IT1082701B - Incapsulanti di semiconduttori ritardanti di fiamma a base di epossidi e novolacca - Google Patents
Incapsulanti di semiconduttori ritardanti di fiamma a base di epossidi e novolaccaInfo
- Publication number
- IT1082701B IT1082701B IT6701277A IT6701277A IT1082701B IT 1082701 B IT1082701 B IT 1082701B IT 6701277 A IT6701277 A IT 6701277A IT 6701277 A IT6701277 A IT 6701277A IT 1082701 B IT1082701 B IT 1082701B
- Authority
- IT
- Italy
- Prior art keywords
- novolacca
- semiconductors
- epoxy
- flame retardant
- based flame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64842476A | 1976-01-12 | 1976-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1082701B true IT1082701B (it) | 1985-05-21 |
Family
ID=24600721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT6701277A IT1082701B (it) | 1976-01-12 | 1977-01-05 | Incapsulanti di semiconduttori ritardanti di fiamma a base di epossidi e novolacca |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5286069A (it) |
DE (1) | DE2700363A1 (it) |
FR (1) | FR2337752A1 (it) |
GB (1) | GB1532592A (it) |
IT (1) | IT1082701B (it) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2732733A1 (de) * | 1977-07-20 | 1979-02-08 | Allied Chem | Epoxyformmasse und deren verwendung |
US4282136A (en) * | 1979-04-09 | 1981-08-04 | Hunt Earl R | Flame retardant epoxy molding compound method and encapsulated device |
DE3027140A1 (de) * | 1979-07-20 | 1981-02-19 | Ciba Geigy Ag | Haertbare epoxidharzgemische und ihre verwendung |
JPS5667948A (en) * | 1979-11-07 | 1981-06-08 | Toshiba Corp | Resin for sealing semiconductor element |
JPS6178823A (ja) * | 1984-09-27 | 1986-04-22 | Toshiba Corp | エポキシ樹脂組成物 |
CA1288189C (en) * | 1986-01-20 | 1991-08-27 | Glenda C. Young | Epoxy resin composition |
GB2210377A (en) * | 1987-09-25 | 1989-06-07 | Plessey Co Plc | Microencapsulated flame retardant: encapsulated semiconductor |
US6548576B1 (en) * | 2001-11-07 | 2003-04-15 | Bourns, Inc. | Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
DE102006012839B4 (de) * | 2006-03-21 | 2008-05-29 | Vacuumschmelze Gmbh & Co. Kg | Lackzusammensetzung und deren Verwendung |
EP2776485A1 (en) * | 2011-11-08 | 2014-09-17 | Dow Global Technologies LLC | Curable compositions |
CN104364289A (zh) * | 2012-06-15 | 2015-02-18 | 陶氏环球技术有限责任公司 | 可固化组合物 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL291723A (it) * | 1962-04-20 | 1900-01-01 | ||
US3813379A (en) * | 1970-12-14 | 1974-05-28 | Motorola Inc | Thermally stabilized thermosetting plastic material,and article |
JPS512385A (ja) * | 1974-06-24 | 1976-01-09 | Hitachi Ltd | Handotaisochifushojushisoseibutsu |
-
1977
- 1977-01-05 IT IT6701277A patent/IT1082701B/it active
- 1977-01-07 DE DE19772700363 patent/DE2700363A1/de not_active Withdrawn
- 1977-01-07 FR FR7700421A patent/FR2337752A1/fr active Pending
- 1977-01-11 GB GB97577A patent/GB1532592A/en not_active Expired
- 1977-01-11 JP JP124477A patent/JPS5286069A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5286069A (en) | 1977-07-16 |
DE2700363A1 (de) | 1977-07-14 |
GB1532592A (en) | 1978-11-15 |
FR2337752A1 (fr) | 1977-08-05 |
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