IT8023809A0 - UNIVERSAL INTERNAL CONNECTION ASSEMBLY FOR HIGH DENSITY CMOS/SOS INTEGRATED CIRCUITS. - Google Patents

UNIVERSAL INTERNAL CONNECTION ASSEMBLY FOR HIGH DENSITY CMOS/SOS INTEGRATED CIRCUITS.

Info

Publication number
IT8023809A0
IT8023809A0 IT8023809A IT2380980A IT8023809A0 IT 8023809 A0 IT8023809 A0 IT 8023809A0 IT 8023809 A IT8023809 A IT 8023809A IT 2380980 A IT2380980 A IT 2380980A IT 8023809 A0 IT8023809 A0 IT 8023809A0
Authority
IT
Italy
Prior art keywords
high density
integrated circuits
connection assembly
internal connection
universal internal
Prior art date
Application number
IT8023809A
Other languages
Italian (it)
Other versions
IT1131790B (en
Inventor
Andrew Gordon Francis Dingwall
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of IT8023809A0 publication Critical patent/IT8023809A0/en
Application granted granted Critical
Publication of IT1131790B publication Critical patent/IT1131790B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT23809/80A 1979-08-20 1980-07-30 UNIVERSAL INTERNAL CONNECTION COMPLEX FOR HIGH DENSITY CMOS / SOS INTEGRATED CIRCUITS IT1131790B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6814879A 1979-08-20 1979-08-20

Publications (2)

Publication Number Publication Date
IT8023809A0 true IT8023809A0 (en) 1980-07-30
IT1131790B IT1131790B (en) 1986-06-25

Family

ID=22080712

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23809/80A IT1131790B (en) 1979-08-20 1980-07-30 UNIVERSAL INTERNAL CONNECTION COMPLEX FOR HIGH DENSITY CMOS / SOS INTEGRATED CIRCUITS

Country Status (5)

Country Link
JP (1) JPS5632770A (en)
DE (1) DE3030753A1 (en)
FR (1) FR2463977A1 (en)
GB (1) GB2056771B (en)
IT (1) IT1131790B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138950A1 (en) * 1981-09-30 1983-04-14 Siemens AG, 1000 Berlin und 8000 München Integrated semi-conductor memory
JPS61127174A (en) * 1984-11-26 1986-06-14 Toshiba Corp Manufacture of semiconductor device
DE19604776A1 (en) * 1996-02-09 1997-08-14 Siemens Ag Detachable connecting bridge (fuse) and connectable line interruption (anti-fuse), as well as methods for producing and activating a fuse and an anti-fuse

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443176A (en) * 1966-03-31 1969-05-06 Ibm Low resistivity semiconductor underpass connector and fabrication method therefor
US3958266A (en) * 1974-04-19 1976-05-18 Rca Corporation Deep depletion insulated gate field effect transistors
CA1040321A (en) * 1974-07-23 1978-10-10 Alfred C. Ipri Polycrystalline silicon resistive device for integrated circuits and method for making same
JPS52139388A (en) * 1976-05-17 1977-11-21 Matsushita Electric Ind Co Ltd Mos type semiconductor device

Also Published As

Publication number Publication date
FR2463977A1 (en) 1981-02-27
JPH0478011B2 (en) 1992-12-10
JPS5632770A (en) 1981-04-02
IT1131790B (en) 1986-06-25
GB2056771B (en) 1983-10-19
GB2056771A (en) 1981-03-18
FR2463977B1 (en) 1983-02-04
DE3030753A1 (en) 1981-03-12

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