IT1184602B - Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto - Google Patents

Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto

Info

Publication number
IT1184602B
IT1184602B IT21089/85A IT2108985A IT1184602B IT 1184602 B IT1184602 B IT 1184602B IT 21089/85 A IT21089/85 A IT 21089/85A IT 2108985 A IT2108985 A IT 2108985A IT 1184602 B IT1184602 B IT 1184602B
Authority
IT
Italy
Prior art keywords
printing
procedure
path
support plate
electronic circuit
Prior art date
Application number
IT21089/85A
Other languages
English (en)
Other versions
IT8521089A0 (it
Inventor
Ezio Curti
Original Assignee
Ezio Curti
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ezio Curti filed Critical Ezio Curti
Priority to IT21089/85A priority Critical patent/IT1184602B/it
Publication of IT8521089A0 publication Critical patent/IT8521089A0/it
Priority to EP86103559A priority patent/EP0204901A3/de
Priority to JP61132014A priority patent/JPS61287294A/ja
Application granted granted Critical
Publication of IT1184602B publication Critical patent/IT1184602B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)
IT21089/85A 1985-06-10 1985-06-10 Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto IT1184602B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT21089/85A IT1184602B (it) 1985-06-10 1985-06-10 Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto
EP86103559A EP0204901A3 (de) 1985-06-10 1986-03-17 Verfahren und Vorrichtung zum registergenauen Aufdruck eines elektronischen Schaltkreises gegenueber den Bezugsbohrungen einer Traegerplatte
JP61132014A JPS61287294A (ja) 1985-06-10 1986-06-09 電子回路を担体板の基準孔に対し正確にアラインメントして印刷するための方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT21089/85A IT1184602B (it) 1985-06-10 1985-06-10 Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto

Publications (2)

Publication Number Publication Date
IT8521089A0 IT8521089A0 (it) 1985-06-10
IT1184602B true IT1184602B (it) 1987-10-28

Family

ID=11176563

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21089/85A IT1184602B (it) 1985-06-10 1985-06-10 Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto

Country Status (3)

Country Link
EP (1) EP0204901A3 (it)
JP (1) JPS61287294A (it)
IT (1) IT1184602B (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108327388A (zh) * 2017-01-20 2018-07-27 维铭有限公司 网版及其制作方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1203506B (it) * 1987-02-25 1989-02-15 Ezio Curti Procedimento e dispositivo per posizionare una piastra di supporto per circuiti stampati rispetto al gruppo di stampa di una macchina per la lavorazione di circuiti stampati
GB8801691D0 (en) * 1988-01-26 1988-02-24 Protocol Eng Plc Film punch registration
EP0341944A3 (en) * 1988-05-10 1991-06-26 Gec Plessey Telecommunications Limited Improvements in or relating to methods of and apparatus for registration
DE3936723A1 (de) * 1989-11-04 1991-05-08 Loehr & Herrmann Gmbh Vorrichtung zum selbsttaetigen positionieren von leiterplatten
WO1997043123A1 (fr) 1996-05-15 1997-11-20 Matsushita Electric Industrial Co., Ltd. Procede de commande d'une machine d'impression au cadre
GB2323664A (en) 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
CN102673113B (zh) * 2012-05-08 2014-12-17 深圳劲嘉彩印集团股份有限公司 单张纸烫金、模切设备电子定位装置及方法
CN102756539B (zh) * 2012-07-20 2014-04-16 深圳市捷佳伟创新能源装备股份有限公司 一种基于双印刷台的图形对位方法及其装置
CN111435068B (zh) * 2018-12-26 2022-08-02 深圳麦逊电子有限公司 Ic载板测试机整机分步定位精度校验方法及系统
CN115519887B (zh) * 2022-10-28 2024-08-06 广州新晔机械设备有限公司 一种光伏玻璃双梁结构的丝网印刷机

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604546A (en) * 1969-08-18 1971-09-14 Computervision Corp Angular registration assembly and driving apparatus therefor
US3838274A (en) * 1973-03-30 1974-09-24 Western Electric Co Electro-optical article positioning system
FR2388249A1 (fr) * 1977-04-20 1978-11-17 Thomson Csf Dispositif de positionnement d'un objet dans un systeme optique de projection et systeme optique de projection comportant un tel dispositif
JPS5775889A (en) * 1980-10-30 1982-05-12 Toshiba Corp Method and device for screen printing
US4481533A (en) * 1981-11-27 1984-11-06 Lenkeit Industries, Inc. Method and apparatus for successively positioning sheets of material with precision for punching aligning holes in the sheets enabling the sheets to be used in the manufacture of composite circuit boards
JPS6054492A (ja) * 1983-09-02 1985-03-28 株式会社桜井製作所 プリント配線印刷機等における被印刷板の位置決め方法
JPS6149218A (ja) * 1984-08-16 1986-03-11 Shimadzu Corp スクリ−ン印刷機の自動位置決め方法
JPS6155937A (ja) * 1984-08-27 1986-03-20 Mitsubishi Electric Corp 半導体基板用印刷装置
JPH074916B2 (ja) * 1985-03-22 1995-01-25 株式会社日立製作所 セラミツク基板等の印刷方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108327388A (zh) * 2017-01-20 2018-07-27 维铭有限公司 网版及其制作方法

Also Published As

Publication number Publication date
JPS61287294A (ja) 1986-12-17
EP0204901A3 (de) 1987-06-03
EP0204901A2 (de) 1986-12-17
IT8521089A0 (it) 1985-06-10

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