IT1011156B - Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati - Google Patents
Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substratiInfo
- Publication number
- IT1011156B IT1011156B IT4968174A IT4968174A IT1011156B IT 1011156 B IT1011156 B IT 1011156B IT 4968174 A IT4968174 A IT 4968174A IT 4968174 A IT4968174 A IT 4968174A IT 1011156 B IT1011156 B IT 1011156B
- Authority
- IT
- Italy
- Prior art keywords
- substrates
- electrically conductive
- conductive metal
- metal layers
- manufacturing electrically
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Chemical Treatment Of Metals (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7304429A NL7304429A (de) | 1973-03-30 | 1973-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1011156B true IT1011156B (it) | 1977-01-20 |
Family
ID=19818532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT4968174A IT1011156B (it) | 1973-03-30 | 1974-03-26 | Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS5631916B2 (de) |
AT (1) | AT326444B (de) |
BE (1) | BE812977A (de) |
CA (1) | CA1000415A (de) |
DE (1) | DE2412733C2 (de) |
ES (1) | ES424713A1 (de) |
FR (1) | FR2223477B1 (de) |
GB (1) | GB1457008A (de) |
HK (1) | HK39378A (de) |
IT (1) | IT1011156B (de) |
NL (1) | NL7304429A (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194911U (ja) * | 1982-06-21 | 1983-12-24 | 富士重工業株式会社 | リヤクオ−タ部窓ガラスの取付部構造 |
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
DE19957130A1 (de) | 1999-11-26 | 2001-05-31 | Infineon Technologies Ag | Metallisierungsverfahren für Dielektrika |
DE10361419A1 (de) * | 2003-12-22 | 2005-07-14 | Infineon Technologies Ag | Schichtenstruktur und ein Verfahren zur Herstellung einer Schichtenstruktur |
CN109680552B (zh) * | 2017-10-18 | 2021-11-05 | 江苏先诺新材料科技有限公司 | 聚酰亚胺/纳米纤维复合纸及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1621077A1 (de) * | 1967-03-31 | 1971-04-22 | Bayer Ag | Verfahren zur Abscheidung von Metallueberzuegen |
GB1229936A (de) * | 1968-09-20 | 1971-04-28 | ||
US3698940A (en) * | 1970-01-26 | 1972-10-17 | Macdermid Inc | Method of making additive printed circuit boards and product thereof |
-
1973
- 1973-03-30 NL NL7304429A patent/NL7304429A/xx unknown
-
1974
- 1974-03-16 DE DE19742412733 patent/DE2412733C2/de not_active Expired
- 1974-03-21 GB GB1258974A patent/GB1457008A/en not_active Expired
- 1974-03-26 IT IT4968174A patent/IT1011156B/it active
- 1974-03-27 AT AT254174A patent/AT326444B/de not_active IP Right Cessation
- 1974-03-27 JP JP3363974A patent/JPS5631916B2/ja not_active Expired
- 1974-03-27 CA CA196,165A patent/CA1000415A/en not_active Expired
- 1974-03-28 ES ES424713A patent/ES424713A1/es not_active Expired
- 1974-03-28 BE BE142575A patent/BE812977A/xx not_active IP Right Cessation
- 1974-03-28 FR FR7410785A patent/FR2223477B1/fr not_active Expired
-
1978
- 1978-07-13 HK HK39378A patent/HK39378A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
ES424713A1 (es) | 1976-06-01 |
AU6720474A (en) | 1975-10-02 |
DE2412733C2 (de) | 1982-12-02 |
HK39378A (en) | 1978-07-21 |
AT326444B (de) | 1975-12-10 |
FR2223477A1 (de) | 1974-10-25 |
DE2412733A1 (de) | 1974-10-10 |
FR2223477B1 (de) | 1978-07-28 |
GB1457008A (en) | 1976-12-01 |
JPS5631916B2 (de) | 1981-07-24 |
NL7304429A (de) | 1974-10-02 |
CA1000415A (en) | 1976-11-23 |
BE812977A (fr) | 1974-09-30 |
JPS49128833A (de) | 1974-12-10 |
ATA254174A (de) | 1975-02-15 |
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