GB2130970B - Etching depth monitor - Google Patents
Etching depth monitorInfo
- Publication number
- GB2130970B GB2130970B GB08333175A GB8333175A GB2130970B GB 2130970 B GB2130970 B GB 2130970B GB 08333175 A GB08333175 A GB 08333175A GB 8333175 A GB8333175 A GB 8333175A GB 2130970 B GB2130970 B GB 2130970B
- Authority
- GB
- United Kingdom
- Prior art keywords
- etching depth
- depth monitor
- monitor
- etching
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08333175A GB2130970B (en) | 1980-12-05 | 1983-12-13 | Etching depth monitor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8039048A GB2088782B (en) | 1980-12-05 | 1980-12-05 | Etching depth monitor and control |
GB08333175A GB2130970B (en) | 1980-12-05 | 1983-12-13 | Etching depth monitor |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8333175D0 GB8333175D0 (en) | 1984-01-18 |
GB2130970A GB2130970A (en) | 1984-06-13 |
GB2130970B true GB2130970B (en) | 1985-01-30 |
Family
ID=26277738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08333175A Expired GB2130970B (en) | 1980-12-05 | 1983-12-13 | Etching depth monitor |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2130970B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2322102A (en) * | 1997-02-13 | 1998-08-19 | British Aerospace | Chemical etching end-point determination |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3503817A (en) * | 1966-01-24 | 1970-03-31 | Fmc Corp | Process for controlling metal etching operation |
US3517921A (en) * | 1968-05-21 | 1970-06-30 | Pitney Bowes Inc | Combined copy paper pre-feed and timing mechanism for copying machines |
DE2304933A1 (en) * | 1973-02-01 | 1974-08-08 | Siemens Ag | PROCEDURES FOR THE AUTOMATIC CONTROL AND REGULATION OF ETCHING MACHINES |
US3874959A (en) * | 1973-09-21 | 1975-04-01 | Ibm | Method to establish the endpoint during the delineation of oxides on semiconductor surfaces and apparatus therefor |
-
1983
- 1983-12-13 GB GB08333175A patent/GB2130970B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2130970A (en) | 1984-06-13 |
GB8333175D0 (en) | 1984-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3175884D1 (en) | Rate and depth monitor for silicon etching | |
GB2068236B (en) | Scarifier | |
GB2089051B (en) | Surface restivimeter | |
DE3166870D1 (en) | Spade | |
JPS569372A (en) | Etching method | |
GB2076649B (en) | Hair-tinting implement | |
JPS56168224A (en) | Position monitor | |
GB2088782B (en) | Etching depth monitor and control | |
JPS5790146A (en) | Surface inspecter | |
GB2102954B (en) | Liquid depth | |
ATA387282A (en) | Depth gauge | |
JPS579635A (en) | Depalletizer | |
JPS57208144A (en) | Etching method | |
GB2091395B (en) | Cartridge-operated devices | |
GB2069039B (en) | Equipment including retractabel protective-screens | |
JPS56117193A (en) | Wide range monitor | |
ZA811691B (en) | Thiazoles | |
PH16437A (en) | Thiazoles | |
ZA815409B (en) | Trench cutter | |
GB2077423B (en) | Alpha-radiation monitor | |
GB2130970B (en) | Etching depth monitor | |
GB2088682B (en) | Revesible plough | |
JPS5771324A (en) | Digger | |
JPS56133396A (en) | Surfactant | |
ZA807511B (en) | An angling aid |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19941205 |