USB465376I5 - - Google Patents
Info
- Publication number
- USB465376I5 USB465376I5 US46537674A USB465376I5 US B465376 I5 USB465376 I5 US B465376I5 US 46537674 A US46537674 A US 46537674A US B465376 I5 USB465376 I5 US B465376I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (19)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05465376 USB465376I5 (en) | 1974-02-19 | 1974-05-01 | |
CA201,055A CA1060136A (en) | 1973-06-11 | 1974-05-28 | Cured epoxy polymer having improved adhesive properties |
DE2427030A DE2427030C3 (en) | 1973-06-11 | 1974-06-05 | Process for the pretreatment of a carrier surface to be electrolessly metallized and the use of the pretreated product |
IE1207/74A IE39796B1 (en) | 1973-06-11 | 1974-06-07 | A cured epoxy polymer |
AT472674A AT336284B (en) | 1974-05-01 | 1974-06-07 | PROCESS FOR PRODUCING A CURED EPOXY POLYMER WITH IMPROVED ADHESIVE PROPERTIES |
SE7407533A SE413774B (en) | 1973-06-11 | 1974-06-07 | PROCEDURE FOR PREPARING AN ADHESIVE METAL DEPOSIT ON A SURFACE OF EPOXY RESIN |
IT68825/74A IT1011946B (en) | 1973-06-11 | 1974-06-10 | PROCEDURE FOR PRODUCING AN ADHESIVE METALLIC DEPOSIT ON A SURFACE |
NL7407729.A NL162118C (en) | 1973-06-11 | 1974-06-10 | METHOD OF APPLYING A METAL LAYER ON AN EPOXY RESIN |
FR7419964A FR2232614B1 (en) | 1973-06-11 | 1974-06-10 | |
GB2562774A GB1448415A (en) | 1973-06-11 | 1974-06-10 | Cured epoxy polymer |
CH791074A CH603725A5 (en) | 1973-06-11 | 1974-06-10 | |
IL44997A IL44997A (en) | 1973-06-11 | 1974-06-10 | Process for producing an adherent metal deposit upon a cured epoxy polymer surface |
ES427131A ES427131A1 (en) | 1973-06-11 | 1974-06-10 | Cured epoxy polymer |
BR4745/74A BR7404745A (en) | 1973-06-11 | 1974-06-10 | PROCESS FOR THE PREPARATION OF A STICKY METAL DEPOSIT ON A SURFACE |
JP6565874A JPS544398B2 (en) | 1973-06-11 | 1974-06-11 | |
US05/642,221 US4077927A (en) | 1974-05-01 | 1975-12-19 | Cured epoxy polymer having improved adhesive properties |
US05/737,638 US4121015A (en) | 1974-05-01 | 1976-11-01 | Cured epoxy polymer having improved adhesive properties |
HK459/77A HK45977A (en) | 1973-06-11 | 1977-09-08 | A cured epoxy polymer |
MY290/77A MY7700290A (en) | 1973-06-11 | 1977-12-30 | A cured epoxy polymer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44364874A | 1974-02-19 | 1974-02-19 | |
US05465376 USB465376I5 (en) | 1974-02-19 | 1974-05-01 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US44364874A Continuation-In-Part | 1973-06-11 | 1974-02-19 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/642,221 Division US4077927A (en) | 1974-05-01 | 1975-12-19 | Cured epoxy polymer having improved adhesive properties |
US64220275A Division | 1975-12-19 | 1975-12-19 | |
US05/737,638 Continuation US4121015A (en) | 1974-05-01 | 1976-11-01 | Cured epoxy polymer having improved adhesive properties |
Publications (1)
Publication Number | Publication Date |
---|---|
USB465376I5 true USB465376I5 (en) | 1976-04-13 |
Family
ID=27033599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05465376 Pending USB465376I5 (en) | 1973-06-11 | 1974-05-01 |
Country Status (1)
Country | Link |
---|---|
US (1) | USB465376I5 (en) |
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1974
- 1974-05-01 US US05465376 patent/USB465376I5/en active Pending