IT1115709B - Apparecchiatura di saldatura perfezionata - Google Patents

Apparecchiatura di saldatura perfezionata

Info

Publication number
IT1115709B
IT1115709B IT2089177A IT2089177A IT1115709B IT 1115709 B IT1115709 B IT 1115709B IT 2089177 A IT2089177 A IT 2089177A IT 2089177 A IT2089177 A IT 2089177A IT 1115709 B IT1115709 B IT 1115709B
Authority
IT
Italy
Prior art keywords
perfected
welding equipment
welding
equipment
perfected welding
Prior art date
Application number
IT2089177A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1115709B publication Critical patent/IT1115709B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
IT2089177A 1976-03-16 1977-03-04 Apparecchiatura di saldatura perfezionata IT1115709B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66781176A 1976-03-16 1976-03-16
US05/751,919 US4171477A (en) 1976-03-16 1976-12-17 Micro-surface welding

Publications (1)

Publication Number Publication Date
IT1115709B true IT1115709B (it) 1986-02-03

Family

ID=27099774

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2089177A IT1115709B (it) 1976-03-16 1977-03-04 Apparecchiatura di saldatura perfezionata

Country Status (7)

Country Link
US (1) US4171477A (it)
JP (1) JPS5824941B2 (it)
DE (1) DE2710835C3 (it)
FR (1) FR2345053A1 (it)
GB (1) GB1530537A (it)
IN (1) IN147651B (it)
IT (1) IT1115709B (it)

