IT8822842A0 - Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggio - Google Patents

Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggio

Info

Publication number
IT8822842A0
IT8822842A0 IT8822842A IT2284288A IT8822842A0 IT 8822842 A0 IT8822842 A0 IT 8822842A0 IT 8822842 A IT8822842 A IT 8822842A IT 2284288 A IT2284288 A IT 2284288A IT 8822842 A0 IT8822842 A0 IT 8822842A0
Authority
IT
Italy
Prior art keywords
diet
packaging
self
mounting
mounting structure
Prior art date
Application number
IT8822842A
Other languages
English (en)
Other versions
IT1227988B (it
Inventor
Harold Frank Webster
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IT8822842A0 publication Critical patent/IT8822842A0/it
Application granted granted Critical
Publication of IT1227988B publication Critical patent/IT1227988B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
IT8822842A 1987-12-04 1988-12-02 Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggio IT1227988B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/128,847 US4796156A (en) 1987-12-04 1987-12-04 Self packaging chip mount

Publications (2)

Publication Number Publication Date
IT8822842A0 true IT8822842A0 (it) 1988-12-02
IT1227988B IT1227988B (it) 1991-05-20

Family

ID=22437278

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8822842A IT1227988B (it) 1987-12-04 1988-12-02 Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggio

Country Status (3)

Country Link
US (1) US4796156A (it)
DE (1) DE3840834A1 (it)
IT (1) IT1227988B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016139A (en) * 1989-09-06 1991-05-14 Whelen Technologies, Inc. Electronic power supply with enhanced heat transfer characteristics
EP0463758A1 (en) * 1990-06-22 1992-01-02 Digital Equipment Corporation Hollow chip package and method of manufacture
WO1999023700A1 (en) 1997-11-05 1999-05-14 Martin Robert A Chip housing, methods of making same and methods for mounting chips therein
FR2788193B1 (fr) * 1999-01-05 2001-03-02 Francis David Procede de realisation d'un element electronique comportant un composant semi-conducteur a milieu isole et un radiateur
DE10200621B4 (de) * 2002-01-10 2005-03-24 Infineon Technologies Ag Modulträger mit einem Kontaktsockel
JP6762271B2 (ja) * 2017-06-26 2020-09-30 三菱電機株式会社 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780352A (en) * 1968-06-25 1973-12-18 J Redwanz Semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
US3629787A (en) * 1970-06-19 1971-12-21 Bell Telephone Labor Inc Connector for flexible circuitry
NL7610306A (nl) * 1976-09-16 1978-03-20 Du Pont Contactinrichting voor een geintegreerde schakeling.
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
ATE39787T1 (de) * 1982-09-09 1989-01-15 Siemens Ag Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.
JPS60115247A (ja) * 1983-11-28 1985-06-21 Fujitsu Ltd 半導体装置
GB2164213B (en) * 1984-09-06 1988-07-13 Nec Corp Structure for connecting leadless chip carrier
GB2169154B (en) * 1984-12-31 1989-01-18 Gen Electric Pressure-fit electrical socket for direct interconnection to a semiconductor chip
US4628406A (en) * 1985-05-20 1986-12-09 Tektronix, Inc. Method of packaging integrated circuit chips, and integrated circuit package
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
US4658331A (en) * 1985-09-09 1987-04-14 Tektronix, Inc. Mounting an integrated circuit chip to an etched circuit board
US4716494A (en) * 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink

Also Published As

Publication number Publication date
IT1227988B (it) 1991-05-20
US4796156A (en) 1989-01-03
DE3840834A1 (de) 1989-06-15

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