IT1036983B - Dispositivo e procedimento per eseguire placcatura per via elettrolitica - Google Patents
Dispositivo e procedimento per eseguire placcatura per via elettroliticaInfo
- Publication number
- IT1036983B IT1036983B IT50039/75A IT5003975A IT1036983B IT 1036983 B IT1036983 B IT 1036983B IT 50039/75 A IT50039/75 A IT 50039/75A IT 5003975 A IT5003975 A IT 5003975A IT 1036983 B IT1036983 B IT 1036983B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- performing plating
- electrolytic
- electrolytic via
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US491377A US3900383A (en) | 1974-07-24 | 1974-07-24 | Apparatus for electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1036983B true IT1036983B (it) | 1979-10-30 |
Family
ID=23951956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT50039/75A IT1036983B (it) | 1974-07-24 | 1975-06-12 | Dispositivo e procedimento per eseguire placcatura per via elettrolitica |
Country Status (7)
Country | Link |
---|---|
US (1) | US3900383A (it) |
JP (1) | JPS5120034A (it) |
CA (1) | CA1049955A (it) |
DE (1) | DE2526006A1 (it) |
FR (1) | FR2279864A1 (it) |
GB (1) | GB1502878A (it) |
IT (1) | IT1036983B (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4119515A (en) * | 1977-03-28 | 1978-10-10 | National Steel Corporation | Apparatus for electroplating sheet metals |
JPS5891195A (ja) * | 1981-11-25 | 1983-05-31 | Masami Kobayashi | メツキ装置 |
NL8300946A (nl) * | 1983-03-16 | 1984-10-16 | Hoogovens Groep Bv | Inrichting voor het tweezijdig electrolytisch bekleden van metaalband. |
JPS6019021A (ja) * | 1983-07-12 | 1985-01-31 | Kanebo Ltd | 気体乾燥装置 |
US4662997A (en) * | 1986-04-25 | 1987-05-05 | Hirt Theodore A | Method and apparatus for energizing metallic strip for plating |
AU579517B2 (en) * | 1986-06-20 | 1988-11-24 | Gould Inc. | Double matte finish copper foil |
LU86520A1 (fr) * | 1986-07-17 | 1988-02-02 | Delloye Matthieu | Procede d'electrozingage en continu d'une tole d'acier par voie electrolytique |
DE3665080D1 (en) * | 1986-10-20 | 1989-09-21 | Clecim Sa | Process and apparatus for electrolytically treating metal strips |
DE4007297C2 (de) * | 1990-03-08 | 1995-12-14 | Heraeus Elektrochemie | Elektrolysezelle zur elektrolytischen Behandlung von Prozeßflüssigkeit |
FR2686623B1 (fr) * | 1992-01-24 | 1995-06-09 | Lorraine Laminage | Procede d'electrodeposition d'un revetement sur une bande metallique en defilement, rouleau pour ligne d'electrodeposition mettant en óoeuvre ce procede et cellule electrolytique incluant ce rouleau. |
DE4236927A1 (de) * | 1992-10-31 | 1994-05-05 | Hans Josef May | Vorrichtung zum einseitigen elektrolytischen Beschichten von Metallbändern |
JPH06228791A (ja) * | 1992-12-07 | 1994-08-16 | Ebara Yuujiraito Kk | 電気めっき装置 |
DE4413149A1 (de) * | 1994-04-15 | 1995-10-19 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
JP4621959B2 (ja) * | 2004-12-27 | 2011-02-02 | Dowaメタルテック株式会社 | メッキ装置およびメッキ方法 |
DE102008004592A1 (de) * | 2008-01-16 | 2009-07-23 | Danziger, Manfred, Dr. | Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes |
US8377267B2 (en) * | 2009-09-30 | 2013-02-19 | National Semiconductor Corporation | Foil plating for semiconductor packaging |
JP6119722B2 (ja) * | 2014-11-21 | 2017-04-26 | Jfeスチール株式会社 | 電気めっき方法、電極ロール、及び電気めっき装置 |
CN112095130B (zh) * | 2020-08-23 | 2021-05-14 | 深圳市崇辉表面技术开发有限公司 | 卷对卷式连续电镀导电装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3432419A (en) * | 1965-07-22 | 1969-03-11 | Belke Mfg Co | Variable,commutating contact electroplating barrel |
US3634223A (en) * | 1970-02-25 | 1972-01-11 | United States Steel Corp | Contact assembly |
-
1974
- 1974-07-24 US US491377A patent/US3900383A/en not_active Expired - Lifetime
-
1975
- 1975-05-01 GB GB18154/75A patent/GB1502878A/en not_active Expired
- 1975-05-21 CA CA227,438A patent/CA1049955A/en not_active Expired
- 1975-06-11 DE DE19752526006 patent/DE2526006A1/de not_active Withdrawn
- 1975-06-12 IT IT50039/75A patent/IT1036983B/it active
- 1975-06-24 FR FR7519787A patent/FR2279864A1/fr active Granted
- 1975-06-24 JP JP50077087A patent/JPS5120034A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1502878A (en) | 1978-03-08 |
DE2526006A1 (de) | 1976-02-12 |
FR2279864B1 (it) | 1978-09-22 |
CA1049955A (en) | 1979-03-06 |
AU8091675A (en) | 1976-11-11 |
US3900383A (en) | 1975-08-19 |
FR2279864A1 (fr) | 1976-02-20 |
JPS5120034A (en) | 1976-02-17 |
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