IT201800003535A1 - Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico - Google Patents

Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico

Info

Publication number
IT201800003535A1
IT201800003535A1 IT102018000003535A IT201800003535A IT201800003535A1 IT 201800003535 A1 IT201800003535 A1 IT 201800003535A1 IT 102018000003535 A IT102018000003535 A IT 102018000003535A IT 201800003535 A IT201800003535 A IT 201800003535A IT 201800003535 A1 IT201800003535 A1 IT 201800003535A1
Authority
IT
Italy
Prior art keywords
distributable
chemical composition
filler material
low levels
high amount
Prior art date
Application number
IT102018000003535A
Other languages
English (en)
Italian (it)
Inventor
Paolo Vacca
Gaetano Campanella
Emiliano Bertinotti
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Priority to IT102018000003535A priority Critical patent/IT201800003535A1/it
Priority to EP19715225.9A priority patent/EP3559089B1/en
Priority to US16/468,384 priority patent/US10954387B2/en
Priority to CN201980001036.2A priority patent/CN110494473B/zh
Priority to JP2019542731A priority patent/JP7199363B2/ja
Priority to KR1020197023191A priority patent/KR102498509B1/ko
Priority to PCT/IB2019/051977 priority patent/WO2019175755A1/en
Priority to TW108108437A priority patent/TWI766150B/zh
Publication of IT201800003535A1 publication Critical patent/IT201800003535A1/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2203—Oxides; Hydroxides of metals of lithium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
IT102018000003535A 2018-03-14 2018-03-14 Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico IT201800003535A1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT102018000003535A IT201800003535A1 (it) 2018-03-14 2018-03-14 Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico
EP19715225.9A EP3559089B1 (en) 2018-03-14 2019-03-12 Dispensable chemical composition with high amount of filler materials and low thixotropic index levels
US16/468,384 US10954387B2 (en) 2018-03-14 2019-03-12 Dispensable chemical composition with high amount of filler materials and low thixotropic index levels
CN201980001036.2A CN110494473B (zh) 2018-03-14 2019-03-12 具有大量填料材料和低触变指数水平的可分配化学组合物
JP2019542731A JP7199363B2 (ja) 2018-03-14 2019-03-12 高含量のフィラー材料及び低チクソトロピックインデックスレベルの分配可能な化学組成物
KR1020197023191A KR102498509B1 (ko) 2018-03-14 2019-03-12 다량의 충전제 물질 및 낮은 요변성 지수 수준을 갖는 분배가능한 화학적 조성물
PCT/IB2019/051977 WO2019175755A1 (en) 2018-03-14 2019-03-12 Dispensable chemical composition with high amount of filler materials and low thixotropic index levels
TW108108437A TWI766150B (zh) 2018-03-14 2019-03-13 具有大量填充材料和低觸變指數水平的可分配化學組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102018000003535A IT201800003535A1 (it) 2018-03-14 2018-03-14 Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico

Publications (1)

Publication Number Publication Date
IT201800003535A1 true IT201800003535A1 (it) 2019-09-14

Family

ID=62167846

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102018000003535A IT201800003535A1 (it) 2018-03-14 2018-03-14 Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico

Country Status (8)

Country Link
US (1) US10954387B2 (enExample)
EP (1) EP3559089B1 (enExample)
JP (1) JP7199363B2 (enExample)
KR (1) KR102498509B1 (enExample)
CN (1) CN110494473B (enExample)
IT (1) IT201800003535A1 (enExample)
TW (1) TWI766150B (enExample)
WO (1) WO2019175755A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021178119A1 (en) * 2020-03-05 2021-09-10 Dow Global Technologies Llc Shear thinning thermally conductive silicone compositions
WO2024242157A1 (ja) * 2023-05-23 2024-11-28 デンカ株式会社 放熱グリース

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922470A (en) * 1993-12-22 1999-07-13 Schering-Plough Healthcare Products, Inc. Soft polysiloxanes having a pressure sensitive adhesive
EP1788031A1 (en) * 2005-11-22 2007-05-23 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone rubber composition
WO2011117094A1 (en) * 2010-03-22 2011-09-29 Saes Getters S.P.A. Composition for the protection of moisture sensitive devices

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1230192A (en) * 1984-03-23 1987-12-08 Loretta A. Kroupa Liquid curable polyorganosiloxane compositions
US6448329B1 (en) * 2001-02-28 2002-09-10 Dow Corning Corporation Silicone composition and thermally conductive cured silicone product
US6623864B1 (en) * 2003-01-13 2003-09-23 Dow Corning Corporation Silicone composition useful in flame retardant applications
KR101082311B1 (ko) * 2003-02-04 2011-11-11 다우 코닝 코포레이션 피복 조성물 및 이로 피복된 직물
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4900584B2 (ja) * 2005-11-28 2012-03-21 信越化学工業株式会社 熱定着ロール又は定着ベルト
KR101264438B1 (ko) * 2005-11-28 2013-05-14 신에쓰 가가꾸 고교 가부시끼가이샤 열 정착 롤 또는 정착 벨트
TW200833752A (en) * 2006-10-23 2008-08-16 Lord Corp Highly filled polymer materials
KR20110090996A (ko) * 2008-10-31 2011-08-10 다우 코닝 코포레이션 광전지 모듈 및 이의 형성 방법
ITMI20120999A1 (it) 2012-06-08 2013-12-09 Getters Spa Composizione essiccante contenente polveri di ossidi metallici modificate in superficie utili per la fabbricazione e la protezione di dispositivi sensibili all'umidità
KR102250406B1 (ko) 2013-03-14 2021-05-12 다우 실리콘즈 코포레이션 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스
JP6525733B2 (ja) * 2014-06-04 2019-06-05 キヤノン株式会社 定着部材とその製造方法、定着装置および電子写真画像形成装置
US10269670B2 (en) * 2015-06-24 2019-04-23 Sumitomo Osaka Cement Co., Ltd. Curable silicone resin composition, silicone resin composite, photosemiconductor light emitting device, luminaire and liquid crystal imaging device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922470A (en) * 1993-12-22 1999-07-13 Schering-Plough Healthcare Products, Inc. Soft polysiloxanes having a pressure sensitive adhesive
EP1788031A1 (en) * 2005-11-22 2007-05-23 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone rubber composition
WO2011117094A1 (en) * 2010-03-22 2011-09-29 Saes Getters S.P.A. Composition for the protection of moisture sensitive devices

Also Published As

Publication number Publication date
TWI766150B (zh) 2022-06-01
TW201938663A (zh) 2019-10-01
US20200062961A1 (en) 2020-02-27
KR102498509B1 (ko) 2023-02-10
JP2021515814A (ja) 2021-06-24
JP7199363B2 (ja) 2023-01-05
CN110494473A (zh) 2019-11-22
US10954387B2 (en) 2021-03-23
KR20200133173A (ko) 2020-11-26
EP3559089A1 (en) 2019-10-30
CN110494473B (zh) 2023-01-17
EP3559089B1 (en) 2023-01-25
WO2019175755A1 (en) 2019-09-19

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