IT1011156B - Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati - Google Patents

Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati

Info

Publication number
IT1011156B
IT1011156B IT4968174A IT4968174A IT1011156B IT 1011156 B IT1011156 B IT 1011156B IT 4968174 A IT4968174 A IT 4968174A IT 4968174 A IT4968174 A IT 4968174A IT 1011156 B IT1011156 B IT 1011156B
Authority
IT
Italy
Prior art keywords
substrates
electrically conductive
conductive metal
metal layers
manufacturing electrically
Prior art date
Application number
IT4968174A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT1011156B publication Critical patent/IT1011156B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
IT4968174A 1973-03-30 1974-03-26 Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati IT1011156B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (de) 1973-03-30 1973-03-30

Publications (1)

Publication Number Publication Date
IT1011156B true IT1011156B (it) 1977-01-20

Family

ID=19818532

Family Applications (1)

Application Number Title Priority Date Filing Date
IT4968174A IT1011156B (it) 1973-03-30 1974-03-26 Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati

Country Status (11)

Country Link
JP (1) JPS5631916B2 (de)
AT (1) AT326444B (de)
BE (1) BE812977A (de)
CA (1) CA1000415A (de)
DE (1) DE2412733C2 (de)
ES (1) ES424713A1 (de)
FR (1) FR2223477B1 (de)
GB (1) GB1457008A (de)
HK (1) HK39378A (de)
IT (1) IT1011156B (de)
NL (1) NL7304429A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194911U (ja) * 1982-06-21 1983-12-24 富士重工業株式会社 リヤクオ−タ部窓ガラスの取付部構造
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE19957130A1 (de) 1999-11-26 2001-05-31 Infineon Technologies Ag Metallisierungsverfahren für Dielektrika
DE10361419A1 (de) * 2003-12-22 2005-07-14 Infineon Technologies Ag Schichtenstruktur und ein Verfahren zur Herstellung einer Schichtenstruktur
CN109680552B (zh) * 2017-10-18 2021-11-05 江苏先诺新材料科技有限公司 聚酰亚胺/纳米纤维复合纸及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621077A1 (de) * 1967-03-31 1971-04-22 Bayer Ag Verfahren zur Abscheidung von Metallueberzuegen
GB1229936A (de) * 1968-09-20 1971-04-28
US3698940A (en) * 1970-01-26 1972-10-17 Macdermid Inc Method of making additive printed circuit boards and product thereof

Also Published As

Publication number Publication date
ES424713A1 (es) 1976-06-01
AU6720474A (en) 1975-10-02
DE2412733C2 (de) 1982-12-02
HK39378A (en) 1978-07-21
AT326444B (de) 1975-12-10
FR2223477A1 (de) 1974-10-25
DE2412733A1 (de) 1974-10-10
FR2223477B1 (de) 1978-07-28
GB1457008A (en) 1976-12-01
JPS5631916B2 (de) 1981-07-24
NL7304429A (de) 1974-10-02
CA1000415A (en) 1976-11-23
BE812977A (fr) 1974-09-30
JPS49128833A (de) 1974-12-10
ATA254174A (de) 1975-02-15

Similar Documents

Publication Publication Date Title
NO740031L (no) Fremgangsmåte til fremstilling av en elektrode for elektrolytiske prosesser.
IT983627B (it) Procedimento per formare sottili strati di tantalio su substrati isolanti
IT1032105B (it) Procedimento di deposizione elettrolitica su superfici non conduttive
AT356727B (de) Elektrische anschlussklemme
IT1006728B (it) Conduttore elettrico e metodo per la sua fabbricazione
CA1009768A (en) Method for forming silicon conductive layers
IT998995B (it) Procedimento per fabbricare un componente elettrico induttivo
IT998866B (it) Procedimento per produrre struttu re a piu strati metallo isolatore semiconduttore
NO139021C (no) Elektrisk tyntskiktkobling.
IT986113B (it) Perfezionamento nelle disposizioni di connessione elettrica per elettrodi metallici
CA943387A (en) Method of producing electrically conductive metal layers
TR17734A (tr) Levha ve seritlere muesavi olarak elektrikle metal kaplamak icin usul
IT1011156B (it) Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati
IT1010413B (it) Processo per il rivestimento di fili metallici
JPS5274890A (en) Method of manufacturing conductive lead layer
FR2307891A1 (fr) Procede de fabrication de compositions colloidales de depot electrolytique
CA950255A (en) Process for the manufacture of metallic, electrically conductive patterns
IT1010148B (it) Attraversamento stagno di morsetti per condensatori elettrolitici di filtraggio
IT980751B (it) Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato
SE380740B (sv) Forfarande for forbettring av ytaktiviteten hos elektriskt ledande underlagsbanor, serskilt aluminiumfolier, medelst ett hogfrekvent och hogspent vexelfelt
IT1000748B (it) Procedimento per formare una metallizzazione fungente da strato di resistenza elettrica su un substrato
AU486258B2 (en) Method of manufacturing electrically conductive metal layers on substrates
CA903020A (en) Method for producing electrically conductive articles
AR200620A1 (es) Metodo para producir cobre metalico
IT1021124B (it) Procedimento per la produzione di composti chimici per l applicazio ne di strati sottili su strutture piane