IT1227988B - Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggio - Google Patents
Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggioInfo
- Publication number
- IT1227988B IT1227988B IT8822842A IT2284288A IT1227988B IT 1227988 B IT1227988 B IT 1227988B IT 8822842 A IT8822842 A IT 8822842A IT 2284288 A IT2284288 A IT 2284288A IT 1227988 B IT1227988 B IT 1227988B
- Authority
- IT
- Italy
- Prior art keywords
- self
- integrated circuit
- circuit plates
- assembly structure
- assembly method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/128,847 US4796156A (en) | 1987-12-04 | 1987-12-04 | Self packaging chip mount |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8822842A0 IT8822842A0 (it) | 1988-12-02 |
IT1227988B true IT1227988B (it) | 1991-05-20 |
Family
ID=22437278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8822842A IT1227988B (it) | 1987-12-04 | 1988-12-02 | Struttura di montaggio autoimpaccante di piastrine di circuiti integrati e relativo metodo di montaggio |
Country Status (3)
Country | Link |
---|---|
US (1) | US4796156A (it) |
DE (1) | DE3840834A1 (it) |
IT (1) | IT1227988B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5016139A (en) * | 1989-09-06 | 1991-05-14 | Whelen Technologies, Inc. | Electronic power supply with enhanced heat transfer characteristics |
EP0463758A1 (en) * | 1990-06-22 | 1992-01-02 | Digital Equipment Corporation | Hollow chip package and method of manufacture |
AU1310399A (en) | 1997-11-05 | 1999-05-24 | Robert A. Martin | Chip housing, methods of making same and methods for mounting chips therein |
FR2788193B1 (fr) * | 1999-01-05 | 2001-03-02 | Francis David | Procede de realisation d'un element electronique comportant un composant semi-conducteur a milieu isole et un radiateur |
DE10200621B4 (de) * | 2002-01-10 | 2005-03-24 | Infineon Technologies Ag | Modulträger mit einem Kontaktsockel |
JP6762271B2 (ja) * | 2017-06-26 | 2020-09-30 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3780352A (en) * | 1968-06-25 | 1973-12-18 | J Redwanz | Semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films |
US3629787A (en) * | 1970-06-19 | 1971-12-21 | Bell Telephone Labor Inc | Connector for flexible circuitry |
NL7610306A (nl) * | 1976-09-16 | 1978-03-20 | Du Pont | Contactinrichting voor een geintegreerde schakeling. |
US4251852A (en) * | 1979-06-18 | 1981-02-17 | International Business Machines Corporation | Integrated circuit package |
US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
DE3378870D1 (en) * | 1982-09-09 | 1989-02-09 | Siemens Ag | Cooling device for a plurality of integrated components assembled as a flat structure |
JPS60115247A (ja) * | 1983-11-28 | 1985-06-21 | Fujitsu Ltd | 半導体装置 |
GB2164213B (en) * | 1984-09-06 | 1988-07-13 | Nec Corp | Structure for connecting leadless chip carrier |
GB2169154B (en) * | 1984-12-31 | 1989-01-18 | Gen Electric | Pressure-fit electrical socket for direct interconnection to a semiconductor chip |
US4628406A (en) * | 1985-05-20 | 1986-12-09 | Tektronix, Inc. | Method of packaging integrated circuit chips, and integrated circuit package |
US4647959A (en) * | 1985-05-20 | 1987-03-03 | Tektronix, Inc. | Integrated circuit package, and method of forming an integrated circuit package |
US4658331A (en) * | 1985-09-09 | 1987-04-14 | Tektronix, Inc. | Mounting an integrated circuit chip to an etched circuit board |
US4716494A (en) * | 1986-11-07 | 1987-12-29 | Amp Incorporated | Retention system for removable heat sink |
-
1987
- 1987-12-04 US US07/128,847 patent/US4796156A/en not_active Expired - Fee Related
-
1988
- 1988-12-02 IT IT8822842A patent/IT1227988B/it active
- 1988-12-03 DE DE3840834A patent/DE3840834A1/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
US4796156A (en) | 1989-01-03 |
IT8822842A0 (it) | 1988-12-02 |
DE3840834A1 (de) | 1989-06-15 |
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