AU8797198A - Transfer assembly for semiconductor wafers - Google Patents

Transfer assembly for semiconductor wafers

Info

Publication number
AU8797198A
AU8797198A AU87971/98A AU8797198A AU8797198A AU 8797198 A AU8797198 A AU 8797198A AU 87971/98 A AU87971/98 A AU 87971/98A AU 8797198 A AU8797198 A AU 8797198A AU 8797198 A AU8797198 A AU 8797198A
Authority
AU
Australia
Prior art keywords
semiconductor wafers
transfer assembly
transfer
assembly
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU87971/98A
Inventor
Rolf Bachmann
Jakob Blattner
Hanno Ruegg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brooks CCS RS AG
Original Assignee
Staeubli AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Staeubli AG filed Critical Staeubli AG
Publication of AU8797198A publication Critical patent/AU8797198A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers
AU87971/98A 1997-09-10 1998-09-03 Transfer assembly for semiconductor wafers Abandoned AU8797198A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP97115686 1997-09-10
EP19970115686 EP0908927B1 (en) 1997-09-10 1997-09-10 Semiconductor wafer transfer apparatus
PCT/CH1998/000380 WO1999013496A1 (en) 1997-09-10 1998-09-03 Transfer assembly for semiconductor wafers

Publications (1)

Publication Number Publication Date
AU8797198A true AU8797198A (en) 1999-03-29

Family

ID=8227336

Family Applications (1)

Application Number Title Priority Date Filing Date
AU87971/98A Abandoned AU8797198A (en) 1997-09-10 1998-09-03 Transfer assembly for semiconductor wafers

Country Status (5)

Country Link
EP (1) EP0908927B1 (en)
AU (1) AU8797198A (en)
CH (1) CH695472A5 (en)
DE (1) DE59712806D1 (en)
WO (1) WO1999013496A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6612801B1 (en) 1999-08-26 2003-09-02 Tokyo Electron Limited Method and device for arraying substrates and processing apparatus thereof
BE1019301A5 (en) * 2011-08-31 2012-05-08 Develop Mechanics Nv DEVICE FOR HANDLING SEMICONDUCTOR WAFERS.
CN113955499B (en) * 2021-11-05 2023-02-03 内蒙古赛宝伦科技有限公司 Transfer device is used in monocrystalline silicon production with protection mechanism

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045031A (en) * 1983-08-22 1985-03-11 Tomuko:Kk Automatic wafer transfer machine
US4695217A (en) * 1983-11-21 1987-09-22 Lau John J Semiconductor wafer transfer apparatus
US4611966A (en) * 1984-05-30 1986-09-16 Johnson Lester R Apparatus for transferring semiconductor wafers
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
JP2919054B2 (en) * 1990-11-17 1999-07-12 東京エレクトロン株式会社 Transfer device and transfer method
EP0496006A1 (en) * 1991-01-19 1992-07-29 International Business Machines Corporation Wafer transfer apparatus

Also Published As

Publication number Publication date
CH695472A5 (en) 2006-05-31
EP0908927B1 (en) 2007-01-31
EP0908927A2 (en) 1999-04-14
DE59712806D1 (en) 2007-03-22
EP0908927A3 (en) 1999-04-21
WO1999013496A1 (en) 1999-03-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase