IT1230028B - Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti - Google Patents
Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenutiInfo
- Publication number
- IT1230028B IT1230028B IT8806627A IT662788A IT1230028B IT 1230028 B IT1230028 B IT 1230028B IT 8806627 A IT8806627 A IT 8806627A IT 662788 A IT662788 A IT 662788A IT 1230028 B IT1230028 B IT 1230028B
- Authority
- IT
- Italy
- Prior art keywords
- mos
- semiconductive devices
- gettering
- treatment
- manufacturing process
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0172—Manufacturing their gate conductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P36/00—Gettering within semiconductor bodies
- H10P36/03—Gettering within semiconductor bodies within silicon bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8806627A IT1230028B (it) | 1988-12-16 | 1988-12-16 | Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti |
| EP89203161A EP0373723A1 (en) | 1988-12-16 | 1989-12-12 | Method for manufacturing a MOS semiconductor device making use of a "gettering" treatment with improved characteristics, and MOS semiconductor devices obtained thereby |
| JP1324913A JPH02218136A (ja) | 1988-12-16 | 1989-12-16 | Mos半導体デバイス製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT8806627A IT1230028B (it) | 1988-12-16 | 1988-12-16 | Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8806627A0 IT8806627A0 (it) | 1988-12-16 |
| IT1230028B true IT1230028B (it) | 1991-09-24 |
Family
ID=11121592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8806627A IT1230028B (it) | 1988-12-16 | 1988-12-16 | Procedimento di fabbricazione di dispositivi semiconduttori mos avvalentesi di un trattamento "gettering" di migliorare caratteristiche, e dispositivi semiconduttori mos con esso ottenuti |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0373723A1 (it) |
| JP (1) | JPH02218136A (it) |
| IT (1) | IT1230028B (it) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0897163A (ja) * | 1994-07-28 | 1996-04-12 | Hitachi Ltd | 半導体ウエハの製造方法、半導体ウエハ、半導体集積回路装置の製造方法および半導体集積回路装置 |
| JP3498431B2 (ja) * | 1995-07-04 | 2004-02-16 | 株式会社デンソー | 半導体装置の製造方法 |
| JPH09120965A (ja) * | 1995-10-25 | 1997-05-06 | Toshiba Corp | 半導体装置の製造方法 |
| GB2368464B (en) * | 1999-02-02 | 2002-10-16 | Nec Corp | Semiconductor device and fabrication process therefor |
| US6309929B1 (en) * | 2000-09-22 | 2001-10-30 | Industrial Technology Research Institute And Genetal Semiconductor Of Taiwan, Ltd. | Method of forming trench MOS device and termination structure |
| KR100944823B1 (ko) * | 2005-07-14 | 2010-03-03 | 오토리브 디벨로프먼트 에이비 | 시트벨트장치 |
| US8329563B2 (en) | 2006-02-24 | 2012-12-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device including a gettering layer and manufacturing method therefor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3065499D1 (en) * | 1979-04-11 | 1983-12-15 | Mitsui Petrochemical Ind | Process for producing spherical carrier particles for olefin polymerisation catalyst, catalyst comprising such carrier particles, and use of such catalyst in olefin polymerisation |
| AT380974B (de) * | 1982-04-06 | 1986-08-11 | Shell Austria | Verfahren zum gettern von halbleiterbauelementen |
| DE3485808T2 (de) * | 1983-02-14 | 1993-03-04 | Memc Electronic Materials | Materialien fuer halbleitersubstrate mit moeglichkeit zum gettern. |
| JPS61159741A (ja) * | 1984-12-31 | 1986-07-19 | Sony Corp | 半導体装置の製造方法 |
-
1988
- 1988-12-16 IT IT8806627A patent/IT1230028B/it active
-
1989
- 1989-12-12 EP EP89203161A patent/EP0373723A1/en not_active Withdrawn
- 1989-12-16 JP JP1324913A patent/JPH02218136A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02218136A (ja) | 1990-08-30 |
| EP0373723A1 (en) | 1990-06-20 |
| IT8806627A0 (it) | 1988-12-16 |
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