USB465376I5 - - Google Patents

Info

Publication number
USB465376I5
USB465376I5 US46537674A USB465376I5 US B465376 I5 USB465376 I5 US B465376I5 US 46537674 A US46537674 A US 46537674A US B465376 I5 USB465376 I5 US B465376I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05465376 priority Critical patent/USB465376I5/en
Priority to CA201,055A priority patent/CA1060136A/en
Priority to DE2427030A priority patent/DE2427030C3/de
Priority to SE7407533A priority patent/SE413774B/xx
Priority to IE1207/74A priority patent/IE39796B1/xx
Priority to AT472674A priority patent/AT336284B/de
Priority to NL7407729.A priority patent/NL162118C/xx
Priority to ES427131A priority patent/ES427131A1/es
Priority to GB2562774A priority patent/GB1448415A/en
Priority to IL44997A priority patent/IL44997A/en
Priority to IT68825/74A priority patent/IT1011946B/it
Priority to FR7419964A priority patent/FR2232614B1/fr
Priority to BR4745/74A priority patent/BR7404745A/pt
Priority to CH791074A priority patent/CH603725A5/xx
Priority to JP6565874A priority patent/JPS544398B2/ja
Priority to US05/642,221 priority patent/US4077927A/en
Publication of USB465376I5 publication Critical patent/USB465376I5/en
Priority to US05/737,638 priority patent/US4121015A/en
Priority to HK459/77A priority patent/HK45977A/xx
Priority to MY290/77A priority patent/MY7700290A/xx
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
US05465376 1973-06-11 1974-05-01 Pending USB465376I5 (de)

Priority Applications (19)

Application Number Priority Date Filing Date Title
US05465376 USB465376I5 (de) 1974-02-19 1974-05-01
CA201,055A CA1060136A (en) 1973-06-11 1974-05-28 Cured epoxy polymer having improved adhesive properties
DE2427030A DE2427030C3 (de) 1973-06-11 1974-06-05 Verfahren zur Vorbehandlung einer stromlos zu metallisierenden Trägeroberfläche und Verwendung des vorbehandelten Produktes
SE7407533A SE413774B (sv) 1973-06-11 1974-06-07 Forfarande for framstellning av en vidheftande metallavsettning pa en yta av epoxiharts
IE1207/74A IE39796B1 (en) 1973-06-11 1974-06-07 A cured epoxy polymer
AT472674A AT336284B (de) 1974-05-01 1974-06-07 Verfahren zur herstellung eines geharteten epoxypolymers mit verbesserten haftungseigenschaften
IL44997A IL44997A (en) 1973-06-11 1974-06-10 Process for producing an adherent metal deposit upon a cured epoxy polymer surface
CH791074A CH603725A5 (de) 1973-06-11 1974-06-10
GB2562774A GB1448415A (en) 1973-06-11 1974-06-10 Cured epoxy polymer
NL7407729.A NL162118C (nl) 1973-06-11 1974-06-10 Werkwijze om een metaallaag aan te brengen op een epoxy- hars.
IT68825/74A IT1011946B (it) 1973-06-11 1974-06-10 Procedimento per produrre un deposito metallico aderente su una superficie
FR7419964A FR2232614B1 (de) 1973-06-11 1974-06-10
BR4745/74A BR7404745A (pt) 1973-06-11 1974-06-10 Processo para a preparacao de um deposito de metal aderente sobre uma superficie
ES427131A ES427131A1 (es) 1973-06-11 1974-06-10 Procedimiento para preparar un polimero epoxido curado, conpropiedades adhesivas mejoradas.
JP6565874A JPS544398B2 (de) 1973-06-11 1974-06-11
US05/642,221 US4077927A (en) 1974-05-01 1975-12-19 Cured epoxy polymer having improved adhesive properties
US05/737,638 US4121015A (en) 1974-05-01 1976-11-01 Cured epoxy polymer having improved adhesive properties
HK459/77A HK45977A (en) 1973-06-11 1977-09-08 A cured epoxy polymer
MY290/77A MY7700290A (en) 1973-06-11 1977-12-30 A cured epoxy polymer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (de) 1974-02-19 1974-05-01

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US44364874A Continuation-In-Part 1973-06-11 1974-02-19

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US05/642,221 Division US4077927A (en) 1974-05-01 1975-12-19 Cured epoxy polymer having improved adhesive properties
US64220275A Division 1975-12-19 1975-12-19
US05/737,638 Continuation US4121015A (en) 1974-05-01 1976-11-01 Cured epoxy polymer having improved adhesive properties

Publications (1)

Publication Number Publication Date
USB465376I5 true USB465376I5 (de) 1976-04-13

Family

ID=27033599

Family Applications (1)

Application Number Title Priority Date Filing Date
US05465376 Pending USB465376I5 (de) 1973-06-11 1974-05-01

Country Status (1)

Country Link
US (1) USB465376I5 (de)

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