HK45977A - A cured epoxy polymer - Google Patents

A cured epoxy polymer

Info

Publication number
HK45977A
HK45977A HK459/77A HK45977A HK45977A HK 45977 A HK45977 A HK 45977A HK 459/77 A HK459/77 A HK 459/77A HK 45977 A HK45977 A HK 45977A HK 45977 A HK45977 A HK 45977A
Authority
HK
Hong Kong
Prior art keywords
cured epoxy
epoxy polymer
polymer
cured
epoxy
Prior art date
Application number
HK459/77A
Other languages
English (en)
Inventor
Ch A Mcpherson
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of HK45977A publication Critical patent/HK45977A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK459/77A 1973-06-11 1977-09-08 A cured epoxy polymer HK45977A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (de) 1974-02-19 1974-05-01

Publications (1)

Publication Number Publication Date
HK45977A true HK45977A (en) 1977-09-16

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
HK459/77A HK45977A (en) 1973-06-11 1977-09-08 A cured epoxy polymer

Country Status (15)

Country Link
JP (1) JPS544398B2 (de)
BR (1) BR7404745A (de)
CA (1) CA1060136A (de)
CH (1) CH603725A5 (de)
DE (1) DE2427030C3 (de)
ES (1) ES427131A1 (de)
FR (1) FR2232614B1 (de)
GB (1) GB1448415A (de)
HK (1) HK45977A (de)
IE (1) IE39796B1 (de)
IL (1) IL44997A (de)
IT (1) IT1011946B (de)
MY (1) MY7700290A (de)
NL (1) NL162118C (de)
SE (1) SE413774B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
DE69229262T2 (de) * 1992-03-16 2000-01-20 Raytheon Co., Lexington Wärmetransferklebstoff
JP2005054145A (ja) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc ガスバリア性（メタ）アクリレート樹脂硬化物および塗料、接着剤、フィルム
JP4336955B2 (ja) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 シクロヘキサントリカルボン酸モノエステルおよびその用途
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル 接着組成物および硬化性接着シートの製造方法
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進
CN115926110A (zh) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 一种改性环氧树脂及其制备方法和应用

Also Published As

Publication number Publication date
CA1060136A (en) 1979-08-07
FR2232614B1 (de) 1977-09-30
BR7404745A (pt) 1976-02-17
SE413774B (sv) 1980-06-23
NL162118C (nl) 1980-04-15
CH603725A5 (de) 1978-08-31
NL7407729A (de) 1974-12-13
IE39796B1 (en) 1979-01-03
DE2427030A1 (de) 1975-01-02
IE39796L (en) 1974-12-11
IL44997A (en) 1977-05-31
GB1448415A (en) 1976-09-08
ES427131A1 (es) 1976-09-01
JPS544398B2 (de) 1979-03-06
DE2427030B2 (de) 1979-12-20
DE2427030C3 (de) 1980-08-28
SE7407533L (de) 1974-12-12
IL44997A0 (en) 1974-09-10
IT1011946B (it) 1977-02-10
MY7700290A (en) 1977-12-31
NL162118B (nl) 1979-11-15
JPS5034094A (de) 1975-04-02
FR2232614A1 (de) 1975-01-03

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