IT1175968B - PROCEDURE FOR MANUFACTURING SEMICONDUCTOR MATERIALS AND RELATED EQUIPMENT - Google Patents
PROCEDURE FOR MANUFACTURING SEMICONDUCTOR MATERIALS AND RELATED EQUIPMENTInfo
- Publication number
- IT1175968B IT1175968B IT20408/84A IT2040884A IT1175968B IT 1175968 B IT1175968 B IT 1175968B IT 20408/84 A IT20408/84 A IT 20408/84A IT 2040884 A IT2040884 A IT 2040884A IT 1175968 B IT1175968 B IT 1175968B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- semiconductor materials
- manufacturing semiconductor
- related equipment
- equipment
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58060757A JPS59190300A (en) | 1983-04-08 | 1983-04-08 | Method and apparatus for production of semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8420408A0 IT8420408A0 (en) | 1984-04-05 |
IT1175968B true IT1175968B (en) | 1987-08-12 |
Family
ID=13151461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20408/84A IT1175968B (en) | 1983-04-08 | 1984-04-05 | PROCEDURE FOR MANUFACTURING SEMICONDUCTOR MATERIALS AND RELATED EQUIPMENT |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS59190300A (en) |
KR (1) | KR840008533A (en) |
DE (1) | DE3413082A1 (en) |
FR (2) | FR2543980A1 (en) |
GB (1) | GB2137524A (en) |
IT (1) | IT1175968B (en) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61219795A (en) * | 1985-03-25 | 1986-09-30 | Mitsubishi Metal Corp | Silicon single crystal wafer speedy in forming velocity of deposited nucleus and its production |
JPS61222999A (en) * | 1985-03-27 | 1986-10-03 | Dowa Mining Co Ltd | Method of improving electric characteristics of single crystal of compound semiconductor of group iii-v |
JPH0787187B2 (en) * | 1987-08-13 | 1995-09-20 | 古河電気工業株式会社 | Method for manufacturing GaAs compound semiconductor substrate |
JPS6472999A (en) * | 1987-09-14 | 1989-03-17 | Nippon Mining Co | Heat treatment of compound semiconductor single crystal |
JPS6472997A (en) * | 1987-09-14 | 1989-03-17 | Nippon Mining Co | Heat treatment of compound semiconductor single crystal |
WO1989008158A1 (en) * | 1988-02-24 | 1989-09-08 | Nippon Mining Co., Ltd. | Single crystal of compound semiconductor, process for its production and semiconductor device manufactured by using same |
US5209811A (en) * | 1988-03-25 | 1993-05-11 | Shin-Etsu Handotai Company Limited Of Japan | Method for heat-treating gallium arsenide monocrystals |
US5228927A (en) * | 1988-03-25 | 1993-07-20 | Shin-Etsu Handotai Company Limited | Method for heat-treating gallium arsenide monocrystals |
JPH0653639B2 (en) * | 1988-10-31 | 1994-07-20 | 株式会社ジャパンエナジー | Method for producing compound semiconductor single crystal |
JPH02263792A (en) * | 1989-03-31 | 1990-10-26 | Shin Etsu Handotai Co Ltd | Heat treatment of silicon |
JPH0633236B2 (en) * | 1989-09-04 | 1994-05-02 | 新日本製鐵株式会社 | Method and apparatus for heat treating silicon single crystal and manufacturing apparatus |
JPH04215439A (en) * | 1990-12-14 | 1992-08-06 | Nikko Kyodo Co Ltd | Manufacture of gaas single crystal substrate |
CN1280455C (en) | 1997-04-09 | 2006-10-18 | Memc电子材料有限公司 | Low defect density silicon |
DE69841714D1 (en) | 1997-04-09 | 2010-07-22 | Memc Electronic Materials | Silicon with low defect density and ideal oxygen precipitation |
JP2003517412A (en) * | 1998-06-26 | 2003-05-27 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | Method for growing defect-free silicon crystals with arbitrarily large diameter |
DE69908965T2 (en) | 1998-10-14 | 2004-05-13 | Memc Electronic Materials, Inc. | HEAT TEMPERATURE SINGLE CRYSTAL SILICON WITH LOW ERROR DENSITY |
US6284039B1 (en) | 1998-10-14 | 2001-09-04 | Memc Electronic Materials, Inc. | Epitaxial silicon wafers substantially free of grown-in defects |
