IT1393922B1 - PRINTED CIRCUIT EQUIPPED WITH INSULATING COVER AND RELATED ASSEMBLY METHOD. - Google Patents

PRINTED CIRCUIT EQUIPPED WITH INSULATING COVER AND RELATED ASSEMBLY METHOD.

Info

Publication number
IT1393922B1
IT1393922B1 ITMC2009A000107A ITMC20090107A IT1393922B1 IT 1393922 B1 IT1393922 B1 IT 1393922B1 IT MC2009A000107 A ITMC2009A000107 A IT MC2009A000107A IT MC20090107 A ITMC20090107 A IT MC20090107A IT 1393922 B1 IT1393922 B1 IT 1393922B1
Authority
IT
Italy
Prior art keywords
printed circuit
insulating cover
assembly method
circuit equipped
related assembly
Prior art date
Application number
ITMC2009A000107A
Other languages
Italian (it)
Inventor
Kuo-Ching Chen
Cheng-Wen Dai
Yen-Huan Yu
Ching-Feng Hsieh
Chia-Hung Lee
Chung-Shao Huang
Original Assignee
Askey Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Askey Computer Corp filed Critical Askey Computer Corp
Publication of ITMC20090107A1 publication Critical patent/ITMC20090107A1/en
Application granted granted Critical
Publication of IT1393922B1 publication Critical patent/IT1393922B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
ITMC2009A000107A 2008-10-13 2009-05-13 PRINTED CIRCUIT EQUIPPED WITH INSULATING COVER AND RELATED ASSEMBLY METHOD. IT1393922B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097139173A TWI375509B (en) 2008-10-13 2008-10-13 A circuit board having an isolation cover and a method for assembling

Publications (2)

Publication Number Publication Date
ITMC20090107A1 ITMC20090107A1 (en) 2010-11-14
IT1393922B1 true IT1393922B1 (en) 2012-05-17

Family

ID=40433332

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMC2009A000107A IT1393922B1 (en) 2008-10-13 2009-05-13 PRINTED CIRCUIT EQUIPPED WITH INSULATING COVER AND RELATED ASSEMBLY METHOD.

Country Status (10)

Country Link
US (1) US7999195B2 (en)
JP (1) JP4755265B2 (en)
KR (1) KR101096387B1 (en)
DE (1) DE102009001744A1 (en)
ES (1) ES2365674B1 (en)
FR (1) FR2937215B1 (en)
GB (1) GB2464329B (en)
IT (1) IT1393922B1 (en)
NL (1) NL1036864C2 (en)
TW (1) TWI375509B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077446A (en) * 2009-10-01 2011-04-14 Sanyo Electric Co Ltd Shield case and image display device
JP5703587B2 (en) 2010-04-14 2015-04-22 コベルコ建機株式会社 Hybrid work machine
US8279624B2 (en) * 2010-06-03 2012-10-02 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with through hole latching mechanisms
TW201225752A (en) * 2010-12-10 2012-06-16 Askey Computer Corp Printed circuit board grounding structure for use with communication apparatus
CN104837327A (en) * 2015-05-21 2015-08-12 小米科技有限责任公司 Circuit protection structure and electronic device
TWI749887B (en) * 2020-11-20 2021-12-11 英業達股份有限公司 Electronic assembly and server

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62237Y2 (en) * 1978-09-12 1987-01-07
US4370515A (en) * 1979-12-26 1983-01-25 Rockwell International Corporation Electromagnetic interference
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
JPH04322498A (en) * 1991-04-23 1992-11-12 Murata Mfg Co Ltd High-frequency apparatus
JP3067326B2 (en) * 1991-09-24 2000-07-17 ソニー株式会社 Soldering method
JPH07142906A (en) * 1993-11-15 1995-06-02 Fuji Elelctrochem Co Ltd Cover body fitting structure for dielectric filter
JPH0818265A (en) * 1994-06-29 1996-01-19 Molex Inc Method of shielding electromagnetic wave, etc. on printed circuit board and shield cover therefor
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
JP3771395B2 (en) * 1999-05-25 2006-04-26 アルプス電気株式会社 Shield case for electronic equipment
JP2001148594A (en) * 1999-11-19 2001-05-29 Murata Mfg Co Ltd Electronic device with shield case
JP3792518B2 (en) * 2001-01-19 2006-07-05 三菱電機株式会社 Shield structure for electronic circuit parts
JP2002280787A (en) * 2001-03-19 2002-09-27 Murata Mfg Co Ltd Structure for aligning members each other
JP2003174281A (en) * 2001-12-06 2003-06-20 Murata Mfg Co Ltd Shield case for electromagnetic component
US6781851B2 (en) * 2002-05-30 2004-08-24 Lucent Technologies Inc. Electromagnetic interference shield
DE10231145A1 (en) * 2002-07-10 2004-01-29 Siemens Ag Shielding device for electronic assemblies on a printed circuit board
US20040025334A1 (en) * 2002-08-06 2004-02-12 Ming Wen Method of securely fastening a shield to a circuit board
JP2005136012A (en) * 2003-10-28 2005-05-26 Murata Mfg Co Ltd Shielding case fixing structure
JP2007299996A (en) * 2006-05-01 2007-11-15 Alps Electric Co Ltd Circuit board mounting structure
US20080043453A1 (en) * 2006-08-18 2008-02-21 Chin-Fu Horng Electromagnetic-shielding device
CN201063966Y (en) 2007-05-29 2008-05-21 丽台科技股份有限公司 Shielding case structure and module group packaging structure thereof

Also Published As

Publication number Publication date
GB2464329A (en) 2010-04-14
TWI375509B (en) 2012-10-21
NL1036864C2 (en) 2012-02-28
ES2365674B1 (en) 2012-04-20
US20100091471A1 (en) 2010-04-15
DE102009001744A1 (en) 2010-04-15
US7999195B2 (en) 2011-08-16
JP2010093220A (en) 2010-04-22
TW201016125A (en) 2010-04-16
ITMC20090107A1 (en) 2010-11-14
FR2937215B1 (en) 2011-11-18
KR20100041652A (en) 2010-04-22
FR2937215A1 (en) 2010-04-16
GB2464329B (en) 2011-04-27
ES2365674A1 (en) 2011-10-10
GB0900608D0 (en) 2009-02-25
NL1036864A (en) 2010-04-14
KR101096387B1 (en) 2011-12-20
JP4755265B2 (en) 2011-08-24

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