IT1402879B1 - Dispositivo igbt con regioni di emettitore sepolte - Google Patents

Dispositivo igbt con regioni di emettitore sepolte

Info

Publication number
IT1402879B1
IT1402879B1 ITMI2010A002146A ITMI20102146A IT1402879B1 IT 1402879 B1 IT1402879 B1 IT 1402879B1 IT MI2010A002146 A ITMI2010A002146 A IT MI2010A002146A IT MI20102146 A ITMI20102146 A IT MI20102146A IT 1402879 B1 IT1402879 B1 IT 1402879B1
Authority
IT
Italy
Prior art keywords
regulations
igbt device
emitters
buried
buried emitters
Prior art date
Application number
ITMI2010A002146A
Other languages
English (en)
Inventor
Davide Giuseppe Patti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITMI2010A002146A priority Critical patent/IT1402879B1/it
Priority to US13/300,010 priority patent/US8878594B2/en
Priority to EP11189781.5A priority patent/EP2455972B1/en
Publication of ITMI20102146A1 publication Critical patent/ITMI20102146A1/it
Application granted granted Critical
Publication of IT1402879B1 publication Critical patent/IT1402879B1/it
Priority to US14/496,937 priority patent/US9196714B2/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395Vertical transistors, e.g. vertical IGBT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0804Emitter regions of bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/083Anode or cathode regions of thyristors or gated bipolar-mode devices
    • H01L29/0834Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095Body region, i.e. base region, of DMOS transistors or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66325Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
    • H01L29/66333Vertical insulated gate bipolar transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
ITMI2010A002146A 2010-11-19 2010-11-19 Dispositivo igbt con regioni di emettitore sepolte IT1402879B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
ITMI2010A002146A IT1402879B1 (it) 2010-11-19 2010-11-19 Dispositivo igbt con regioni di emettitore sepolte
US13/300,010 US8878594B2 (en) 2010-11-19 2011-11-18 IGBT device with buried emitter regions
EP11189781.5A EP2455972B1 (en) 2010-11-19 2011-11-18 IGBT device with buried emitter regions
US14/496,937 US9196714B2 (en) 2010-11-19 2014-09-25 IGBT device with buried emitter regions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2010A002146A IT1402879B1 (it) 2010-11-19 2010-11-19 Dispositivo igbt con regioni di emettitore sepolte

Publications (2)

Publication Number Publication Date
ITMI20102146A1 ITMI20102146A1 (it) 2012-05-20
IT1402879B1 true IT1402879B1 (it) 2013-09-27

Family

ID=43742759

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A002146A IT1402879B1 (it) 2010-11-19 2010-11-19 Dispositivo igbt con regioni di emettitore sepolte

Country Status (3)

Country Link
US (2) US8878594B2 (it)
EP (1) EP2455972B1 (it)
IT (1) IT1402879B1 (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9041096B2 (en) * 2013-04-16 2015-05-26 Rohm Co., Ltd. Superjunction semiconductor device and manufacturing method therefor
US9520492B2 (en) * 2015-02-18 2016-12-13 Macronix International Co., Ltd. Semiconductor device having buried layer
US10063048B2 (en) * 2015-12-30 2018-08-28 Silicon Laboratories Inc. Dynamic trigger voltage control for an ESD protection device
DE102016015475B3 (de) * 2016-12-28 2018-01-11 3-5 Power Electronics GmbH IGBT Halbleiterstruktur
US11728422B2 (en) * 2019-11-14 2023-08-15 Stmicroelectronics S.R.L. Power MOSFET device having improved safe-operating area and on resistance, manufacturing process thereof and operating method thereof
IT202000015076A1 (it) 2020-06-23 2021-12-23 St Microelectronics Srl Dispositivo elettronico in 4h-sic con prestazioni di corto circuito migliorate, e relativo metodo di fabbricazione