US6312516B2 (en) | 1998-10-14 | 2001-11-06 | Memc Electronic Materials, Inc. | Process for preparing defect free silicon crystals which allows for variability in process conditions |
US7105050B2 (en) | 2000-11-03 | 2006-09-12 | Memc Electronic Materials, Inc. | Method for the production of low defect density silicon |
US6858307B2 (en) | 2000-11-03 | 2005-02-22 | Memc Electronic Materials, Inc. | Method for the production of low defect density silicon |
US6689209B2 (en) * | 2000-11-03 | 2004-02-10 | Memc Electronic Materials, Inc. | Process for preparing low defect density silicon using high growth rates |
US6846539B2 (en) | 2001-01-26 | 2005-01-25 | Memc Electronic Materials, Inc. | Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults |
WO2004003265A1 (en) * | 2002-07-01 | 2004-01-08 | Sumitomo Titanium Corporation | Silicon single crystal material and its production method |
MY157902A (en) | 2006-05-19 | 2016-08-15 | Memc Electronic Materials | Controlling agglomerated point defect and oxygen cluster formation induced by the lateral surface of a silicon single crystal during cz growth |
CN101660209B (en) * | 2009-06-25 | 2012-05-30 | 南安市三晶阳光电力有限公司 | Method and device for reducing polysilicon cast ingot stress |
CN102094248B (en) * | 2010-12-31 | 2012-07-11 | 东莞市中镓半导体科技有限公司 | Annealing device and method |
JP6287462B2 (en) * | 2014-03-27 | 2018-03-07 | 三菱マテリアル株式会社 | Electrode plate for plasma processing apparatus and method for manufacturing the same |
US11739437B2 (en) | 2018-12-27 | 2023-08-29 | Globalwafers Co., Ltd. | Resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1719021B1 (en) * | 1963-07-13 | 1969-09-11 | Siemens Ag | Method for reducing the cross section of a vertically arranged rod of semiconductor material |
CH458566A (en) * | 1967-08-14 | 1968-06-30 | Balzers Patent Beteilig Ag | Method and device for zone melting in a vacuum with electron beam bombardment |
GB1186127A (en) * | 1968-01-05 | 1970-04-02 | Dow Corning | Method and Apparatus for Doping Semiconductors. |
DE1769405B2 (en) * | 1968-05-18 | 1972-08-03 | Battelle-Entwicklungs-Gesellschaft mbH, 6000 Frankfurt | PROCESS FOR THE PRODUCTION OF SINGLE CRYSTALS FROM MELTABLE SUBSTANCES |
JPS5029405B1 (en) * | 1971-02-06 | 1975-09-23 | ||
US3737282A (en) * | 1971-10-01 | 1973-06-05 | Ibm | Method for reducing crystallographic defects in semiconductor structures |
DE2436490C3 (en) * | 1974-07-29 | 1978-12-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Process for phosphorus doping of weakly n-conducting silicon bodies |
GB2080780B (en) * | 1980-07-18 | 1983-06-29 | Secr Defence | Heat treatment of silicon slices |
JPS5750427A (en) * | 1980-09-12 | 1982-03-24 | Ushio Inc | Annealing device and annealing method |
GB2116871B (en) * | 1982-03-16 | 1985-11-13 | Vnii Monokristallov | Apparatus for growing single crystals from a melt using the czochralski method |
-
1983
- 1983-04-08 JP JP58060757A patent/JPS59190300A/en active Granted
-
1984
- 1984-02-07 FR FR8401838A patent/FR2543980A1/en not_active Withdrawn
- 1984-02-16 GB GB08404092A patent/GB2137524A/en not_active Withdrawn
- 1984-04-02 KR KR1019840001721A patent/KR840008533A/en not_active IP Right Cessation
- 1984-04-05 IT IT20408/84A patent/IT1175968B/en active
- 1984-04-06 DE DE19843413082 patent/DE3413082A1/en not_active Withdrawn
- 1984-05-30 FR FR8408514A patent/FR2543981A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2543980A1 (en) | 1984-10-12 |
JPH0453840B2 (en) | 1992-08-27 |
GB8404092D0 (en) | 1984-03-21 |
DE3413082A1 (en) | 1984-10-11 |
IT8420408A0 (en) | 1984-04-05 |
JPS59190300A (en) | 1984-10-29 |
FR2543981A1 (en) | 1984-10-12 |
GB2137524A (en) | 1984-10-10 |
KR840008533A (en) | 1984-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19940426 |