IT1398430B1 - Dispositivo per l'alloggiamento di un substrato, e relativo procedimento - Google Patents

Dispositivo per l'alloggiamento di un substrato, e relativo procedimento

Info

Publication number
IT1398430B1
IT1398430B1 ITUD2009A000151A ITUD20090151A IT1398430B1 IT 1398430 B1 IT1398430 B1 IT 1398430B1 IT UD2009A000151 A ITUD2009A000151 A IT UD2009A000151A IT UD20090151 A ITUD20090151 A IT UD20090151A IT 1398430 B1 IT1398430 B1 IT 1398430B1
Authority
IT
Italy
Prior art keywords
procedure
housing
substrate
Prior art date
Application number
ITUD2009A000151A
Other languages
English (en)
Inventor
Gianfranco Pasqualin
Giorgio Cellere
Andrea Baccini
Marco Galiazzo
Tommaso Vercesi
Santi Luigi De
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000151A priority Critical patent/IT1398430B1/it
Priority to TW099129726A priority patent/TW201118975A/zh
Priority to CN2010800395805A priority patent/CN102484092A/zh
Priority to US13/394,123 priority patent/US20120315825A1/en
Priority to PCT/EP2010/062856 priority patent/WO2011026888A1/en
Priority to EP10747869A priority patent/EP2474028A1/en
Publication of ITUD20090151A1 publication Critical patent/ITUD20090151A1/it
Application granted granted Critical
Publication of IT1398430B1 publication Critical patent/IT1398430B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
ITUD2009A000151A 2009-09-03 2009-09-03 Dispositivo per l'alloggiamento di un substrato, e relativo procedimento IT1398430B1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ITUD2009A000151A IT1398430B1 (it) 2009-09-03 2009-09-03 Dispositivo per l'alloggiamento di un substrato, e relativo procedimento
TW099129726A TW201118975A (en) 2009-09-03 2010-09-02 Device for housing a substrate, and relative method
CN2010800395805A CN102484092A (zh) 2009-09-03 2010-09-02 用以容纳基材的装置及其制造方法
US13/394,123 US20120315825A1 (en) 2009-09-03 2010-09-02 Device for housing a substrate, and relative method
PCT/EP2010/062856 WO2011026888A1 (en) 2009-09-03 2010-09-02 Device for housing a substrate, and relative method
EP10747869A EP2474028A1 (en) 2009-09-03 2010-09-02 Device for housing a substrate, and relative method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000151A IT1398430B1 (it) 2009-09-03 2009-09-03 Dispositivo per l'alloggiamento di un substrato, e relativo procedimento

Publications (2)

Publication Number Publication Date
ITUD20090151A1 ITUD20090151A1 (it) 2011-03-04
IT1398430B1 true IT1398430B1 (it) 2013-02-22

Family

ID=42062006

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000151A IT1398430B1 (it) 2009-09-03 2009-09-03 Dispositivo per l'alloggiamento di un substrato, e relativo procedimento

Country Status (6)

Country Link
US (1) US20120315825A1 (it)
EP (1) EP2474028A1 (it)
CN (1) CN102484092A (it)
IT (1) IT1398430B1 (it)
TW (1) TW201118975A (it)
WO (1) WO2011026888A1 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8573579B2 (en) * 2010-03-01 2013-11-05 Seagate Technology Llc Biasing a pre-metalized non-conductive substrate
WO2015006345A2 (en) 2013-07-09 2015-01-15 Nd Industries, Inc. Multi-row magnetic dial for the conveyance of workpieces and related method

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123950A (en) * 1964-03-10 Ultrasonic cleaning of grinding wheels
US1082134A (en) * 1912-04-25 1913-12-23 D & W Fuse Company Water-tight joint for magnetic circuits.
US1171818A (en) * 1914-10-24 1916-02-15 Builders Iron Foundry Process of forming jigs or fixtures.
US1507006A (en) * 1918-10-28 1924-09-02 Taftpeirce Mfg Company Magnetic chuck
US1831617A (en) * 1928-07-26 1931-11-10 Libbey Owens Ford Glass Co Table for supporting glass sheets and method of bedding the same thereon
US1936017A (en) * 1931-04-14 1933-11-21 Heuze Charles Table for supporting plate glass and the like in grinding and polishing apparatus
US2351129A (en) * 1943-01-09 1944-06-13 Titan Abrasive Company Anchor stud for abrasive wheels
US2423118A (en) * 1946-02-05 1947-07-01 Eric G Ramsay Lapping machine
US3004766A (en) * 1959-11-02 1961-10-17 Andrew J Bryant Vacuum chuck
AT330006B (de) * 1973-06-08 1976-06-10 Swarovski Tyrolit Schleif Stirnseitig wirkende schleifscheibe
US3893676A (en) * 1974-01-17 1975-07-08 Cincinnati Milacron Heald Magnetic chuck
US4259922A (en) * 1977-08-25 1981-04-07 Amerace Corporation Apparatus for producing locking patches on magnetic screws
US4222204A (en) * 1979-06-18 1980-09-16 Benner Robert L Holder for an abrasive plate
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
JP2665242B2 (ja) * 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
US5384682A (en) * 1993-03-22 1995-01-24 Toto Ltd. Electrostatic chuck
EP0756917A4 (en) * 1994-04-22 1997-12-17 Toshiba Kk SEPARATE GRINDING SURFACE SUPPORT PLATE AND ASSOCIATED APPARATUS
DE4419134A1 (de) * 1994-06-01 1995-12-07 Blaupunkt Werke Gmbh Positioniervorrichtung für die Bearbeitung von Substraten
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
JP3245369B2 (ja) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
US5971379A (en) * 1997-08-27 1999-10-26 Leon, Jr.; Raymond Adjustable magnetic jig
JPH11111828A (ja) * 1997-09-30 1999-04-23 Shin Etsu Chem Co Ltd 静電吸着装置
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
US6802765B1 (en) * 2003-06-19 2004-10-12 Robert M. Torrez Stud resurfacing tool
US8465346B1 (en) * 2012-11-06 2013-06-18 Stephen Michael Cattaneo Slidable platform abrasion workstation device for truing model car wheels and axles

Also Published As

Publication number Publication date
WO2011026888A1 (en) 2011-03-10
CN102484092A (zh) 2012-05-30
EP2474028A1 (en) 2012-07-11
ITUD20090151A1 (it) 2011-03-04
TW201118975A (en) 2011-06-01
US20120315825A1 (en) 2012-12-13

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