NL162118B - PROCEDURE FOR APPLYING A METALLIC LAYER ON AN EPOXY RESIN. - Google Patents

PROCEDURE FOR APPLYING A METALLIC LAYER ON AN EPOXY RESIN.

Info

Publication number
NL162118B
NL162118B NL7407729.A NL7407729A NL162118B NL 162118 B NL162118 B NL 162118B NL 7407729 A NL7407729 A NL 7407729A NL 162118 B NL162118 B NL 162118B
Authority
NL
Netherlands
Prior art keywords
procedure
applying
epoxy resin
metallic layer
metallic
Prior art date
Application number
NL7407729.A
Other languages
Dutch (nl)
Other versions
NL162118C (en
NL7407729A (en
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of NL7407729A publication Critical patent/NL7407729A/xx
Publication of NL162118B publication Critical patent/NL162118B/en
Application granted granted Critical
Publication of NL162118C publication Critical patent/NL162118C/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
NL7407729.A 1973-06-11 1974-06-10 METHOD OF APPLYING A METAL LAYER ON AN EPOXY RESIN NL162118C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36903873A 1973-06-11 1973-06-11
US44364874A 1974-02-19 1974-02-19
US05465376 USB465376I5 (en) 1974-02-19 1974-05-01

Publications (3)

Publication Number Publication Date
NL7407729A NL7407729A (en) 1974-12-13
NL162118B true NL162118B (en) 1979-11-15
NL162118C NL162118C (en) 1980-04-15

Family

ID=27408900

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7407729.A NL162118C (en) 1973-06-11 1974-06-10 METHOD OF APPLYING A METAL LAYER ON AN EPOXY RESIN

Country Status (15)

Country Link
JP (1) JPS544398B2 (en)
BR (1) BR7404745A (en)
CA (1) CA1060136A (en)
CH (1) CH603725A5 (en)
DE (1) DE2427030C3 (en)
ES (1) ES427131A1 (en)
FR (1) FR2232614B1 (en)
GB (1) GB1448415A (en)
HK (1) HK45977A (en)
IE (1) IE39796B1 (en)
IL (1) IL44997A (en)
IT (1) IT1011946B (en)
MY (1) MY7700290A (en)
NL (1) NL162118C (en)
SE (1) SE413774B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109921A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109922A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109915A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109918A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109914A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109919A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
JPS53109920A (en) * 1977-01-29 1978-09-26 Kureha Chem Ind Co Ltd Preparation of anti-tumor polysaccharides
US4602053A (en) * 1984-05-24 1986-07-22 E. I. Du Pont De Nemours And Company Chip-resistant paint containing epoxyester linear block oligomer
DE69229262T2 (en) * 1992-03-16 2000-01-20 Raytheon Co Heat transfer adhesive
JP2005054145A (en) 2003-08-07 2005-03-03 Mitsubishi Gas Chem Co Inc (meth)acrylate resin cured material having gas barrier property, coating, adhesive and film
JP4336955B2 (en) * 2003-08-07 2009-09-30 三菱瓦斯化学株式会社 Cyclohexanetricarboxylic acid monoester and use thereof
JP5670048B2 (en) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル Adhesive composition and method for producing curable adhesive sheet
JP2012256872A (en) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc Adhesion promotion of metal to dielectric

Also Published As

Publication number Publication date
SE7407533L (en) 1974-12-12
HK45977A (en) 1977-09-16
NL162118C (en) 1980-04-15
IL44997A0 (en) 1974-09-10
DE2427030C3 (en) 1980-08-28
GB1448415A (en) 1976-09-08
NL7407729A (en) 1974-12-13
IE39796L (en) 1974-12-11
CH603725A5 (en) 1978-08-31
BR7404745A (en) 1976-02-17
IL44997A (en) 1977-05-31
DE2427030B2 (en) 1979-12-20
FR2232614B1 (en) 1977-09-30
ES427131A1 (en) 1976-09-01
DE2427030A1 (en) 1975-01-02
JPS5034094A (en) 1975-04-02
IE39796B1 (en) 1979-01-03
FR2232614A1 (en) 1975-01-03
IT1011946B (en) 1977-02-10
CA1060136A (en) 1979-08-07
MY7700290A (en) 1977-12-31
JPS544398B2 (en) 1979-03-06
SE413774B (en) 1980-06-23

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee