AT336284B - Verfahren zur herstellung eines geharteten epoxypolymers mit verbesserten haftungseigenschaften - Google Patents

Verfahren zur herstellung eines geharteten epoxypolymers mit verbesserten haftungseigenschaften

Info

Publication number
AT336284B
AT336284B AT472674A AT472674A AT336284B AT 336284 B AT336284 B AT 336284B AT 472674 A AT472674 A AT 472674A AT 472674 A AT472674 A AT 472674A AT 336284 B AT336284 B AT 336284B
Authority
AT
Austria
Prior art keywords
producing
adhesive properties
cured epoxy
epoxy polymer
improved adhesive
Prior art date
Application number
AT472674A
Other languages
English (en)
Other versions
ATA472674A (de
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05465376 external-priority patent/USB465376I5/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of ATA472674A publication Critical patent/ATA472674A/de
Application granted granted Critical
Publication of AT336284B publication Critical patent/AT336284B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
AT472674A 1974-05-01 1974-06-07 Verfahren zur herstellung eines geharteten epoxypolymers mit verbesserten haftungseigenschaften AT336284B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05465376 USB465376I5 (de) 1974-02-19 1974-05-01

Publications (2)

Publication Number Publication Date
ATA472674A ATA472674A (de) 1976-08-15
AT336284B true AT336284B (de) 1977-04-25

Family

ID=23847561

Family Applications (1)

Application Number Title Priority Date Filing Date
AT472674A AT336284B (de) 1974-05-01 1974-06-07 Verfahren zur herstellung eines geharteten epoxypolymers mit verbesserten haftungseigenschaften

Country Status (2)

Country Link
US (2) US4077927A (de)
AT (1) AT336284B (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169187A (en) * 1977-04-01 1979-09-25 E. I. Du Pont De Nemours And Company Powder coating composition of a mixture of epoxy resins
US4255302A (en) * 1979-11-15 1981-03-10 The United States Of America As Represented By The Secretary Of The Navy Resin system for filament winding of pressure vessels
US4507340A (en) * 1980-07-31 1985-03-26 Raychem Corporation Adhesives and devices coated therewith
US4339558A (en) * 1981-06-03 1982-07-13 Sankin Industry Co., Ltd. Hardening resin compositions
US4360968A (en) * 1981-07-27 1982-11-30 Western Electric Company, Incorporated Method for reducing solder sticking on a printed wiring board
US4354911A (en) * 1981-08-07 1982-10-19 Western Electric Company Inc. Method of selectively depositing a metal on a surface by means of sputtering
GB2108975B (en) * 1981-11-10 1985-04-03 Scott Bader Co Modified unstaturated ester polymers
US4479991A (en) * 1982-04-07 1984-10-30 At&T Technologies, Inc. Plastic coated laminate
US4597996A (en) * 1984-04-16 1986-07-01 International Business Machines Corporation Process of laminating with an epoxy composition
US4550128A (en) * 1984-04-16 1985-10-29 International Business Machines Corporation Epoxy composition
US4599268A (en) * 1984-04-16 1986-07-08 International Business Machines Corporation Product containing an epoxy composition
US5538789A (en) * 1990-02-09 1996-07-23 Toranaga Technologies, Inc. Composite substrates for preparation of printed circuits
US5218063A (en) * 1991-06-26 1993-06-08 W. R. Grace & Co.-Conn. Epoxy adhesives and methods of using cured compositions therefrom
WO1993000381A1 (de) * 1991-06-26 1993-01-07 Teroson Gmbh Reaktiver schmelzklebstoff
KR20000000061A (ko) * 1999-08-26 2000-01-15 최천행 경화성 에폭시 조성물
CA2405584A1 (en) * 2000-04-10 2002-10-08 Henkel Kommanditgesellschaft Auf Aktien Impact-resistant epoxy resin compositions
KR100501651B1 (ko) * 2001-07-09 2005-07-18 현대자동차주식회사 차체 외판 보강용 실러 조성물
KR100420499B1 (ko) * 2001-07-27 2004-03-02 신재섭 전자회로 기판 접착용 에폭시 수지 조성물
KR101246003B1 (ko) * 2011-11-29 2013-03-20 현대건설주식회사 에폭시 콘크리트 조성물 및 그 제조방법
MX350094B (es) 2011-12-07 2017-08-25 Adhesivos sensibles a la presion a base de aceite vegetal.
WO2013086004A1 (en) * 2011-12-07 2013-06-13 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Pressure sensitive adhesives based on carboxylic acids and epoxides
RU2628949C2 (ru) 2012-04-09 2017-08-25 Эйвери Деннисон Корпорейшн Клеи, чувствительные к давлению, на основе перерабатываемых материалов и способы с отверждением уф
CN103619130A (zh) * 2013-11-22 2014-03-05 华进半导体封装先导技术研发中心有限公司 在低粗糙度基板上化学镀铜的方法
CN103709979B (zh) * 2013-12-07 2015-04-15 南宁珀源化工有限公司 一种用于半导体晶片切割的胶黏剂
CN103929874B (zh) * 2014-04-09 2017-04-19 中国科学院微电子研究所 一种pcb线路板铜线路加工方法
CN103987208B (zh) * 2014-06-06 2017-11-24 华进半导体封装先导技术研发中心有限公司 一种印刷线路板及其制作方法

