CH603725A5 - - Google Patents

Info

Publication number
CH603725A5
CH603725A5 CH791074A CH791074A CH603725A5 CH 603725 A5 CH603725 A5 CH 603725A5 CH 791074 A CH791074 A CH 791074A CH 791074 A CH791074 A CH 791074A CH 603725 A5 CH603725 A5 CH 603725A5
Authority
CH
Switzerland
Application number
CH791074A
Inventor
Charles Allen Mc Pherson
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH603725A5 publication Critical patent/CH603725A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
CH791074A 1973-06-11 1974-06-10 CH603725A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (en) 1974-02-19 1974-05-01

Publications (1)

Publication Number Publication Date
CH603725A5 true CH603725A5 (en) 1978-08-31

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
CH791074A CH603725A5 (en) 1973-06-11 1974-06-10

Country Status (15)

Country Link
JP (1) JPS544398B2 (en)
BR (1) BR7404745A (en)
CA (1) CA1060136A (en)
CH (1) CH603725A5 (en)
DE (1) DE2427030C3 (en)
ES (1) ES427131A1 (en)
FR (1) FR2232614B1 (en)
GB (1) GB1448415A (en)
HK (1) HK45977A (en)
IE (1) IE39796B1 (en)
IL (1) IL44997A (en)
IT (1) IT1011946B (en)
MY (1) MY7700290A (en)
NL (1) NL162118C (en)
SE (1) SE413774B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
DE69229262T2 (en) * 1992-03-16 2000-01-20 Raytheon Co Heat transfer adhesive
JP4336955B2 (en) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 Cyclohexanetricarboxylic acid monoester and use thereof
JP2005054145A (en) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc (meth)acrylate resin cured material having gas barrier property, coating, adhesive and film
JP5670048B2 (en) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル Adhesive composition and method for producing curable adhesive sheet
JP2012256872A (en) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc Adhesion promotion of metal to dielectric
CN115926110A (en) * 2022-12-29 2023-04-07 江苏扬农锦湖化工有限公司 Modified epoxy resin and preparation method and application thereof

Also Published As

Publication number Publication date
DE2427030C3 (en) 1980-08-28
IL44997A (en) 1977-05-31
JPS5034094A (en) 1975-04-02
DE2427030B2 (en) 1979-12-20
BR7404745A (en) 1976-02-17
SE7407533L (en) 1974-12-12
DE2427030A1 (en) 1975-01-02
NL7407729A (en) 1974-12-13
NL162118B (en) 1979-11-15
IL44997A0 (en) 1974-09-10
JPS544398B2 (en) 1979-03-06
FR2232614A1 (en) 1975-01-03
IE39796B1 (en) 1979-01-03
FR2232614B1 (en) 1977-09-30
GB1448415A (en) 1976-09-08
IT1011946B (en) 1977-02-10
ES427131A1 (en) 1976-09-01
NL162118C (en) 1980-04-15
MY7700290A (en) 1977-12-31
CA1060136A (en) 1979-08-07
HK45977A (en) 1977-09-16
SE413774B (en) 1980-06-23
IE39796L (en) 1974-12-11

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Legal Events

Date Code Title Description
PL Patent ceased