IT1160373B - Struttura d'interconnessione di circuiti integrati - Google Patents

Struttura d'interconnessione di circuiti integrati

Info

Publication number
IT1160373B
IT1160373B IT7831078A IT3107878A IT1160373B IT 1160373 B IT1160373 B IT 1160373B IT 7831078 A IT7831078 A IT 7831078A IT 3107878 A IT3107878 A IT 3107878A IT 1160373 B IT1160373 B IT 1160373B
Authority
IT
Italy
Prior art keywords
integrated circuits
interconnection structure
interconnection
circuits
integrated
Prior art date
Application number
IT7831078A
Other languages
English (en)
Italian (it)
Other versions
IT7831078A0 (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7831078A0 publication Critical patent/IT7831078A0/it
Application granted granted Critical
Publication of IT1160373B publication Critical patent/IT1160373B/it

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/018—Coupling arrangements; Interface arrangements using bipolar transistors only
    • H03K19/01825—Coupling arrangements, impedance matching circuits
    • H03K19/01831—Coupling arrangements, impedance matching circuits with at least one differential stage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0005—Modifications of input or output impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/40—Resistors
    • H10D1/43—Resistors having PN junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
IT7831078A 1977-12-30 1978-12-21 Struttura d'interconnessione di circuiti integrati IT1160373B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/865,808 US4228369A (en) 1977-12-30 1977-12-30 Integrated circuit interconnection structure having precision terminating resistors

Publications (2)

Publication Number Publication Date
IT7831078A0 IT7831078A0 (it) 1978-12-21
IT1160373B true IT1160373B (it) 1987-03-11

Family

ID=25346278

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7831078A IT1160373B (it) 1977-12-30 1978-12-21 Struttura d'interconnessione di circuiti integrati

Country Status (5)