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4303841A (en) * 1979-05-21 1981-12-01 Exxon Research & Engineering Co. VMOS/Bipolar power switch
US4395723A (en) * 1980-05-27 1983-07-26 Eliyahou Harari Floating substrate dynamic RAM cell with lower punch-through means
US4782379A (en) * 1981-11-23 1988-11-01 General Electric Company Semiconductor device having rapid removal of majority carriers from an active base region thereof at device turn-off and method of fabricating this device
JPS61180472A (ja) * 1985-02-05 1986-08-13 Mitsubishi Electric Corp 半導体装置
JP2579928B2 (ja) * 1987-02-26 1997-02-12 株式会社東芝 半導体素子およびその製造方法
US5198688A (en) * 1989-03-06 1993-03-30 Fuji Electric Co., Ltd. Semiconductor device provided with a conductivity modulation MISFET
US5055721A (en) * 1989-04-13 1991-10-08 Mitsubishi Denki Kabushiki Kaisha Drive circuit for igbt device
JPH0548111A (ja) * 1991-08-12 1993-02-26 Toshiba Corp 半導体装置およびその製造方法
JP3203814B2 (ja) * 1992-10-19 2001-08-27 富士電機株式会社 半導体装置
JP3163850B2 (ja) * 1993-03-23 2001-05-08 富士電機株式会社 半導体装置
US5548133A (en) * 1994-09-19 1996-08-20 International Rectifier Corporation IGBT with increased ruggedness
US5538908A (en) * 1995-04-27 1996-07-23 Lg Semicon Co., Ltd. Method for manufacturing a BiCMOS semiconductor device
US6448587B1 (en) * 1997-11-28 2002-09-10 Hitachi, Ltd. Circuit incorporated IGBT and power conversion device using the same
US6275093B1 (en) * 1998-02-25 2001-08-14 Intersil Corporation IGBT gate drive circuit with short circuit protection
US6242967B1 (en) * 1998-06-15 2001-06-05 Fuji Electric Co., Ltd. Low on resistance high speed off switching device having unipolar transistors
JP3817380B2 (ja) * 1999-01-14 2006-09-06 ローム株式会社 絶縁ゲート型半導体装置
DE102006001252B4 (de) * 2006-01-10 2012-01-26 Infineon Technologies Ag Bipolares Leistungshalbleiterbauelement mit einem p-Emitter und höher dotierten Zonen in dem p-Emitter und Herstellungsverfahren
US7687891B2 (en) * 2007-05-14 2010-03-30 Infineon Technologies Ag Diode having one or more zones of a first conductivity type and one or more zones of a second conductivity type each located within a layer of the second conductivity type
JP5423377B2 (ja) * 2009-12-15 2014-02-19 三菱電機株式会社 イグナイタ用電力半導体装置

Also Published As

Publication number Publication date
EP2455972B1 (en) 2015-03-25
US20150048414A1 (en) 2015-02-19
EP2455972A1 (en) 2012-05-23
ITMI20102146A1 (it) 2012-05-20
US9196714B2 (en) 2015-11-24
US20120126880A1 (en) 2012-05-24
US8878594B2 (en) 2014-11-04

Similar Documents

Publication Publication Date Title
CO7020913A2 (es) Inhibidores de pde9 con estructura básica de imidazotriazinona
DK2544738T3 (da) Injektionsanordning
BR112012022323A2 (pt) dispositivo de iluminação
BR112012033589A2 (pt) dispositivo de iluminação
BR112012033478A2 (pt) dispositivo médico
DE112011103755A5 (de) Abzugvorrichtung
ES1073154Y (es) Estructura de dispositivo de iluminacion
DK2613888T3 (da) Doseringsanordning
IT1402879B1 (it) Dispositivo igbt con regioni di emettitore sepolte
FI20105906A0 (fi) Laite
DK2447459T3 (da) Isolator
BR112012030878A2 (pt) dispositivo
ES1074271Y (es) Dispositivo de union de sillas en hilera
DK2402077T3 (da) Isolatorenhed
ES1075366Y (es) Jeringuilla hipodermica con sistema de fuelle
DE102011007240A8 (de) Fahrzeugnavigationsvorrichtung
IT1401974B1 (it) Dispositivo illuminante
FI20105903A0 (fi) Laite
DK2365242T3 (da) Belysningsindretning
ITMI20112078A1 (it) Dispositivo di navigazione
IT1402832B1 (it) Dispositivo reggispinta
ES1073149Y (es) Dispositivo avisador
FI20105907A0 (fi) Laite
FI20105902A0 (fi) Laite
ES1074553Y (es) Dispositivo convertidor de farolas