IT7926278A0 - Gruppo trasduttore di pressione a semi-conduttori. - Google Patents
Gruppo trasduttore di pressione a semi-conduttori.Info
- Publication number
- IT7926278A0 IT7926278A0 IT7926278A IT2627879A IT7926278A0 IT 7926278 A0 IT7926278 A0 IT 7926278A0 IT 7926278 A IT7926278 A IT 7926278A IT 2627879 A IT2627879 A IT 2627879A IT 7926278 A0 IT7926278 A0 IT 7926278A0
- Authority
- IT
- Italy
- Prior art keywords
- semi
- pressure transducer
- transducer assembly
- conductor pressure
- conductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12254078A JPS5550668A (en) | 1978-10-06 | 1978-10-06 | Semiconductor pressure converter |
Publications (1)
Publication Number | Publication Date |
---|---|
IT7926278A0 true IT7926278A0 (it) | 1979-10-05 |
Family
ID=14838386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT7926278A IT7926278A0 (it) | 1978-10-06 | 1979-10-05 | Gruppo trasduttore di pressione a semi-conduttori. |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5550668A (it) |
AU (1) | AU5117679A (it) |
DE (1) | DE2940497A1 (it) |
FR (1) | FR2438264A1 (it) |
GB (1) | GB2034970A (it) |
IT (1) | IT7926278A0 (it) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57142533A (en) * | 1981-02-27 | 1982-09-03 | Mitsubishi Electric Corp | Pressure sensor |
JPS6056244U (ja) * | 1983-09-26 | 1985-04-19 | 住友電気工業株式会社 | 半導体圧力センサ |
JPS60149369A (ja) * | 1984-01-14 | 1985-08-06 | Hitoshi Nagaoka | 霊芝菌糸体エキスおよびその製造方法 |
GB2229816B (en) * | 1989-03-31 | 1992-11-18 | Stc Plc | Pressure sensor |
JPH0465643A (ja) * | 1990-07-05 | 1992-03-02 | Mitsubishi Electric Corp | 半導体圧力センサ及びその製造方法 |
DE4309917A1 (de) * | 1992-03-30 | 1993-10-07 | Awa Microelectronics | Verfahren zur Herstellung von Siliziummikrostrukturen sowie Siliziummikrostruktur |
AU660358B2 (en) * | 1992-03-30 | 1995-06-22 | Awa Microelectronics Pty Limited | Silicon transducer |
US6647794B1 (en) * | 2002-05-06 | 2003-11-18 | Rosemount Inc. | Absolute pressure sensor |
TWI583931B (zh) * | 2016-02-02 | 2017-05-21 | Asia Pacific Microsystems Inc | Miniature piezoresistive pressure sensor |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL162254B (nl) * | 1968-11-29 | 1979-11-15 | Philips Nv | Halfgeleiderinrichting voor het omzetten van mechanische spanningen in elektrische signalen en werkwijze voor het vervaardigen daarvan. |
US3819431A (en) * | 1971-10-05 | 1974-06-25 | Kulite Semiconductor Products | Method of making transducers employing integral protective coatings and supports |
JPS5217780A (en) * | 1975-07-04 | 1977-02-09 | Hitachi Ltd | Pressure convertor with semi-conductor elements |
JPS52127257A (en) * | 1976-04-19 | 1977-10-25 | Hitachi Ltd | Displacement converter |
-
1978
- 1978-10-06 JP JP12254078A patent/JPS5550668A/ja active Pending
-
1979
- 1979-09-25 AU AU51176/79A patent/AU5117679A/en not_active Abandoned
- 1979-10-04 FR FR7924695A patent/FR2438264A1/fr not_active Withdrawn
- 1979-10-04 GB GB7934401A patent/GB2034970A/en not_active Withdrawn
- 1979-10-05 DE DE19792940497 patent/DE2940497A1/de not_active Withdrawn
- 1979-10-05 IT IT7926278A patent/IT7926278A0/it unknown
Also Published As
Publication number | Publication date |
---|---|
GB2034970A (en) | 1980-06-11 |
FR2438264A1 (fr) | 1980-04-30 |
DE2940497A1 (de) | 1980-04-10 |
JPS5550668A (en) | 1980-04-12 |
AU5117679A (en) | 1980-04-17 |
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