BR8400347A - Solucao de eletrodeposicao e processo para eletrodeposicao de ouro - Google Patents
Solucao de eletrodeposicao e processo para eletrodeposicao de ouroInfo
- Publication number
- BR8400347A BR8400347A BR8400347A BR8400347A BR8400347A BR 8400347 A BR8400347 A BR 8400347A BR 8400347 A BR8400347 A BR 8400347A BR 8400347 A BR8400347 A BR 8400347A BR 8400347 A BR8400347 A BR 8400347A
- Authority
- BR
- Brazil
- Prior art keywords
- electrodeposition
- gold
- solution
- electrodeposition process
- electrodeposition solution
- Prior art date
Links
- 238000004070 electrodeposition Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/461,341 US4435253A (en) | 1983-01-28 | 1983-01-28 | Gold sulphite electroplating solutions and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8400347A true BR8400347A (pt) | 1984-09-04 |
Family
ID=23832180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8400347A BR8400347A (pt) | 1983-01-28 | 1984-01-27 | Solucao de eletrodeposicao e processo para eletrodeposicao de ouro |
Country Status (10)
Country | Link |
---|---|
US (1) | US4435253A (pt) |
JP (1) | JPH0657877B2 (pt) |
AU (2) | AU561858B2 (pt) |
BR (1) | BR8400347A (pt) |
CA (1) | CA1244373A (pt) |
DE (1) | DE3400670A1 (pt) |
FR (1) | FR2540142B1 (pt) |
GB (1) | GB2134138B (pt) |
IT (1) | IT1177510B (pt) |
NL (1) | NL8400075A (pt) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5129143A (en) * | 1982-11-29 | 1992-07-14 | Amp Incorporated | Durable plating for electrical contact terminals |
US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
DE4226167C2 (de) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik |
US5632438A (en) * | 1995-10-12 | 1997-05-27 | International Business Machines Corporation | Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization |
DE19745602C1 (de) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
DE10110743A1 (de) * | 2001-02-28 | 2002-09-05 | Wieland Dental & Technik Gmbh | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
US20050092616A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Baths, methods, and tools for superconformal deposition of conductive materials other than copper |
DE102005036133C5 (de) | 2005-07-26 | 2017-07-13 | Ivoclar Vivadent Ag | Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad |
US8420520B2 (en) * | 2006-05-18 | 2013-04-16 | Megica Corporation | Non-cyanide gold electroplating for fine-line gold traces and gold pads |
DE102009024396A1 (de) | 2009-06-09 | 2010-12-16 | Coventya Spa | Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen |
DE102010053676A1 (de) | 2010-12-07 | 2012-06-14 | Coventya Spa | Elektrolyt für die galvanische Abscheidung von Gold-Legierungen und Verfahren zu dessen Herstellung |
CN105112953A (zh) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | 无氰镀金液 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3475292A (en) | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
US3562120A (en) * | 1966-09-07 | 1971-02-09 | Sel Rex Corp | Plating of smooth,semibright gold deposits |
US3644184A (en) * | 1970-06-29 | 1972-02-22 | Sel Rex Corp | Electrolytic gold plating solutions and methods for using same |
US3666640A (en) | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
US3776822A (en) * | 1972-03-27 | 1973-12-04 | Engelhard Min & Chem | Gold plating electrolyte |
US4012294A (en) * | 1972-08-10 | 1977-03-15 | Oxy Metal Industries Corporation | Gold sulfite baths containing organophosphorous compounds |
JPS5090538A (pt) * | 1973-12-13 | 1975-07-19 | ||
US3990954A (en) | 1973-12-17 | 1976-11-09 | Oxy Metal Industries Corporation | Sulfite gold plating bath and process |
DE2445538C2 (de) | 1974-09-20 | 1984-05-30 | Schering AG, 1000 Berlin und 4709 Bergkamen | Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen |
JPS53129260A (en) * | 1977-04-19 | 1978-11-11 | Junkosha Co Ltd | Production of continuous porous body comprising hydrophilic tetra fluorinated ethylene resin |
US4199416A (en) | 1977-05-03 | 1980-04-22 | Johnson, Matthey & Co., Limited | Composition for the electroplating of gold |
CH622829A5 (pt) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
ZA794013B (en) * | 1978-08-04 | 1981-06-24 | Uniroyal Inc | Derivatives of 2-oxazolines as antioxidants |
JPS5534235A (en) * | 1978-08-31 | 1980-03-10 | Dainippon Toryo Co Ltd | Coating composition |
JPS5826436B2 (ja) * | 1979-06-19 | 1983-06-02 | ニナ アレクサンドロフナ スマグノヴア | 金メツキ用の電解液 |
JPS5684495A (en) * | 1979-12-12 | 1981-07-09 | Electroplating Eng Of Japan Co | Pure gold plating liquid |
JPS56108892A (en) * | 1980-01-31 | 1981-08-28 | Electroplating Eng Of Japan Co | Plating solution with pure gold |
US4253920A (en) | 1980-03-20 | 1981-03-03 | American Chemical & Refining Company, Incorporated | Composition and method for gold plating |
-
1983
- 1983-01-28 US US06/461,341 patent/US4435253A/en not_active Expired - Lifetime
- 1983-12-30 AU AU23053/84A patent/AU561858B2/en not_active Ceased
- 1983-12-30 AU AU2305383A patent/AU2305383A/xx active Pending
-
1984
- 1984-01-05 CA CA000444728A patent/CA1244373A/en not_active Expired
- 1984-01-10 NL NL8400075A patent/NL8400075A/nl not_active Application Discontinuation
- 1984-01-11 DE DE19843400670 patent/DE3400670A1/de active Granted
- 1984-01-19 FR FR8400801A patent/FR2540142B1/fr not_active Expired
- 1984-01-25 JP JP59011802A patent/JPH0657877B2/ja not_active Expired - Lifetime
- 1984-01-25 IT IT47591/84A patent/IT1177510B/it active
- 1984-01-27 BR BR8400347A patent/BR8400347A/pt not_active IP Right Cessation
- 1984-01-27 GB GB08402223A patent/GB2134138B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
AU2305383A (en) | 1984-08-02 |
GB2134138A (en) | 1984-08-08 |
US4435253A (en) | 1984-03-06 |
FR2540142A1 (fr) | 1984-08-03 |
JPH0657877B2 (ja) | 1994-08-03 |
IT8447591A0 (it) | 1984-01-25 |
AU561858B2 (en) | 1987-05-21 |
DE3400670C2 (pt) | 1989-07-06 |
JPS59143084A (ja) | 1984-08-16 |
DE3400670A1 (de) | 1984-08-02 |
IT1177510B (it) | 1987-08-26 |
FR2540142B1 (fr) | 1986-12-19 |
GB8402223D0 (en) | 1984-02-29 |
CA1244373A (en) | 1988-11-08 |
NL8400075A (nl) | 1984-08-16 |
GB2134138B (en) | 1987-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Lapse due to non-payment of fees (art. 50) |