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US4340803A (en) * 1979-11-20 1982-07-20 Rca Corporation Method for interconnecting solar cells
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
GB2125720B (en) * 1982-08-24 1986-11-05 Asm Assembly Automation Ltd Wire bonding apparatus
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
JPS60243549A (ja) * 1984-05-05 1985-12-03 ゲゼルシヤフト、フユール、ゲレーテバウ、ミツト、ベシユレンクテル、ハフツング ガスの触媒燃焼用のセンサの製造方法
US4697058A (en) * 1986-04-28 1987-09-29 International Business Machines Corporation Microweld apparatus with an improved electrode tip design and tip support
USH487H (en) 1986-07-14 1988-07-05 The United States Of America As Represented By The Secretary Of The Air Force Direct cable attach method
US4772498A (en) * 1986-11-20 1988-09-20 Air Products And Chemicals, Inc. Silicon carbide capillaries
US4861533A (en) * 1986-11-20 1989-08-29 Air Products And Chemicals, Inc. Method of preparing silicon carbide capillaries
US4950866A (en) * 1987-12-08 1990-08-21 Hitachi, Ltd. Method and apparatus of bonding insulated and coated wire
DE4007292C1 (it) * 1990-03-08 1991-06-27 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
US5253415A (en) * 1990-03-20 1993-10-19 Die Tech, Inc. Method of making an integrated circuit substrate lead assembly
US5115111A (en) * 1990-08-06 1992-05-19 Hughes Aircraft Company Dual tip rotating welding electrode
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5097100A (en) * 1991-01-25 1992-03-17 Sundstrand Data Control, Inc. Noble metal plated wire and terminal assembly, and method of making the same
JPH0813423B2 (ja) * 1991-12-27 1996-02-14 株式会社セイワ製作所 アルミニウム箔の溶接方法
US5360958A (en) * 1993-05-17 1994-11-01 Delco Electronics Corporation Welding apparatus having coaxial welding electrodes
DE4323149A1 (de) * 1993-07-10 1995-01-12 Audi Ag Elektrode zum Widerstandsschweißen
EP0922524B1 (en) * 1997-04-22 2002-01-09 F & K Delvotec Bondtechnik GmbH Wire guide for a bonding machine
US5950070A (en) * 1997-05-15 1999-09-07 Kulicke & Soffa Investments Method of forming a chip scale package, and a tool used in forming the chip scale package
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US6651864B2 (en) * 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US6396080B2 (en) * 1999-05-18 2002-05-28 Cree, Inc Semi-insulating silicon carbide without vanadium domination
US20040149713A1 (en) * 1999-08-18 2004-08-05 Hyperion Innovations, Inc. Cordless soldering iron
US6646228B2 (en) * 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
DE10006764C1 (de) * 2000-02-15 2002-04-18 Heraeus Electro Nite Int Elektrische Verbindung
JP3548509B2 (ja) * 2000-06-07 2004-07-28 諏訪熱工業株式会社 パルス通電接合方法及び接合装置並びに接合体
US6522525B1 (en) 2000-11-03 2003-02-18 Cardiac Pacemakers, Inc. Implantable heart monitors having flat capacitors with curved profiles
US7355841B1 (en) 2000-11-03 2008-04-08 Cardiac Pacemakers, Inc. Configurations and methods for making capacitor connections
US7456077B2 (en) 2000-11-03 2008-11-25 Cardiac Pacemakers, Inc. Method for interconnecting anodes and cathodes in a flat capacitor
US6684102B1 (en) 2000-11-03 2004-01-27 Cardiac Pacemakers, Inc. Implantable heart monitors having capacitors with endcap headers
US6833987B1 (en) 2000-11-03 2004-12-21 Cardiac Pacemakers, Inc. Flat capacitor having an active case
US7107099B1 (en) 2000-11-03 2006-09-12 Cardiac Pacemakers, Inc. Capacitor having a feedthrough assembly with a coupling member
US6509588B1 (en) 2000-11-03 2003-01-21 Cardiac Pacemakers, Inc. Method for interconnecting anodes and cathodes in a flat capacitor
US6687118B1 (en) 2000-11-03 2004-02-03 Cardiac Pacemakers, Inc. Flat capacitor having staked foils and edge-connected connection members
US6699265B1 (en) 2000-11-03 2004-03-02 Cardiac Pacemakers, Inc. Flat capacitor for an implantable medical device
DE10114355A1 (de) * 2001-03-22 2002-10-17 Intec Holding Gmbh Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte
CN1139453C (zh) * 2001-06-12 2004-02-25 杨仕桐 点电焊焊头
US6520399B1 (en) * 2001-09-14 2003-02-18 Raytheon Company Thermosonic bonding apparatus, tool, and method
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US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
US7180727B2 (en) * 2004-07-16 2007-02-20 Cardiac Pacemakers, Inc. Capacitor with single sided partial etch and stake
US7120008B2 (en) * 2004-07-16 2006-10-10 Cardiac Pacemakers, Inc. Method and apparatus for capacitor interconnection using a metal spray
US7327552B2 (en) * 2005-05-09 2008-02-05 Cardiac Pacemakers, Inc. Method and apparatus for electrically connecting capacitor electrodes using a spray
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
CN100360270C (zh) * 2005-12-23 2008-01-09 杨仕桐 连体电极的电阻焊焊头及其制备方法
TWI343611B (en) * 2007-06-08 2011-06-11 Orient Semiconductor Elect Ltd Semiconductor package and method for discharging electronic devices on a substrate
JP5804644B2 (ja) * 2012-02-21 2015-11-04 超音波工業株式会社 超音波ワイヤボンディング装置および超音波ワイヤボンディング方法
US8952292B2 (en) * 2012-04-17 2015-02-10 Caterpillar Inc. Adjustable welding head for multiple electrode cladding
DE102013104207A1 (de) * 2013-04-25 2014-11-13 Epcos Ag Vorrichtung und Verfahren zur Herstellung einer elektrisch leitfähigen und mechanischen Verbindung
HK1193540A2 (en) * 2013-07-26 2014-09-19 Cardmatix Co. Ltd. A method of manufacturing a smart card
EP3688668B8 (en) * 2017-09-29 2022-08-24 Avery Dennison Retail Information Services LLC Strap mounting techniques for wire format antennas
US11791304B2 (en) * 2019-04-09 2023-10-17 Kaijo Corporation Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
JP7483255B2 (ja) * 2020-08-19 2024-05-15 ナグシステム株式会社 蓄勢式溶接機

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US3342972A (en) * 1964-01-22 1967-09-19 Aerojet General Co Welding electrode assembly
US3297855A (en) * 1964-06-26 1967-01-10 Ibm Method of bonding
US3435184A (en) * 1965-07-12 1969-03-25 Gen Time Corp Parallel gap welding
JPS4837221A (it) * 1971-09-10 1973-06-01

Also Published As

Publication number Publication date
DE2710835C3 (de) 1981-05-27
GB1530537A (en) 1978-11-01
IN147651B (it) 1980-05-17
FR2345053A1 (fr) 1977-10-14
DE2710835A1 (de) 1977-09-29
JPS5824941B2 (ja) 1983-05-24
DE2710835B2 (de) 1980-09-04
JPS52112277A (en) 1977-09-20
US4171477A (en) 1979-10-16
FR2345053B1 (it) 1980-12-19

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