2003-04-15 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process | 
| FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions | 
| US6291326B1 (en) | 1998-06-23 | 2001-09-18 | Silicon Genesis Corporation | Pre-semiconductor process implant and post-process film separation | 
| US6255662B1 (en) * | 1998-10-27 | 2001-07-03 | Axcelis Technologies, Inc. | Rutherford backscattering detection for use in Ion implantation | 
| US6500732B1 (en) | 1999-08-10 | 2002-12-31 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses | 
| US6221740B1 (en) | 1999-08-10 | 2001-04-24 | Silicon Genesis Corporation | Substrate cleaving tool and method | 
| US6263941B1 (en) | 1999-08-10 | 2001-07-24 | Silicon Genesis Corporation | Nozzle for cleaving substrates | 
| AU6905000A (en) * | 1999-08-10 | 2001-03-05 | Silicon Genesis Corporation | A cleaving process to fabricate multilayered substrates using low implantation doses | 
| US6373070B1 (en) | 1999-10-12 | 2002-04-16 | Fei Company | Method apparatus for a coaxial optical microscope with focused ion beam | 
| FR2806527B1 (fr) * | 2000-03-20 | 2002-10-25 | Schlumberger Technologies Inc | Colonne a focalisation simultanee d'un faisceau de particules et d'un faisceau optique | 
| US6465776B1 (en) | 2000-06-02 | 2002-10-15 | Board Of Regents, The University Of Texas System | Mass spectrometer apparatus for analyzing multiple fluid samples concurrently | 
| FR2823599B1 (fr) | 2001-04-13 | 2004-12-17 | Commissariat Energie Atomique | Substrat demomtable a tenue mecanique controlee et procede de realisation | 
| US8187377B2 (en) * | 2002-10-04 | 2012-05-29 | Silicon Genesis Corporation | Non-contact etch annealing of strained layers | 
| FR2848336B1 (fr) * | 2002-12-09 | 2005-10-28 | Commissariat Energie Atomique | Procede de realisation d'une structure contrainte destinee a etre dissociee | 
| FR2856844B1 (fr) * | 2003-06-24 | 2006-02-17 | Commissariat Energie Atomique | Circuit integre sur puce de hautes performances | 
| FR2857953B1 (fr) | 2003-07-21 | 2006-01-13 | Commissariat Energie Atomique | Structure empilee, et procede pour la fabriquer | 
| FR2861497B1 (fr) * | 2003-10-28 | 2006-02-10 | Soitec Silicon On Insulator | Procede de transfert catastrophique d'une couche fine apres co-implantation | 
| US7354815B2 (en) * | 2003-11-18 | 2008-04-08 | Silicon Genesis Corporation | Method for fabricating semiconductor devices using strained silicon bearing material | 
| FR2889887B1 (fr) * | 2005-08-16 | 2007-11-09 | Commissariat Energie Atomique | Procede de report d'une couche mince sur un support | 
| FR2891281B1 (fr) | 2005-09-28 | 2007-12-28 | Commissariat Energie Atomique | Procede de fabrication d'un element en couches minces. | 
| JP5127148B2 (ja) * | 2006-03-16 | 2013-01-23 | 株式会社日立ハイテクノロジーズ | イオンビーム加工装置 | 
| US8293619B2 (en) | 2008-08-28 | 2012-10-23 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled propagation | 
| US9362439B2 (en) | 2008-05-07 | 2016-06-07 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region | 
| US7811900B2 (en) * | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process | 
| US8993410B2 (en) | 2006-09-08 | 2015-03-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions | 
| FR2910179B1 (fr) * | 2006-12-19 | 2009-03-13 | Commissariat Energie Atomique | PROCEDE DE FABRICATION DE COUCHES MINCES DE GaN PAR IMPLANTATION ET RECYCLAGE D'UN SUBSTRAT DE DEPART | 
