IT8822335A0 - Procedimento e dispositivo per la preparazione di rondelle con almeno una superficie piana. - Google Patents

Procedimento e dispositivo per la preparazione di rondelle con almeno una superficie piana.

Info

Publication number
IT8822335A0
IT8822335A0 IT8822335A IT2233588A IT8822335A0 IT 8822335 A0 IT8822335 A0 IT 8822335A0 IT 8822335 A IT8822335 A IT 8822335A IT 2233588 A IT2233588 A IT 2233588A IT 8822335 A0 IT8822335 A0 IT 8822335A0
Authority
IT
Italy
Prior art keywords
washers
procedure
preparation
flat surface
flat
Prior art date
Application number
IT8822335A
Other languages
English (en)
Other versions
IT1229933B (it
Inventor
Fritz Feldmeier
Original Assignee
Mueller Georg Nuernberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mueller Georg Nuernberg filed Critical Mueller Georg Nuernberg
Publication of IT8822335A0 publication Critical patent/IT8822335A0/it
Application granted granted Critical
Publication of IT1229933B publication Critical patent/IT1229933B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
    • B23P23/02—Machine tools for performing different machining operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49792—Dividing through modified portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5176—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5176—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means
    • Y10T29/5177—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means and work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mining & Mineral Resources (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
IT8822335A 1987-11-05 1988-10-17 Procedimento e dispositivo per la preparazione di rondelle con almeno una superficie piana. IT1229933B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3737540A DE3737540C1 (de) 1987-11-05 1987-11-05 Verfahren und Maschine zum Herstellen von Ronden mit zumindest einer planen Oberflaeche

Publications (2)

Publication Number Publication Date
IT8822335A0 true IT8822335A0 (it) 1988-10-17
IT1229933B IT1229933B (it) 1991-09-16

Family

ID=6339832

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8822335A IT1229933B (it) 1987-11-05 1988-10-17 Procedimento e dispositivo per la preparazione di rondelle con almeno una superficie piana.

Country Status (7)

Country Link
US (2) US4881518A (it)
JP (1) JPH01153259A (it)
KR (1) KR890008921A (it)
DE (1) DE3737540C1 (it)
FR (1) FR2622820A1 (it)
GB (1) GB2212081B (it)
IT (1) IT1229933B (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111622A (en) * 1989-05-18 1992-05-12 Silicon Technology Corporation Slicing and grinding system for a wafer slicing machine
JP2667520B2 (ja) * 1989-06-29 1997-10-27 株式会社東京精密 スライシングマシンの誤差補正方法
JPH0767692B2 (ja) * 1989-09-07 1995-07-26 株式会社東京精密 スライシングマシンの切断方法
US5185956A (en) * 1990-05-18 1993-02-16 Silicon Technology Corporation Wafer slicing and grinding system
US5189843A (en) * 1990-08-30 1993-03-02 Silicon Technology Corporation Wafer slicing and grinding machine and a method of slicing and grinding wafers
DE4134110A1 (de) * 1991-10-15 1993-04-22 Wacker Chemitronic Verfahren zum rotationssaegen sproedharter werkstoffe, insbesondere solcher mit durchmessern ueber 200 mm in duenne scheiben vermittels innenlochsaege und vorrichtung zur durchfuehrung des verfahrens
DE4136566C1 (it) * 1991-11-07 1993-04-22 Gmn Georg Mueller Nuernberg Ag, 8500 Nuernberg, De
DE4224395A1 (de) * 1992-07-23 1994-01-27 Wacker Chemitronic Halbleiterscheiben mit definiert geschliffener Verformung und Verfahren zu ihrer Herstellung
DE19607695A1 (de) * 1996-02-29 1997-09-04 Wacker Siltronic Halbleitermat Verfahren zur Herstellung von Halbleiterscheiben
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
CN116117619B (zh) * 2022-12-30 2023-10-13 江苏福旭科技有限公司 一种太阳能级单晶硅片表面处理设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382257A (en) * 1943-04-21 1945-08-14 Albert Ramsay Manufacture of piezoelectric oscillator blanks
US2865082A (en) * 1953-07-16 1958-12-23 Sylvania Electric Prod Semiconductor mount and method
US3154990A (en) * 1962-03-16 1964-11-03 Sylvania Electric Prod Slicing apparatus having a rotary internal peripheral faced saw blade
US3828758A (en) * 1972-09-27 1974-08-13 P Cary Machine for producing thin section specimens
JPS51140285A (en) * 1975-05-30 1976-12-03 Hitachi Metals Ltd Crystal processing method
US4228782A (en) * 1978-09-08 1980-10-21 Rca Corporation System for regulating the applied blade-to-boule force during the slicing of wafers
US4227348A (en) * 1978-12-26 1980-10-14 Rca Corporation Method of slicing a wafer
FR2469259A1 (fr) * 1979-08-08 1981-05-22 Radiotechnique Compelec Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede
CH635769A5 (fr) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies Installation pour le sciage de plaques et dispositif de manutention pour une telle installation.
JPS57168854A (en) * 1981-04-05 1982-10-18 Tokyo Seimitsu Co Ltd Slicing device
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
US4663890A (en) * 1982-05-18 1987-05-12 Gmn Georg Muller Nurnberg Gmbh Method for machining workpieces of brittle hard material into wafers
JPS6213305A (ja) * 1985-07-12 1987-01-22 株式会社日立製作所 ワ−ク回転式切断法およびその装置
JPS6296400A (ja) * 1985-10-23 1987-05-02 Mitsubishi Metal Corp ウエハの製造方法
EP0242489B1 (de) * 1986-04-17 1991-07-10 Maschinenfabrik Meyer & Burger AG Verfahren zum Trennen eines Stabes in Teilstücke, Trennschleifmaschine zur Durchführung dieses Verfahrens und Verwendung dieser Trennschleifmaschine
DE3613132A1 (de) * 1986-04-18 1987-10-22 Mueller Georg Nuernberg Verfahren zum zerteilen von harten, nichtmetallischen werkstoffen
US4852304A (en) * 1987-10-29 1989-08-01 Tokyo Seimtsu Co., Ltd. Apparatus and method for slicing a wafer

Also Published As

Publication number Publication date
US4881518A (en) 1989-11-21
FR2622820A1 (fr) 1989-05-12
US4967461A (en) 1990-11-06
KR890008921A (ko) 1989-07-13
JPH01153259A (ja) 1989-06-15
DE3737540C1 (de) 1989-06-22
IT1229933B (it) 1991-09-16
GB2212081B (en) 1991-10-16
GB2212081A (en) 1989-07-19
GB8825807D0 (en) 1988-12-07

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951030