IT1178756B - Disposizione per il raffreddamento direttamente per ebolizione di semiconduttori di potenza - Google Patents

Disposizione per il raffreddamento direttamente per ebolizione di semiconduttori di potenza

Info

Publication number
IT1178756B
IT1178756B IT24036/84A IT2403684A IT1178756B IT 1178756 B IT1178756 B IT 1178756B IT 24036/84 A IT24036/84 A IT 24036/84A IT 2403684 A IT2403684 A IT 2403684A IT 1178756 B IT1178756 B IT 1178756B
Authority
IT
Italy
Prior art keywords
provision
power semiconductors
cooling directly
boiling power
boiling
Prior art date
Application number
IT24036/84A
Other languages
English (en)
Italian (it)
Other versions
IT8424036A0 (it
IT8424036A1 (it
Inventor
Kurt Hahn
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of IT8424036A0 publication Critical patent/IT8424036A0/it
Publication of IT8424036A1 publication Critical patent/IT8424036A1/it
Application granted granted Critical
Publication of IT1178756B publication Critical patent/IT1178756B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT24036/84A 1983-12-14 1984-12-13 Disposizione per il raffreddamento direttamente per ebolizione di semiconduttori di potenza IT1178756B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3345668A DE3345668C2 (de) 1983-12-14 1983-12-14 Anordnung zur direkten Siedekühlung von Leistungshalbleiterbauelementen

Publications (3)

Publication Number Publication Date
IT8424036A0 IT8424036A0 (it) 1984-12-13
IT8424036A1 IT8424036A1 (it) 1986-06-13
IT1178756B true IT1178756B (it) 1987-09-16

Family

ID=6217212

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24036/84A IT1178756B (it) 1983-12-14 1984-12-13 Disposizione per il raffreddamento direttamente per ebolizione di semiconduttori di potenza

Country Status (6)

Country Link
AT (1) AT391776B (es)
CH (1) CH666142A5 (es)
DE (1) DE3345668C2 (es)
ES (1) ES8603233A1 (es)
IT (1) IT1178756B (es)
TR (1) TR22333A (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3542755C1 (de) * 1985-11-30 1986-10-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur direkten Siedekühlung von Bauelementen der Leistungselektronik

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573569A (en) * 1969-08-12 1971-04-06 Gen Motors Corp Controlled rectifier mounting assembly
FR2327642A1 (fr) * 1975-10-06 1977-05-06 Alsthom Cgee Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant
JPS55129462U (es) * 1979-03-08 1980-09-12
FR2481051A1 (fr) * 1980-04-21 1981-10-23 Alsthom Atlantique Dispositif support des accessoires de semiconducteurs de puissance servant a leur allumage et leur protection
DE8206226U1 (de) * 1982-03-04 1983-07-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Stromrichter mit siedekuehlung
DE3240502A1 (de) * 1982-10-30 1984-05-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Siedekuehlbehaelter fuer bauelemente der leistungselektronik

Also Published As

Publication number Publication date
IT8424036A0 (it) 1984-12-13
CH666142A5 (de) 1988-06-30
TR22333A (tr) 1987-02-13
IT8424036A1 (it) 1986-06-13
ES538283A0 (es) 1986-01-01
DE3345668A1 (de) 1985-07-04
AT391776B (de) 1990-11-26
DE3345668C2 (de) 1986-01-09
ES8603233A1 (es) 1986-01-01
ATA396584A (de) 1990-05-15

Similar Documents

Publication Publication Date Title
IT8467374A0 (it) Dissipatore di calore per dispositivi semiconduttori
DE2965795D1 (en) Cooling structure for a semiconductor module
DE3481795D1 (de) Kuehlungsanordnung fuer halbleiterchips.
DK157413C (da) Koeleapparat
KR860004481A (ko) 반도체 리이드 프레임의 세정장치
NO820037L (no) Nye, krystallinske aluminiumsilikater
DE3682797D1 (de) Kuehlungsstruktur fuer halbleitermodul.
DE3270984D1 (en) Low dissipation snubber circuit for switching power transistors
IT1158009B (it) Misuratore di potenza termica
GB1552876A (en) Arrangement for semiconductor power components
IT8423184A0 (it) Circuito di raffreddamento ad evaporizzazione per motori endotermici.
GB2014360B (en) Heat sinks for semiconductor arrangements
GB2117972B (en) Device for cooling semiconductor elements
DK165086C (da) Effektomformningskredsloeb
IT1064181B (it) Unita' per trasmissione di potenza
IT8420958A0 (it) Dispositivo per produrre automaticamente indotti di motorini elettrici nonche' procedimento per il suo esercizio.
IT1112434B (it) Custodia per disposizione di semiconduttori
IT1179599B (it) Procedimento per il posizionamento di utensili
IT1112288B (it) Dissipatore di calore per chip semiconduttori
CS191622B1 (en) Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements
IT1196140B (it) Vibrocompressore con dispositivo limitatore di potenza
ATA316581A (de) Regeleinrichtung fuer die kuehlung von gasgekuehlten, insbesondere wasserstoffgekuehlten, generatoren
ATA225484A (de) Strahlungsempfindliche halbleiteranordnung
IT1099096B (it) Impianto di raffreddamento per centrali termoelettriche
IT1178756B (it) Disposizione per il raffreddamento direttamente per ebolizione di semiconduttori di potenza