IT1011946B - Procedimento per produrre un deposito metallico aderente su una superficie - Google Patents

Procedimento per produrre un deposito metallico aderente su una superficie

Info

Publication number
IT1011946B
IT1011946B IT68825/74A IT6882574A IT1011946B IT 1011946 B IT1011946 B IT 1011946B IT 68825/74 A IT68825/74 A IT 68825/74A IT 6882574 A IT6882574 A IT 6882574A IT 1011946 B IT1011946 B IT 1011946B
Authority
IT
Italy
Prior art keywords
procedure
producing
metallic deposit
adhesive metallic
adhesive
Prior art date
Application number
IT68825/74A
Other languages
English (en)
Italian (it)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co filed Critical Western Electric Co
Application granted granted Critical
Publication of IT1011946B publication Critical patent/IT1011946B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
IT68825/74A 1973-06-11 1974-06-10 Procedimento per produrre un deposito metallico aderente su una superficie IT1011946B (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (de) 1974-02-19 1974-05-01

Publications (1)

Publication Number Publication Date
IT1011946B true IT1011946B (it) 1977-02-10

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68825/74A IT1011946B (it) 1973-06-11 1974-06-10 Procedimento per produrre un deposito metallico aderente su una superficie

Country Status (15)

Country Link
JP (1) JPS544398B2 (de)
BR (1) BR7404745A (de)
CA (1) CA1060136A (de)
CH (1) CH603725A5 (de)
DE (1) DE2427030C3 (de)
ES (1) ES427131A1 (de)
FR (1) FR2232614B1 (de)
GB (1) GB1448415A (de)
HK (1) HK45977A (de)
IE (1) IE39796B1 (de)
IL (1) IL44997A (de)
IT (1) IT1011946B (de)
MY (1) MY7700290A (de)
NL (1) NL162118C (de)
SE (1) SE413774B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
DE69229262T2 (de) * 1992-03-16 2000-01-20 Raytheon Co Wärmetransferklebstoff
JP4336955B2 (ja) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 シクロヘキサントリカルボン酸モノエステルおよびその用途
JP2005054145A (ja) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc ガスバリア性(メタ)アクリレート樹脂硬化物および塗料、接着剤、フィルム
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Dnpファインケミカル 接着組成物および硬化性接着シートの製造方法
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進
CN115926110A (zh) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 一种改性环氧树脂及其制备方法和应用

Also Published As

Publication number Publication date
DE2427030C3 (de) 1980-08-28
IL44997A (en) 1977-05-31
CH603725A5 (de) 1978-08-31
JPS5034094A (de) 1975-04-02
DE2427030B2 (de) 1979-12-20
BR7404745A (pt) 1976-02-17
SE7407533L (de) 1974-12-12
DE2427030A1 (de) 1975-01-02
NL7407729A (de) 1974-12-13
NL162118B (nl) 1979-11-15
IL44997A0 (en) 1974-09-10
JPS544398B2 (de) 1979-03-06
FR2232614A1 (de) 1975-01-03
IE39796B1 (en) 1979-01-03
FR2232614B1 (de) 1977-09-30
GB1448415A (en) 1976-09-08
ES427131A1 (es) 1976-09-01
NL162118C (nl) 1980-04-15
MY7700290A (en) 1977-12-31
CA1060136A (en) 1979-08-07
HK45977A (en) 1977-09-16
SE413774B (sv) 1980-06-23
IE39796L (en) 1974-12-11

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