| FR2922359B1 (fr) * | 2007-10-12 | 2009-12-18 | Commissariat Energie Atomique | Procede de fabrication d'une structure micro-electronique impliquant un collage moleculaire | 
| FR2925221B1 (fr) * | 2007-12-17 | 2010-02-19 | Commissariat Energie Atomique | Procede de transfert d'une couche mince | 
| US8330126B2 (en) * | 2008-08-25 | 2012-12-11 | Silicon Genesis Corporation | Race track configuration and method for wafering silicon solar substrates | 
| US8329557B2 (en) * | 2009-05-13 | 2012-12-11 | Silicon Genesis Corporation | Techniques for forming thin films by implantation with reduced channeling | 
| FR2947098A1 (fr) * | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince | 
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3415985A (en) * | 1962-11-28 | 1968-12-10 | Centre Nat Rech Scient | Ionic microanalyzer wherein secondary ions are emitted from a sample surface upon bombardment by neutral atoms | 
| NL7306378A (it) * | 1973-05-08 | 1974-11-12 | ||
| NL7317436A (nl) * | 1973-12-20 | 1975-06-24 | Philips Nv | Inrichting voor massa-analyse en structuur-analyse van een oppervlaklaag door middel van ionenver- strooiing. | 
| US3916190A (en) * | 1974-03-01 | 1975-10-28 | Minnesota Mining & Mfg | Depth profile analysis apparatus | 
| US4088895A (en) * | 1977-07-08 | 1978-05-09 | Martin Frederick Wight | Memory device utilizing ion beam readout | 
| DE3128814A1 (de) * | 1981-07-21 | 1983-02-10 | Siemens AG, 1000 Berlin und 8000 München | Elektrisch leitende probenhalterung fuer die analysentechnik der sekundaerionen-massenspektrometrie | 
| DE3475585D1 (en) * | 1984-09-27 | 1989-01-12 | Leybold Ag | Apparatus for the sputtered neutral mass spectrometry | 
| US4633084A (en) * | 1985-01-16 | 1986-12-30 | The United States Of America As Represented By The United States Department Of Energy | High efficiency direct detection of ions from resonance ionization of sputtered atoms | 
| IE58049B1 (en) * | 1985-05-21 | 1993-06-16 | Tekscan Ltd | Surface analysis microscopy apparatus | 
| DE3803424C2 (de) | 1988-02-05 | 1995-05-18 | Gsf Forschungszentrum Umwelt | Verfahren zur quantitativen, tiefendifferentiellen Analyse fester Proben | 
| JPH0739987B2 (ja) * | 1988-06-28 | 1995-05-01 | 川崎製鉄株式会社 | 皮膜の厚みと組成の同時測定方法 | 
- 
        1988
        
- 1988-02-05 DE DE3803424A patent/DE3803424C2/de not_active Expired - Fee Related
 - 1988-12-28 FR FR888817317A patent/FR2626976B1/fr not_active Expired - Fee Related
 - 1988-12-30 IT IT8823166A patent/IT1230178B/it active
 
 - 
        1989
        
- 1989-01-31 GB GB8902064A patent/GB2215909B/en not_active Expired - Lifetime
 - 1989-02-02 US US07/305,693 patent/US4982090A/en not_active Expired - Lifetime
 - 1989-02-06 JP JP1025956A patent/JP2740231B2/ja not_active Expired - Fee Related
 
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JP2740231B2 (ja) | 1998-04-15 | 
| JPH01217249A (ja) | 1989-08-30 | 
| GB2215909B (en) | 1992-09-16 | 
| GB2215909A (en) | 1989-09-27 | 
| IT1230178B (it) | 1991-10-18 | 
| FR2626976B1 (fr) | 1993-04-30 | 
| DE3803424A1 (de) | 1989-08-17 | 
| US4982090A (en) | 1991-01-01 | 
| FR2626976A1 (fr) | 1989-08-11 | 
| DE3803424C2 (de) | 1995-05-18 | 
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Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 | 
             Effective date: 19961219  |