IT1057575B - Procedimento e dispositivo per il collegamento di componenti elettronici - Google Patents

Procedimento e dispositivo per il collegamento di componenti elettronici

Info

Publication number
IT1057575B
IT1057575B IT2115976A IT2115976A IT1057575B IT 1057575 B IT1057575 B IT 1057575B IT 2115976 A IT2115976 A IT 2115976A IT 2115976 A IT2115976 A IT 2115976A IT 1057575 B IT1057575 B IT 1057575B
Authority
IT
Italy
Prior art keywords
procedure
connection
electronic components
electronic
components
Prior art date
Application number
IT2115976A
Other languages
English (en)
Italian (it)
Inventor
G Nicolas
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of IT1057575B publication Critical patent/IT1057575B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IT2115976A 1975-03-12 1976-03-12 Procedimento e dispositivo per il collegamento di componenti elettronici IT1057575B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (fr) 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques

Publications (1)

Publication Number Publication Date
IT1057575B true IT1057575B (it) 1982-03-30

Family

ID=9152470

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2115976A IT1057575B (it) 1975-03-12 1976-03-12 Procedimento e dispositivo per il collegamento di componenti elettronici

Country Status (5)

Country Link
JP (1) JPS6015160B2 (cg-RX-API-DMAC7.html)
DE (1) DE2610283C2 (cg-RX-API-DMAC7.html)
FR (1) FR2304247A1 (cg-RX-API-DMAC7.html)
GB (1) GB1504252A (cg-RX-API-DMAC7.html)
IT (1) IT1057575B (cg-RX-API-DMAC7.html)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
JPS5558573A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Manufacture of mis semiconductor device
DE3051232C2 (de) * 1979-09-28 1995-02-23 Cii Honeywell Bull Vorrichtung zur Verdrahtung von insbesondere bestückten Substratoberflächen
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
JPS57162387A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Wire bonding device
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
DE3313456C2 (de) * 1982-05-10 1984-02-16 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Impuls-Lötverfahren
DD216357A1 (de) * 1983-06-29 1984-12-05 Mikroelektronik Zt Forsch Tech Vorrichtung zum automatischen kontaktieren und schneiden elektrischer leiter
DE3408338A1 (de) * 1984-03-07 1985-09-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte
GB8517703D0 (en) * 1985-07-12 1985-08-21 Golten D Surface mounted assemblies
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
CA1260157A (en) * 1985-07-26 1989-09-26 Preleg, Inc. Electrical circuit fabrication apparatus and method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
JPS6398920A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS6398919A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS63136420A (ja) * 1986-11-28 1988-06-08 文化自動車工業株式会社 布線装置
ES2004620A6 (es) * 1987-05-25 1989-01-16 C G Sistemas Electronicos S A Boquilla para implantacion o reposicion de pistas en placas de circuitos impreso
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht
CN114012269B (zh) * 2020-07-16 2024-05-14 绵阳伟成科技有限公司 一种装夹机构、激光破皮机及破皮方法
CN118336405B (zh) * 2024-05-27 2024-09-03 中国水利水电第四工程局有限公司 一种自然接地体连接接头及其加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
JPS5550399B1 (cg-RX-API-DMAC7.html) * 1970-03-05 1980-12-17

Also Published As

Publication number Publication date
JPS51115659A (en) 1976-10-12
DE2610283C2 (de) 1986-05-07
JPS6015160B2 (ja) 1985-04-17
DE2610283A1 (de) 1976-09-23
FR2304247B1 (cg-RX-API-DMAC7.html) 1979-06-08
FR2304247A1 (fr) 1976-10-08
GB1504252A (en) 1978-03-15

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