IT1298891B1 - Impianto da vuoto portatile provvisto di precamera per la deposizione di film sottili su superfici anche inamovibili. - Google Patents
Impianto da vuoto portatile provvisto di precamera per la deposizione di film sottili su superfici anche inamovibili.Info
- Publication number
- IT1298891B1 IT1298891B1 IT98RM000071A ITRM980071A IT1298891B1 IT 1298891 B1 IT1298891 B1 IT 1298891B1 IT 98RM000071 A IT98RM000071 A IT 98RM000071A IT RM980071 A ITRM980071 A IT RM980071A IT 1298891 B1 IT1298891 B1 IT 1298891B1
- Authority
- IT
- Italy
- Prior art keywords
- deposition
- chamber
- thin films
- vacuum system
- system equipped
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/162—Open vessel, i.e. one end sealed by object or workpiece
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT98RM000071A IT1298891B1 (it) | 1998-02-06 | 1998-02-06 | Impianto da vuoto portatile provvisto di precamera per la deposizione di film sottili su superfici anche inamovibili. |
DE19904829A DE19904829A1 (de) | 1998-02-06 | 1999-02-05 | Tragbare Vakuumanlage mit Vorkammer zum Auftragen von Feinfolien |
US09/247,474 US6136167A (en) | 1998-02-06 | 1999-02-08 | Portable apparatus for thin deposition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT98RM000071A IT1298891B1 (it) | 1998-02-06 | 1998-02-06 | Impianto da vuoto portatile provvisto di precamera per la deposizione di film sottili su superfici anche inamovibili. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITRM980071A1 ITRM980071A1 (it) | 1998-05-06 |
IT1298891B1 true IT1298891B1 (it) | 2000-02-07 |
Family
ID=11405533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT98RM000071A IT1298891B1 (it) | 1998-02-06 | 1998-02-06 | Impianto da vuoto portatile provvisto di precamera per la deposizione di film sottili su superfici anche inamovibili. |
Country Status (3)
Country | Link |
---|---|
US (1) | US6136167A (it) |
DE (1) | DE19904829A1 (it) |
IT (1) | IT1298891B1 (it) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2832022B1 (fr) * | 2001-11-06 | 2003-12-19 | Christian Lincot | Procede et dispositif d'application in situ d'un champ electrique intense a puissance variable pour des traitements localises |
FR2839459B1 (fr) * | 2002-05-13 | 2005-02-25 | Pvdco | Nouveau reacteur pour le depot d'un revetement metallique sur un substrat |
KR100563102B1 (ko) * | 2002-09-12 | 2006-03-27 | 에이에스엠엘 네델란즈 비.브이. | 표면들로부터 입자들을 제거함으로써 세정하는 방법,세정장치 및 리소그래피투영장치 |
DE10247888A1 (de) * | 2002-10-14 | 2004-04-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Einrichtung zur Erzeugung von Plasmen durch Hochfrequenzentladungen |
US20130115867A1 (en) * | 2011-11-08 | 2013-05-09 | General Electric Company | Enclosure system and method for applying coating |
DE102012209650B4 (de) * | 2012-06-08 | 2014-10-23 | Schunk Kohlenstofftechnik Gmbh | Plasma-unterstütztes chemisches Gasabscheidungs-Verfahren mit erhöhter Plasmadichte |
CN111837221B (zh) * | 2019-02-14 | 2024-03-05 | 株式会社日立高新技术 | 半导体制造装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57134559A (en) * | 1981-02-12 | 1982-08-19 | Toyota Central Res & Dev Lab Inc | Physical vapor deposition device |
DE3521053A1 (de) * | 1985-06-12 | 1986-12-18 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zum aufbringen duenner schichten auf ein substrat |
KR920003789B1 (ko) * | 1988-02-08 | 1992-05-14 | 니뽄 덴신 덴와 가부시끼가이샤 | 플라즈마 스퍼터링을 이용한 박막 형성 장치 및 이온원 |
DE4313353C2 (de) * | 1993-04-23 | 1997-08-28 | Leybold Ag | Vakuum-Beschichtungsanlage |
-
1998
- 1998-02-06 IT IT98RM000071A patent/IT1298891B1/it active IP Right Grant
-
1999
- 1999-02-05 DE DE19904829A patent/DE19904829A1/de not_active Withdrawn
- 1999-02-08 US US09/247,474 patent/US6136167A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6136167A (en) | 2000-10-24 |
ITRM980071A1 (it) | 1998-05-06 |
DE19904829A1 (de) | 1999-08-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |