IT1398429B1 - Procedimento per l'allineamento di una traccia di stampa - Google Patents

Procedimento per l'allineamento di una traccia di stampa

Info

Publication number
IT1398429B1
IT1398429B1 ITUD2009A000150A ITUD20090150A IT1398429B1 IT 1398429 B1 IT1398429 B1 IT 1398429B1 IT UD2009A000150 A ITUD2009A000150 A IT UD2009A000150A IT UD20090150 A ITUD20090150 A IT UD20090150A IT 1398429 B1 IT1398429 B1 IT 1398429B1
Authority
IT
Italy
Prior art keywords
aligning
procedure
print track
print
track
Prior art date
Application number
ITUD2009A000150A
Other languages
English (en)
Italian (it)
Inventor
Gianfranco Pasqualin
Giorgio Cellere
Andrea Baccini
Marco Galiazzo
Tommaso Vercesi
Santi Luigi De
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000150A priority Critical patent/IT1398429B1/it
Priority to TW099129712A priority patent/TW201115677A/zh
Priority to CN201080039560.8A priority patent/CN102484948B/zh
Priority to EP10747865.3A priority patent/EP2474211B1/en
Priority to KR1020127008644A priority patent/KR20120080191A/ko
Priority to US13/394,134 priority patent/US20120216694A1/en
Priority to JP2012527315A priority patent/JP2013504194A/ja
Priority to PCT/EP2010/062841 priority patent/WO2011026880A1/en
Publication of ITUD20090150A1 publication Critical patent/ITUD20090150A1/it
Application granted granted Critical
Publication of IT1398429B1 publication Critical patent/IT1398429B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)
  • Printing Methods (AREA)
  • Electroluminescent Light Sources (AREA)
  • Character Spaces And Line Spaces In Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ITUD2009A000150A 2009-09-03 2009-09-03 Procedimento per l'allineamento di una traccia di stampa IT1398429B1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ITUD2009A000150A IT1398429B1 (it) 2009-09-03 2009-09-03 Procedimento per l'allineamento di una traccia di stampa
TW099129712A TW201115677A (en) 2009-09-03 2010-09-02 Method for centering a print track
CN201080039560.8A CN102484948B (zh) 2009-09-03 2010-09-02 印刷轨道的置中方法
EP10747865.3A EP2474211B1 (en) 2009-09-03 2010-09-02 Method for centering a print track
KR1020127008644A KR20120080191A (ko) 2009-09-03 2010-09-02 프린트 트랙을 센터링하기 위한 방법
US13/394,134 US20120216694A1 (en) 2009-09-03 2010-09-02 Method For Centering A Print Track
JP2012527315A JP2013504194A (ja) 2009-09-03 2010-09-02 印刷トラックをセンタリングするための方法
PCT/EP2010/062841 WO2011026880A1 (en) 2009-09-03 2010-09-02 Method for centering a print track

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000150A IT1398429B1 (it) 2009-09-03 2009-09-03 Procedimento per l'allineamento di una traccia di stampa

Publications (2)

Publication Number Publication Date
ITUD20090150A1 ITUD20090150A1 (it) 2011-03-04
IT1398429B1 true IT1398429B1 (it) 2013-02-22

Family

ID=41682550

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000150A IT1398429B1 (it) 2009-09-03 2009-09-03 Procedimento per l'allineamento di una traccia di stampa

Country Status (8)

Country Link
US (1) US20120216694A1 (enExample)
EP (1) EP2474211B1 (enExample)
JP (1) JP2013504194A (enExample)
KR (1) KR20120080191A (enExample)
CN (1) CN102484948B (enExample)
IT (1) IT1398429B1 (enExample)
TW (1) TW201115677A (enExample)
WO (1) WO2011026880A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUD20110171A1 (it) * 2011-10-24 2013-04-25 Applied Materials Italia Srl Metodo ed impianto di controllo in retroazione ad anello chiuso per la stampa di uno schema multistrato
NL2013237B1 (en) * 2014-07-22 2016-08-16 Roth & Rau B V Inkjet printing system and method for processing wafers.
CN107635781B (zh) * 2015-07-15 2020-02-07 惠普发展公司，有限责任合伙企业 用于打印系统的诊断图
NL2016137B1 (en) 2016-01-21 2017-07-25 Meyer Burger (Netherlands) B V Inkjet printing system and method for processing substrates.

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376584A (en) * 1980-06-02 1983-03-15 Bell Telephone Laboratories, Inc. Pattern printing including aligning masks and monitoring such alignment
US4590327A (en) * 1984-09-24 1986-05-20 Energy Conversion Devices, Inc. Photovoltaic device and method
JPH01253297A (ja) * 1988-03-31 1989-10-09 Taiyo Yuden Co Ltd 厚膜回路装置の製造方法
JPH0229566U (enExample) * 1988-08-18 1990-02-26
JPH02129761U (enExample) * 1989-03-31 1990-10-25
JPH04307791A (ja) * 1991-04-04 1992-10-29 Nec Corp 印刷配線板の製造方法
WO2005109524A1 (ja) * 2004-05-07 2005-11-17 Mitsubishi Denki Kabushiki Kaisha 太陽電池及びその製造方法
DE102007041057A1 (de) * 2007-08-29 2009-03-05 Manz Automation Ag Verfahren zum Herstellen einer Solarzelle

Also Published As

Publication number Publication date
WO2011026880A1 (en) 2011-03-10
ITUD20090150A1 (it) 2011-03-04
CN102484948B (zh) 2015-01-07
US20120216694A1 (en) 2012-08-30
EP2474211B1 (en) 2014-03-05
JP2013504194A (ja) 2013-02-04
TW201115677A (en) 2011-05-01
KR20120080191A (ko) 2012-07-16
CN102484948A (zh) 2012-05-30
EP2474211A1 (en) 2012-07-11

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