Country Link
US (1) US4228369A (en, 2012)
EP (1) EP0002751B1 (en, 2012)
JP (1) JPS5494278A (en, 2012)
DE (1) DE2861897D1 (en, 2012)
IT (1) IT1160373B (en, 2012)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922414B2 (ja) 1980-10-08 1984-05-26 富士通株式会社 ラインドライバ回路
US4553050A (en) * 1983-12-27 1985-11-12 International Business Machines Corporation Transmission line terminator-decoupling capacitor chip for off-chip driver
US4748426A (en) * 1986-11-07 1988-05-31 Rodime Plc Active termination circuit for computer interface use
JPS63193389A (ja) * 1987-02-06 1988-08-10 Matsushita Electric Ind Co Ltd 輸送ロツク装置
US4779270A (en) * 1987-04-15 1988-10-18 International Business Machines Corporation Apparatus for reducing and maintaining constant overshoot in a high speed driver
US4859877A (en) * 1988-01-04 1989-08-22 Gte Laboratories Incorporated Bidirectional digital signal transmission system
JPH02292773A (ja) * 1989-05-02 1990-12-04 Pioneer Electron Corp 複数ディスク収納プレーヤ
US5006820A (en) * 1989-07-03 1991-04-09 Motorola, Inc. Low reflection input configuration for integrated circuit packages
US5166561A (en) * 1991-07-25 1992-11-24 Northern Telecom Limited Active intelligent termination
US5519353A (en) * 1992-06-09 1996-05-21 At&T Corp. Balanced driver circuit for eliminating inductive noise
US5396198A (en) * 1992-09-09 1995-03-07 Hitachi, Ltd. Electronic circuit device having a series connection of resistor and capacitance as a noise reducing circuit connected to a power source wiring
US5304856A (en) * 1992-12-17 1994-04-19 At&T Bell Laboratories Article comprising a balanced driver circuit with less power dissipation than conventional circuit
DE4329639A1 (de) * 1993-09-02 1995-03-09 Telefunken Microelectron Schaltungsanordnung mit gesteuerten Pinch-Widerständen
SE502835C2 (sv) * 1994-11-23 1996-01-29 Ellemtel Utvecklings Ab Termineringsnätsrelaterat kopplingsarrangemang
US6418500B1 (en) * 1999-02-12 2002-07-09 Fujitsu Limited Feedback control for termination adjustment
US6280011B1 (en) 1999-08-16 2001-08-28 Hewlett-Packard Company Circuit and assembly with selectable resistance low voltage differential signal receiver
US6424169B1 (en) 2000-01-24 2002-07-23 Broadcom Corporation Active termination network
US6816987B1 (en) 2000-03-25 2004-11-09 Broadcom Corporation Apparatus and method for built-in self-test of a data communications system
US6335632B1 (en) 2000-05-30 2002-01-01 International Business Machines Corporation CMOS small signal switchable terminator network
JP3495346B2 (ja) 2000-05-30 2004-02-09 インターナショナル・ビジネス・マシーンズ・コーポレーション ターミネータおよびネットワークの使用方法
US6281702B1 (en) 2000-05-30 2001-08-28 International Business Machines Corporation CMOS small signal terminated hysteresis receiver
US6356103B1 (en) 2000-05-30 2002-03-12 International Business Machines Corporation CMOS small signal terminator and network
US6262591B1 (en) 2000-05-30 2001-07-17 International Business Machines Corporation SOI small signal terminated receiver
US6259269B1 (en) 2000-05-30 2001-07-10 International Business Machines Corporation Soi small signal terminated hysteresis receiver
US6359464B1 (en) 2000-05-30 2002-03-19 International Business Machines Corporation Method of use with a terminator and network
US6400178B1 (en) 2000-05-30 2002-06-04 International Business Machines Corporation CMOS small signal terminated receiver
US6420897B1 (en) 2000-05-30 2002-07-16 International Business Machines Corporation SOI small signal terminator and network
US6359465B1 (en) 2000-05-30 2002-03-19 International Business Machines Corporation CMOS small signal switchable adjustable impedence terminator network
US6310490B1 (en) 2000-05-30 2001-10-30 International Business Machines Corporation CMOS small signal switchable, impedence and voltage adjustable terminator network and receiver integration
US6356104B1 (en) 2000-05-30 2002-03-12 International Business Machines Corporation CMOS small signal switchable, impedence and voltage adjustable terminator network
US6373276B1 (en) 2000-05-31 2002-04-16 International Business Machines Corporation CMOS small signal switchable impedence and voltage adjustable terminator with hysteresis receiver network
TWI264052B (en) * 2005-08-19 2006-10-11 Silicon Integrated Sys Corp A switch on a package substrate for switching functions of circuit and switching method for switching functions of circuit
US10510823B2 (en) * 2016-10-12 2019-12-17 Mediatek Inc. Impedance circuit with poly-resistor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281721A (en) * 1962-05-11 1966-10-25 Sperry Rand Corp Impedance matching system
US3168656A (en) * 1962-06-18 1965-02-02 Tektronix Inc Transmission line circuit having termination impedance which includes emitter junction of transistor
GB1028656A (en) * 1963-03-22 1966-05-04 Rca Corp Transistor logic circuits
US3581244A (en) * 1969-01-28 1971-05-25 Rca Corp Automatic impedance matching circuits for variable frequency source
CH495669A (de) * 1969-11-13 1970-08-31 Abdel Latif Mahmoud Anordnung mit durch Übertragungsleitungen verbundenen integrierten Schaltkreisen und mit Mitteln zur Vermeidung von Leitungs-Reflexionen
US3660675A (en) * 1970-05-05 1972-05-02 Honeywell Inc Transmission line series termination network for interconnecting high speed logic circuits
US3828281A (en) * 1973-02-26 1974-08-06 Lorain Prod Corp Impedance simulating circuit for transmission lines
US4015147A (en) * 1974-06-26 1977-03-29 International Business Machines Corporation Low power transmission line terminator
JPS51123085A (en) * 1975-04-18 1976-10-27 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit

Also Published As

Publication number Publication date
DE2861897D1 (en) 1982-07-29
JPS5494278A (en) 1979-07-25
US4228369A (en) 1980-10-14
EP0002751B1 (de) 1982-06-09
JPS6358374B2 (en, 2012) 1988-11-15
IT7831078A0 (it) 1978-12-21
EP0002751A1 (de) 1979-07-11

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