IT1293536B1 - Procedimento di metallizzazione multilivello ad alta planarizzazione per dispositivi a semiconduttore - Google Patents

Procedimento di metallizzazione multilivello ad alta planarizzazione per dispositivi a semiconduttore

Info

Publication number
IT1293536B1
IT1293536B1 IT97RM000431A ITRM970431A IT1293536B1 IT 1293536 B1 IT1293536 B1 IT 1293536B1 IT 97RM000431 A IT97RM000431 A IT 97RM000431A IT RM970431 A ITRM970431 A IT RM970431A IT 1293536 B1 IT1293536 B1 IT 1293536B1
Authority
IT
Italy
Prior art keywords
semiconductor devices
metallization process
multilevel metallization
high planarization
planarization
Prior art date
Application number
IT97RM000431A
Other languages
English (en)
Italian (it)
Inventor
Felice Russo
Giuseppe Miccoli
Natale Nardi
Marco Ricotti
Alfredo Franchina
Original Assignee
Consorzio Eagle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consorzio Eagle filed Critical Consorzio Eagle
Priority to IT97RM000431A priority Critical patent/IT1293536B1/it
Publication of ITRM970431A0 publication Critical patent/ITRM970431A0/it
Priority to JP10232206A priority patent/JPH11233515A/ja
Priority to KR1019980028388A priority patent/KR19990013850A/ko
Priority to EP98305603A priority patent/EP0897193A3/en
Publication of ITRM970431A1 publication Critical patent/ITRM970431A1/it
Application granted granted Critical
Publication of IT1293536B1 publication Critical patent/IT1293536B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
IT97RM000431A 1997-07-14 1997-07-14 Procedimento di metallizzazione multilivello ad alta planarizzazione per dispositivi a semiconduttore IT1293536B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT97RM000431A IT1293536B1 (it) 1997-07-14 1997-07-14 Procedimento di metallizzazione multilivello ad alta planarizzazione per dispositivi a semiconduttore
JP10232206A JPH11233515A (ja) 1997-07-14 1998-07-14 半導体装置の多層配線平坦化方法
KR1019980028388A KR19990013850A (ko) 1997-07-14 1998-07-14 반도체 장치에 대한 고 평탄화 멀티 레벨 금속화 방법
EP98305603A EP0897193A3 (en) 1997-07-14 1998-07-14 Process of making a multilevel metallization scheme with high planarization degree

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT97RM000431A IT1293536B1 (it) 1997-07-14 1997-07-14 Procedimento di metallizzazione multilivello ad alta planarizzazione per dispositivi a semiconduttore

Publications (3)

Publication Number Publication Date
ITRM970431A0 ITRM970431A0 (US06559137-20030506-C00071.png) 1997-07-14
ITRM970431A1 ITRM970431A1 (it) 1999-01-14
IT1293536B1 true IT1293536B1 (it) 1999-03-01

Family

ID=11405176

Family Applications (1)

Application Number Title Priority Date Filing Date
IT97RM000431A IT1293536B1 (it) 1997-07-14 1997-07-14 Procedimento di metallizzazione multilivello ad alta planarizzazione per dispositivi a semiconduttore

Country Status (4)

Country Link
EP (1) EP0897193A3 (US06559137-20030506-C00071.png)
JP (1) JPH11233515A (US06559137-20030506-C00071.png)
KR (1) KR19990013850A (US06559137-20030506-C00071.png)
IT (1) IT1293536B1 (US06559137-20030506-C00071.png)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063175A (en) * 1986-09-30 1991-11-05 North American Philips Corp., Signetics Division Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material
US5612254A (en) * 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5366911A (en) * 1994-05-11 1994-11-22 United Microelectronics Corporation VLSI process with global planarization
JP2836529B2 (ja) * 1995-04-27 1998-12-14 日本電気株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
ITRM970431A1 (it) 1999-01-14
EP0897193A2 (en) 1999-02-17
JPH11233515A (ja) 1999-08-27
ITRM970431A0 (US06559137-20030506-C00071.png) 1997-07-14
EP0897193A3 (en) 1999-08-04
KR19990013850A (ko) 1999-02-25

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Legal Events

Date Code Title Description
0001 Granted