IT1177510B - Soluzione elettrolitica e metodo per elettrodepositare oro brillante a basse durezza - Google Patents

Soluzione elettrolitica e metodo per elettrodepositare oro brillante a basse durezza

Info

Publication number
IT1177510B
IT1177510B IT47591/84A IT4759184A IT1177510B IT 1177510 B IT1177510 B IT 1177510B IT 47591/84 A IT47591/84 A IT 47591/84A IT 4759184 A IT4759184 A IT 4759184A IT 1177510 B IT1177510 B IT 1177510B
Authority
IT
Italy
Prior art keywords
electrodepositing
electrolytic solution
low hardness
brilliant gold
brilliant
Prior art date
Application number
IT47591/84A
Other languages
English (en)
Other versions
IT8447591A0 (it
Inventor
Kenneth D Baker
Hans Scheider
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of IT8447591A0 publication Critical patent/IT8447591A0/it
Application granted granted Critical
Publication of IT1177510B publication Critical patent/IT1177510B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IT47591/84A 1983-01-28 1984-01-25 Soluzione elettrolitica e metodo per elettrodepositare oro brillante a basse durezza IT1177510B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/461,341 US4435253A (en) 1983-01-28 1983-01-28 Gold sulphite electroplating solutions and methods

Publications (2)

Publication Number Publication Date
IT8447591A0 IT8447591A0 (it) 1984-01-25
IT1177510B true IT1177510B (it) 1987-08-26

Family

ID=23832180

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47591/84A IT1177510B (it) 1983-01-28 1984-01-25 Soluzione elettrolitica e metodo per elettrodepositare oro brillante a basse durezza

Country Status (10)

Country Link
US (1) US4435253A (it)
JP (1) JPH0657877B2 (it)
AU (2) AU2305383A (it)
BR (1) BR8400347A (it)
CA (1) CA1244373A (it)
DE (1) DE3400670A1 (it)
FR (1) FR2540142B1 (it)
GB (1) GB2134138B (it)
IT (1) IT1177510B (it)
NL (1) NL8400075A (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5129143A (en) * 1982-11-29 1992-07-14 Amp Incorporated Durable plating for electrical contact terminals
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
US5632438A (en) * 1995-10-12 1997-05-27 International Business Machines Corporation Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization
DE19745602C1 (de) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Verfahren und Lösung zur Herstellung von Goldschichten
DE10110743A1 (de) * 2001-02-28 2002-09-05 Wieland Dental & Technik Gmbh Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
DE102005036133C5 (de) 2005-07-26 2017-07-13 Ivoclar Vivadent Ag Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad
US8420520B2 (en) * 2006-05-18 2013-04-16 Megica Corporation Non-cyanide gold electroplating for fine-line gold traces and gold pads
DE102009024396A1 (de) 2009-06-09 2010-12-16 Coventya Spa Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
DE102010053676A1 (de) 2010-12-07 2012-06-14 Coventya Spa Elektrolyt für die galvanische Abscheidung von Gold-Legierungen und Verfahren zu dessen Herstellung
CN105112953A (zh) * 2015-09-17 2015-12-02 深圳市瑞世兴科技有限公司 无氰镀金液

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475292A (en) 1966-02-10 1969-10-28 Technic Gold plating bath and process
US3562120A (en) * 1966-09-07 1971-02-09 Sel Rex Corp Plating of smooth,semibright gold deposits
US3644184A (en) * 1970-06-29 1972-02-22 Sel Rex Corp Electrolytic gold plating solutions and methods for using same
US3666640A (en) 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
US3776822A (en) * 1972-03-27 1973-12-04 Engelhard Min & Chem Gold plating electrolyte
US4012294A (en) * 1972-08-10 1977-03-15 Oxy Metal Industries Corporation Gold sulfite baths containing organophosphorous compounds
JPS5090538A (it) * 1973-12-13 1975-07-19
US3990954A (en) 1973-12-17 1976-11-09 Oxy Metal Industries Corporation Sulfite gold plating bath and process
DE2445538C2 (de) 1974-09-20 1984-05-30 Schering AG, 1000 Berlin und 4709 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen
JPS53129260A (en) * 1977-04-19 1978-11-11 Junkosha Co Ltd Production of continuous porous body comprising hydrophilic tetra fluorinated ethylene resin
US4199416A (en) 1977-05-03 1980-04-22 Johnson, Matthey & Co., Limited Composition for the electroplating of gold
CH622829A5 (it) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
JPS5531073A (en) * 1978-08-04 1980-03-05 Uniroyal Inc Phenolic esteramide antioxidant
JPS5534235A (en) * 1978-08-31 1980-03-10 Dainippon Toryo Co Ltd Coating composition
JPS5826436B2 (ja) * 1979-06-19 1983-06-02 ニナ アレクサンドロフナ スマグノヴア 金メツキ用の電解液
JPS5684495A (en) * 1979-12-12 1981-07-09 Electroplating Eng Of Japan Co Pure gold plating liquid
JPS56108892A (en) * 1980-01-31 1981-08-28 Electroplating Eng Of Japan Co Plating solution with pure gold
US4253920A (en) 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating

Also Published As

Publication number Publication date
AU561858B2 (en) 1987-05-21
JPS59143084A (ja) 1984-08-16
GB2134138A (en) 1984-08-08
NL8400075A (nl) 1984-08-16
GB8402223D0 (en) 1984-02-29
DE3400670C2 (it) 1989-07-06
DE3400670A1 (de) 1984-08-02
FR2540142A1 (fr) 1984-08-03
GB2134138B (en) 1987-08-19
BR8400347A (pt) 1984-09-04
CA1244373A (en) 1988-11-08
IT8447591A0 (it) 1984-01-25
AU2305383A (en) 1984-08-02
FR2540142B1 (fr) 1986-12-19
US4435253A (en) 1984-03-06
JPH0657877B2 (ja) 1994-08-03

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