IT1213490B - Dispositivo a semiconduttori avente una struttura di contatti apressione per l'impiego in applicazioni di alta potenza. - Google Patents
Dispositivo a semiconduttori avente una struttura di contatti apressione per l'impiego in applicazioni di alta potenza.Info
- Publication number
- IT1213490B IT1213490B IT2165586A IT2165586A IT1213490B IT 1213490 B IT1213490 B IT 1213490B IT 2165586 A IT2165586 A IT 2165586A IT 2165586 A IT2165586 A IT 2165586A IT 1213490 B IT1213490 B IT 1213490B
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor device
- high power
- power applications
- contacts opening
- contacts
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
- H01L29/744—Gate-turn-off devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20940785A JPH079919B2 (ja) | 1985-09-20 | 1985-09-20 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8621655A0 IT8621655A0 (it) | 1986-09-09 |
IT1213490B true IT1213490B (it) | 1989-12-20 |
Family
ID=16572372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2165586A IT1213490B (it) | 1985-09-20 | 1986-09-09 | Dispositivo a semiconduttori avente una struttura di contatti apressione per l'impiego in applicazioni di alta potenza. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0238665A1 (it) |
JP (1) | JPH079919B2 (it) |
IT (1) | IT1213490B (it) |
WO (1) | WO1987001866A1 (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040051A (en) * | 1988-12-05 | 1991-08-13 | Sundstrand Corporation | Hydrostatic clamp and method for compression type power semiconductors |
DE58905844D1 (de) * | 1989-02-02 | 1993-11-11 | Asea Brown Boveri | Druckkontaktiertes Halbleiterbauelement. |
JPH0744264B2 (ja) * | 1989-10-31 | 1995-05-15 | 株式会社東芝 | 圧接型半導体装置 |
US5210601A (en) * | 1989-10-31 | 1993-05-11 | Kabushiki Kaisha Toshiba | Compression contacted semiconductor device and method for making of the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4099201A (en) * | 1977-04-11 | 1978-07-04 | General Electric Company | Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc |
JPS56153767A (en) * | 1980-04-28 | 1981-11-27 | Mitsubishi Electric Corp | Manufacture of planar type thyristor |
JPS5778178A (en) * | 1980-11-04 | 1982-05-15 | Toshiba Corp | Input protective circuit |
FR2517471B1 (fr) * | 1981-12-02 | 1985-08-02 | Silicium Semiconducteur Ssc | Montage en boitier presse de composants de puissance a structure d'electrodes ramifiee |
JPS59218774A (ja) * | 1983-05-26 | 1984-12-10 | Nec Corp | サイリスタ |
-
1985
- 1985-09-20 JP JP20940785A patent/JPH079919B2/ja not_active Expired - Lifetime
-
1986
- 1986-03-27 WO PCT/JP1986/000145 patent/WO1987001866A1/en not_active Application Discontinuation
- 1986-03-27 EP EP86902027A patent/EP0238665A1/en not_active Withdrawn
- 1986-09-09 IT IT2165586A patent/IT1213490B/it active
Also Published As
Publication number | Publication date |
---|---|
JPH079919B2 (ja) | 1995-02-01 |
WO1987001866A1 (en) | 1987-03-26 |
IT8621655A0 (it) | 1986-09-09 |
EP0238665A1 (en) | 1987-09-30 |
JPS6269522A (ja) | 1987-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970929 |