IT1091594B - Metodo per la passivazione dell'intercetta superficiale di una giunzione pn - Google Patents

Metodo per la passivazione dell'intercetta superficiale di una giunzione pn

Info

Publication number
IT1091594B
IT1091594B IT19030/78A IT1903078A IT1091594B IT 1091594 B IT1091594 B IT 1091594B IT 19030/78 A IT19030/78 A IT 19030/78A IT 1903078 A IT1903078 A IT 1903078A IT 1091594 B IT1091594 B IT 1091594B
Authority
IT
Italy
Prior art keywords
passivating
junction
surface intercept
intercept
Prior art date
Application number
IT19030/78A
Other languages
English (en)
Other versions
IT7819030A0 (it
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of IT7819030A0 publication Critical patent/IT7819030A0/it
Application granted granted Critical
Publication of IT1091594B publication Critical patent/IT1091594B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
    • H10P14/69391—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing aluminium, e.g. Al2O3
IT19030/78A 1977-02-24 1978-01-04 Metodo per la passivazione dell'intercetta superficiale di una giunzione pn IT1091594B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77168177A 1977-02-24 1977-02-24

Publications (2)

Publication Number Publication Date
IT7819030A0 IT7819030A0 (it) 1978-01-04
IT1091594B true IT1091594B (it) 1985-07-06

Family

ID=25092625

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19030/78A IT1091594B (it) 1977-02-24 1978-01-04 Metodo per la passivazione dell'intercetta superficiale di una giunzione pn

Country Status (10)

Country Link
JP (1) JPS53105978A (it)
BE (1) BE864270A (it)
DE (1) DE2806493A1 (it)
FR (1) FR2382094B1 (it)
GB (1) GB1552759A (it)
IN (1) IN147572B (it)
IT (1) IT1091594B (it)
PL (1) PL116754B1 (it)
SE (1) SE7801091L (it)
YU (1) YU14978A (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344985A (en) 1981-03-27 1982-08-17 Rca Corporation Method of passivating a semiconductor device with a multi-layer passivant system by thermally growing a layer of oxide on an oxygen doped polycrystalline silicon layer
US4420765A (en) 1981-05-29 1983-12-13 Rca Corporation Multi-layer passivant system
JPS6312166U (it) * 1986-07-08 1988-01-26
CA1339817C (en) * 1989-05-31 1998-04-14 Mitel Corporation Curing and passivation of spin-on-glasses by a plasma process, and product produced thereby
JPH0316373U (it) * 1989-06-28 1991-02-19

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1274736C2 (de) * 1964-12-03 1974-02-07 Verfahren zur herstellung einer halbleitervorrichtung
GB1250099A (it) * 1969-04-14 1971-10-20
JPS532552B2 (it) * 1974-03-30 1978-01-28
US3895127A (en) * 1974-04-19 1975-07-15 Rca Corp Method of selectively depositing glass on semiconductor devices
NL7500492A (nl) * 1975-01-16 1976-07-20 Philips Nv Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze.
US4007476A (en) * 1975-04-21 1977-02-08 Hutson Jearld L Technique for passivating semiconductor devices

Also Published As

Publication number Publication date
YU14978A (en) 1982-10-31
FR2382094A1 (fr) 1978-09-22
GB1552759A (en) 1979-09-19
PL116754B1 (en) 1981-06-30
BE864270A (fr) 1978-06-16
PL204820A1 (pl) 1978-11-06
JPS53105978A (en) 1978-09-14
FR2382094B1 (fr) 1985-07-19
JPS5626980B2 (it) 1981-06-22
IT7819030A0 (it) 1978-01-04
IN147572B (it) 1980-04-19
SE7801091L (sv) 1978-08-25
DE2806493A1 (de) 1978-08-31

Similar Documents

Publication Publication Date Title
IT1110832B (it) Dispositivo per la regolarizzazione della profondita' di un solco
IT1122253B (it) Perfezionata paletta di turbomacchina
IT7951211A0 (it) Procedimento per produrre copolimeri di propilene
IT8020439A0 (it) Sommita' di paletta a scala per turbomacchine.
IT7926748A0 (it) Procedimento per la preparazione di smalti termo-indurenti a base pre valentemente di copolimeri in dispersione acquosa
IT1112931B (it) Laser a semiconduttore e procedimento per la fabbricazione di un laser a semiconduttore
JPS5489570A (en) Method of forming junction on surface of semiconductor
IT1101536B (it) Disposizione di raddrizzatori a semiconduttori
IT1109323B (it) Procedimento per la produzione di copolimeri molli di etilene-butene-1
IT1113323B (it) Procedimento per la produzione di copolimeri a blocchi di propilene-etilene
IT1116178B (it) Procedimento per la preparazione di supposte
IT1091594B (it) Metodo per la passivazione dell'intercetta superficiale di una giunzione pn
IT1134592B (it) Apparecchiatura per applicare una corrente di gas caldo ad un'area ben definita
IT1102762B (it) Macchina per la fabbricazione di involuori c'imballaggio
IT7828114A0 (it) Procedimento per l'applicazione di rivestimenti e macchina per attuare il procedimento.
IT1114217B (it) Procedimento per la fabbricazione monoetilfosfito d'alluminio
IT7827008A0 (it) Procedimento per incrementare la velocita' di idrogenazione di poliolefine.
IT1112737B (it) Procedimento per la fabbricazione di oggetti di nitrudo di silicio
IT1106616B (it) Metodo per la preparazione di 2/2 ditiodianilina
IT1098369B (it) Procedimento per la preparazione di un ciclopentendione
IT1110139B (it) Attrezzo per l'imbutitura idromeccanica
IT1096109B (it) Metodo per formare una carcassa di pneumatico avente un'apertura per valvola
IT1075522B (it) Processo per la preparazione dell'1-metil-2-(carbomoilossimetil)-5-nitroimidazolo
IT1096093B (it) Impianto per l'applicazione di laminati
IT1095994B (it) Impianto per l'applicazione di laminati

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970129