GB2169154B - Pressure-fit electrical socket for direct interconnection to a semiconductor chip - Google Patents
Pressure-fit electrical socket for direct interconnection to a semiconductor chipInfo
- Publication number
- GB2169154B GB2169154B GB8529187A GB8529187A GB2169154B GB 2169154 B GB2169154 B GB 2169154B GB 8529187 A GB8529187 A GB 8529187A GB 8529187 A GB8529187 A GB 8529187A GB 2169154 B GB2169154 B GB 2169154B
- Authority
- GB
- United Kingdom
- Prior art keywords
- pressure
- semiconductor chip
- electrical socket
- direct interconnection
- fit electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68768484A | 1984-12-31 | 1984-12-31 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8529187D0 GB8529187D0 (en) | 1986-01-02 |
GB2169154A GB2169154A (en) | 1986-07-02 |
GB2169154B true GB2169154B (en) | 1989-01-18 |
Family
ID=24761387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8529187A Expired GB2169154B (en) | 1984-12-31 | 1985-11-27 | Pressure-fit electrical socket for direct interconnection to a semiconductor chip |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS61259470A (en) |
DE (1) | DE3545560A1 (en) |
GB (1) | GB2169154B (en) |
MX (1) | MX159256A (en) |
SG (1) | SG37989G (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5322446A (en) * | 1993-04-09 | 1994-06-21 | Minnesota Mining And Manufacturing Company | Top load socket and carrier |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4658331A (en) * | 1985-09-09 | 1987-04-14 | Tektronix, Inc. | Mounting an integrated circuit chip to an etched circuit board |
US4783719A (en) * | 1987-01-20 | 1988-11-08 | Hughes Aircraft Company | Test connector for electrical devices |
US4859189A (en) * | 1987-09-25 | 1989-08-22 | Minnesota Mining And Manufacturing Company | Multipurpose socket |
JPH01122583A (en) * | 1987-11-05 | 1989-05-15 | Fujitsu Ltd | Measurement jig for semiconductor device |
US4796156A (en) * | 1987-12-04 | 1989-01-03 | General Electric Company | Self packaging chip mount |
JPH0746624B2 (en) * | 1992-12-10 | 1995-05-17 | 山一電機株式会社 | IC carrier socket |
US5468996A (en) * | 1994-03-25 | 1995-11-21 | International Business Machines Corporation | Electronic package assembly and connector for use therewith |
US5498970A (en) * | 1995-02-06 | 1996-03-12 | Minnesota Mining And Manufacturing | Top load socket for ball grid array devices |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1539470A (en) * | 1975-11-13 | 1979-01-31 | Tektronix Inc | Electrical connector |
US4420203A (en) * | 1981-06-04 | 1983-12-13 | International Business Machines Corporation | Semiconductor module circuit interconnection system |
-
1985
- 1985-11-27 GB GB8529187A patent/GB2169154B/en not_active Expired
- 1985-12-21 DE DE19853545560 patent/DE3545560A1/en not_active Withdrawn
- 1985-12-25 JP JP29968385A patent/JPS61259470A/en active Pending
- 1985-12-30 MX MX113385A patent/MX159256A/en unknown
-
1989
- 1989-06-16 SG SG37989A patent/SG37989G/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5322446A (en) * | 1993-04-09 | 1994-06-21 | Minnesota Mining And Manufacturing Company | Top load socket and carrier |
Also Published As
Publication number | Publication date |
---|---|
GB8529187D0 (en) | 1986-01-02 |
DE3545560A1 (en) | 1986-07-10 |
SG37989G (en) | 1989-12-22 |
MX159256A (en) | 1989-05-09 |
JPS61259470A (en) | 1986-11-17 |
GB2169154A (en) | 1986-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2192495B (en) | Leadless chip carrier socket | |
GB2164213B (en) | Structure for connecting leadless chip carrier | |
EP0221399A3 (en) | Semiconductor power module | |
DE3664022D1 (en) | Packaged semiconductor chip | |
DE3172625D1 (en) | Connection part for removably connecting a semiconductor chip to said part | |
GB2156616B (en) | A semiconductor integrated circuit | |
EP0228279A3 (en) | Plug-in socket assembly for integrated circuit package | |
EP0190027A3 (en) | Semiconductor integrated circuit | |
EP0205746A3 (en) | Semiconductor power module comprising a ceramic substrate | |
EP0146242A3 (en) | An electrical connector for a chip carrier | |
EP0256494A3 (en) | Activatable conductive links for semiconductor devices | |
GB2123606B (en) | Pin type semiconductor photoelectric conversion device | |
DE3370240D1 (en) | Bonding leads to semiconductor devices | |
GB2188797B (en) | Chip connector | |
EP0192456A3 (en) | Semiconductor integrated circuit | |
GB8522166D0 (en) | Encapsulating semiconductor components | |
GB2183408B (en) | Connector for leadless chip | |
GB2168842B (en) | Integrated semiconductor power devices | |
EP0205936A3 (en) | Semiconductor integrated circuit | |
GB8506111D0 (en) | Encapsulating semiconductor components | |
GB2169154B (en) | Pressure-fit electrical socket for direct interconnection to a semiconductor chip | |
GB8431490D0 (en) | Electrical contact to semiconductor devices | |
EP0072938A3 (en) | Method of connecting a semiconductor chip to a chip carrier | |
EP0190077A3 (en) | A package structure for a semiconductor chip | |
HK84189A (en) | Pressure-fit electrical socket for direct interconnection to a semiconductor chip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |