IT1017115B - Apparecchiatura per segnalare il completamento di un operazione di attacco chimico nella fabbricazio ne di dispositivi semiconduttori - Google Patents

Apparecchiatura per segnalare il completamento di un operazione di attacco chimico nella fabbricazio ne di dispositivi semiconduttori

Info

Publication number
IT1017115B
IT1017115B IT25102/74A IT2510274A IT1017115B IT 1017115 B IT1017115 B IT 1017115B IT 25102/74 A IT25102/74 A IT 25102/74A IT 2510274 A IT2510274 A IT 2510274A IT 1017115 B IT1017115 B IT 1017115B
Authority
IT
Italy
Prior art keywords
reporting
completion
manufacture
equipment
chemical attack
Prior art date
Application number
IT25102/74A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1017115B publication Critical patent/IT1017115B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
IT25102/74A 1973-09-21 1974-07-12 Apparecchiatura per segnalare il completamento di un operazione di attacco chimico nella fabbricazio ne di dispositivi semiconduttori IT1017115B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US399668A US3874959A (en) 1973-09-21 1973-09-21 Method to establish the endpoint during the delineation of oxides on semiconductor surfaces and apparatus therefor

Publications (1)

Publication Number Publication Date
IT1017115B true IT1017115B (it) 1977-07-20

Family

ID=23580485

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25102/74A IT1017115B (it) 1973-09-21 1974-07-12 Apparecchiatura per segnalare il completamento di un operazione di attacco chimico nella fabbricazio ne di dispositivi semiconduttori

Country Status (6)

Country Link
US (1) US3874959A (it)
JP (1) JPS5231713B2 (it)
DE (1) DE2439795C3 (it)
FR (1) FR2245083B1 (it)
GB (1) GB1448048A (it)
IT (1) IT1017115B (it)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4039370A (en) * 1975-06-23 1977-08-02 Rca Corporation Optically monitoring the undercutting of a layer being etched
US4058438A (en) * 1975-07-18 1977-11-15 The United States Of America As Represented By The Secretary Of The Army Rapid universal sensing cell
US4082602A (en) * 1977-05-02 1978-04-04 Bell Telephone Laboratories, Incorporated Photovoltaic cell manufacture
US4142107A (en) * 1977-06-30 1979-02-27 International Business Machines Corporation Resist development control system
DE3068851D1 (en) * 1979-05-02 1984-09-13 Ibm Apparatus and process for selective electrochemical etching
WO1981000646A1 (en) * 1979-08-30 1981-03-05 Western Electric Co Device manufacture involving pattern delineation in thin layers
GB2130970B (en) * 1980-12-05 1985-01-30 Burroughs Corp Etching depth monitor
JPS58141531A (ja) * 1982-02-18 1983-08-22 Toshiba Corp 半導体素子用金属薄膜エツチング装置
US4569717A (en) * 1983-05-24 1986-02-11 Dainippon Screen Mfg. Co., Ltd. Method of surface treatment
EP0171195B1 (en) * 1984-07-09 1991-01-02 Sigma Corporation Method for detecting endpoint of development
HU199020B (en) * 1987-05-04 1989-12-28 Magyar Tudomanyos Akademia Method and apparatus for measuring the layer thickness of semiconductor layer structures
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
DE3823137C2 (de) * 1988-07-05 1993-12-02 Schering Ag Verfahren zur Ätzung von Epoxid-Harz
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5376214A (en) * 1992-09-22 1994-12-27 Nissan Motor Co., Ltd. Etching device
US5788801A (en) * 1992-12-04 1998-08-04 International Business Machines Corporation Real time measurement of etch rate during a chemical etching process
US5582746A (en) * 1992-12-04 1996-12-10 International Business Machines Corporation Real time measurement of etch rate during a chemical etching process
US5573624A (en) * 1992-12-04 1996-11-12 International Business Machines Corporation Chemical etch monitor for measuring film etching uniformity during a chemical etching process
US5439551A (en) * 1994-03-02 1995-08-08 Micron Technology, Inc. Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes
US5516399A (en) * 1994-06-30 1996-05-14 International Business Machines Corporation Contactless real-time in-situ monitoring of a chemical etching
US5445705A (en) * 1994-06-30 1995-08-29 International Business Machines Corporation Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process
US5489361A (en) * 1994-06-30 1996-02-06 International Business Machines Corporation Measuring film etching uniformity during a chemical etching process
US5501766A (en) * 1994-06-30 1996-03-26 International Business Machines Corporation Minimizing overetch during a chemical etching process
US5480511A (en) * 1994-06-30 1996-01-02 International Business Machines Corporation Method for contactless real-time in-situ monitoring of a chemical etching process
US6411110B1 (en) * 1999-08-17 2002-06-25 Micron Technology, Inc. Apparatuses and methods for determining if protective coatings on semiconductor substrate holding devices have been compromised

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3162589A (en) * 1954-06-01 1964-12-22 Rca Corp Methods of making semiconductor devices
US2875141A (en) * 1954-08-12 1959-02-24 Philco Corp Method and apparatus for use in forming semiconductive structures
CH444975A (de) * 1966-09-27 1967-10-15 Bbc Brown Boveri & Cie Verfahren zur Herstellung eines Halbleiterelementes mit pnpn-Struktur mit Kurzschlüssen in der Emitterzone
US3628017A (en) * 1970-06-18 1971-12-14 Itek Corp Ultraviolet light-sensitive cell using a substantially chemically unchanged semiconductor electrode in an electrolyte
US3755026A (en) * 1971-04-01 1973-08-28 Sprague Electric Co Method of making a semiconductor device having tunnel oxide contacts

Also Published As

Publication number Publication date
FR2245083A1 (it) 1975-04-18
DE2439795B2 (de) 1981-01-22
DE2439795C3 (de) 1981-09-17
US3874959A (en) 1975-04-01
DE2439795A1 (de) 1975-04-03
FR2245083B1 (it) 1977-03-18
GB1448048A (en) 1976-09-02
JPS5231713B2 (it) 1977-08-16
JPS5060185A (it) 1975-05-23

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