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US3280056A (en) * 1953-07-30 1966-10-18 Devoe & Raynolds Co Epoxide compositions prepared from dimeric unsaturated higher fatty acids
US2920990A (en) * 1954-06-02 1960-01-12 Rubber And Asbestos Corp Structural adhesive compositions
US2970983A (en) * 1956-09-10 1961-02-07 Shell Oil Co Epoxy-containing condensates of polyepoxides and acidic materials, their preparation and polymers
BE614524A (de) * 1960-01-20
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US3299169A (en) * 1961-09-18 1967-01-17 Dow Chemical Co Elastomeric epoxy resin
BE628249A (de) * 1962-02-13
US3188362A (en) * 1962-07-06 1965-06-08 Furane Plastics Semi-rigid epoxy resin compositions and method
US3350352A (en) * 1962-09-06 1967-10-31 Minnesota Mining & Mfg Halogenated bisphenols and glycidyl polyethers thereof
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US3371070A (en) * 1965-03-01 1968-02-27 Gen Mills Inc Polyanhydrides of polymeric fat acids as curing agents for epoxy resins
US3440216A (en) * 1965-10-20 1969-04-22 Allied Chem Process for curing an epoxy resin with an organic anhydride and pyridine activator and composition thereof
US3894113A (en) * 1966-09-15 1975-07-08 Minnesota Mining & Mfg Bonding film
US3503910A (en) * 1967-01-05 1970-03-31 Hercules Inc Elastomeric poly(epihalohydrin) compositions of improved processability
US3505283A (en) * 1967-05-15 1970-04-07 Merck & Co Inc Isocyanates as thickening agents for epoxy resins
US3686359A (en) * 1969-12-19 1972-08-22 Union Carbide Corp Curable polyepoxide compositions
US3678130A (en) * 1970-09-10 1972-07-18 Dexter Corp Adhesive compositions containing epoxy resin, carboxy containing copolymer and 1,5-dihydrozynaphthalene
US3678131A (en) * 1970-09-10 1972-07-18 Dexter Corp Adhesive compositions containing epoxy resin, carboxyl containing copolymer and 2,2,-bis-(4-hydroxyphenyl) sulfone
GB1381123A (en) * 1971-03-11 1975-01-22 Shell Int Research Process for curing epoxy resins
US3707583A (en) * 1971-06-04 1972-12-26 Minnesota Mining & Mfg Adhesive
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3758332A (en) * 1971-08-20 1973-09-11 Western Electric Co Method of metal coating an epoxy surface
BE793030A (fr) * 1971-12-20 1973-04-16 Goodrich Co B F Procede pour la realisation de matieres plastiques de resine epoxy
US3926903A (en) * 1974-09-30 1975-12-16 United Technologies Corp Curable crack-resistant epoxy resin
US3926904A (en) * 1974-09-30 1975-12-16 United Technologies Corp Curable crack-resistant epoxy resin

Also Published As

Publication number Publication date
ATA472674A (de) 1976-08-15
US4077927A (en) 1978-03-07
US4121015A (en) 1978-10-17

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