IT1163691B - Processo ed apparecchiatura di lucidatura di un pezzo da lavorare con liberta' di moviemtno di quest'ultimo - Google Patents

Processo ed apparecchiatura di lucidatura di un pezzo da lavorare con liberta' di moviemtno di quest'ultimo

Info

Publication number
IT1163691B
IT1163691B IT24956/79A IT2495679A IT1163691B IT 1163691 B IT1163691 B IT 1163691B IT 24956/79 A IT24956/79 A IT 24956/79A IT 2495679 A IT2495679 A IT 2495679A IT 1163691 B IT1163691 B IT 1163691B
Authority
IT
Italy
Prior art keywords
moviemtno
freedom
piece
work
polishing equipment
Prior art date
Application number
IT24956/79A
Other languages
English (en)
Italian (it)
Other versions
IT7924956A0 (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7924956A0 publication Critical patent/IT7924956A0/it
Application granted granted Critical
Publication of IT1163691B publication Critical patent/IT1163691B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IT24956/79A 1978-08-15 1979-08-07 Processo ed apparecchiatura di lucidatura di un pezzo da lavorare con liberta' di moviemtno di quest'ultimo IT1163691B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93370578A 1978-08-15 1978-08-15

Publications (2)

Publication Number Publication Date
IT7924956A0 IT7924956A0 (it) 1979-08-07
IT1163691B true IT1163691B (it) 1987-04-08

Family

ID=25464383

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24956/79A IT1163691B (it) 1978-08-15 1979-08-07 Processo ed apparecchiatura di lucidatura di un pezzo da lavorare con liberta' di moviemtno di quest'ultimo

Country Status (5)

Country Link
EP (1) EP0008360B1 (de)
JP (1) JPS5531582A (de)
CA (1) CA1106611A (de)
DE (1) DE2961004D1 (de)
IT (1) IT1163691B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639406Y2 (de) * 1981-01-22 1988-03-19
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US6081959A (en) * 1996-07-01 2000-07-04 Umbrell; Richard Buffer centering system
US6105197A (en) * 1998-04-14 2000-08-22 Umbrell; Richard T. Centering system for buffing pad
US6298518B1 (en) 1998-04-14 2001-10-09 Richard T. Umbrell Heat dissipating buffing pad
DE10004578C1 (de) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante
DE102004010379A1 (de) * 2004-03-03 2005-09-22 Schott Ag Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile
JP5421628B2 (ja) * 2009-03-23 2014-02-19 富士紡ホールディングス株式会社 研磨布および研磨布の製造方法
JP5545536B2 (ja) * 2010-04-27 2014-07-09 株式会社Ｓｕｍｃｏ ウェーハの研磨方法、研磨パッド、研磨装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7010086A (de) * 1969-07-18 1971-01-20
US3715842A (en) * 1970-07-02 1973-02-13 Tizon Chem Corp Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces
NL7114274A (de) * 1970-10-21 1972-04-25
US3691694A (en) * 1970-11-02 1972-09-19 Ibm Wafer polishing machine
DE2305188A1 (de) * 1973-02-02 1974-08-08 Wacker Chemitronic Verfahren zur herstellung von polierten halbleiteroberflaechen
JPS5363695A (en) * 1976-11-17 1978-06-07 Hitachi Ltd Method of finish polishing

Also Published As

Publication number Publication date
EP0008360B1 (de) 1981-10-14
JPS6234509B2 (de) 1987-07-27
JPS5531582A (en) 1980-03-05
DE2961004D1 (en) 1981-12-24
EP0008360A1 (de) 1980-03-05
CA1106611A (en) 1981-08-11
IT7924956A0 (it) 1979-08-07

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