IT1102177B - Procedimento di realizzazione di transistori ad effetto di campo di tipo mos e transistori realizzati secondo un tale procedimento - Google Patents
Procedimento di realizzazione di transistori ad effetto di campo di tipo mos e transistori realizzati secondo un tale procedimentoInfo
- Publication number
- IT1102177B IT1102177B IT48972/78A IT4897278A IT1102177B IT 1102177 B IT1102177 B IT 1102177B IT 48972/78 A IT48972/78 A IT 48972/78A IT 4897278 A IT4897278 A IT 4897278A IT 1102177 B IT1102177 B IT 1102177B
- Authority
- IT
- Italy
- Prior art keywords
- transistors
- procedure
- type field
- realized according
- mos type
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
- H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
- H10P32/141—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer comprising oxides only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
- H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
- H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/141—Self-alignment coat gate
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7711912A FR2388410A1 (fr) | 1977-04-20 | 1977-04-20 | Procede de realisation de transistors a effet de champ de type mos, et transistors realises selon un tel procede |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT7848972A0 IT7848972A0 (it) | 1978-04-19 |
| IT1102177B true IT1102177B (it) | 1985-10-07 |
Family
ID=9189666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT48972/78A IT1102177B (it) | 1977-04-20 | 1978-04-19 | Procedimento di realizzazione di transistori ad effetto di campo di tipo mos e transistori realizzati secondo un tale procedimento |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4160683A (it) |
| DE (1) | DE2817342A1 (it) |
| FR (1) | FR2388410A1 (it) |
| GB (1) | GB1594537A (it) |
| IT (1) | IT1102177B (it) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140483A (en) * | 1978-04-21 | 1979-10-31 | Nec Corp | Semiconductor device |
| JPS55163860A (en) * | 1979-06-06 | 1980-12-20 | Toshiba Corp | Manufacture of semiconductor device |
| US4280855A (en) * | 1980-01-23 | 1981-07-28 | Ibm Corporation | Method of making a dual DMOS device by ion implantation and diffusion |
| US5202574A (en) * | 1980-05-02 | 1993-04-13 | Texas Instruments Incorporated | Semiconductor having improved interlevel conductor insulation |
| US4317276A (en) * | 1980-06-12 | 1982-03-02 | Teletype Corporation | Method of manufacturing an insulated gate field-effect transistor therefore in a silicon wafer |
| US4356623A (en) * | 1980-09-15 | 1982-11-02 | Texas Instruments Incorporated | Fabrication of submicron semiconductor devices |
| US4366613A (en) * | 1980-12-17 | 1983-01-04 | Ibm Corporation | Method of fabricating an MOS dynamic RAM with lightly doped drain |
| FR2525389A1 (fr) * | 1982-04-14 | 1983-10-21 | Commissariat Energie Atomique | Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre |
| US4830975A (en) * | 1983-01-13 | 1989-05-16 | National Semiconductor Corporation | Method of manufacture a primos device |
| US4553315A (en) * | 1984-04-05 | 1985-11-19 | Harris Corporation | N Contact compensation technique |
| US4818714A (en) * | 1987-12-02 | 1989-04-04 | Advanced Micro Devices, Inc. | Method of making a high performance MOS device having LDD regions with graded junctions |
| US5015595A (en) * | 1988-09-09 | 1991-05-14 | Advanced Micro Devices, Inc. | Method of making a high performance MOS device having both P- and N-LDD regions using single photoresist mask |
| JP3426043B2 (ja) * | 1994-09-27 | 2003-07-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6933237B2 (en) * | 2002-06-21 | 2005-08-23 | Hewlett-Packard Development Company, L.P. | Substrate etch method and device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USB381501I5 (it) * | 1964-07-09 | |||
| GB1187611A (en) * | 1966-03-23 | 1970-04-08 | Matsushita Electronics Corp | Method of manufacturing Semiconductors Device |
| US3434021A (en) * | 1967-01-13 | 1969-03-18 | Rca Corp | Insulated gate field effect transistor |
| US3837071A (en) * | 1973-01-16 | 1974-09-24 | Rca Corp | Method of simultaneously making a sigfet and a mosfet |
| US3959025A (en) * | 1974-05-01 | 1976-05-25 | Rca Corporation | Method of making an insulated gate field effect transistor |
-
1977
- 1977-04-20 FR FR7711912A patent/FR2388410A1/fr active Granted
-
1978
- 1978-04-17 US US05/897,169 patent/US4160683A/en not_active Expired - Lifetime
- 1978-04-18 GB GB15315/78A patent/GB1594537A/en not_active Expired
- 1978-04-19 IT IT48972/78A patent/IT1102177B/it active
- 1978-04-20 DE DE19782817342 patent/DE2817342A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2388410B1 (it) | 1981-11-13 |
| GB1594537A (en) | 1981-07-30 |
| FR2388410A1 (fr) | 1978-11-17 |
| IT7848972A0 (it) | 1978-04-19 |
| US4160683A (en) | 1979-07-10 |
| DE2817342A1 (de) | 1978-10-26 |
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